CN208430224U - A kind of fixture of the potsherd magnetron sputtering plating for chip components and parts - Google Patents
A kind of fixture of the potsherd magnetron sputtering plating for chip components and parts Download PDFInfo
- Publication number
- CN208430224U CN208430224U CN201821019052.3U CN201821019052U CN208430224U CN 208430224 U CN208430224 U CN 208430224U CN 201821019052 U CN201821019052 U CN 201821019052U CN 208430224 U CN208430224 U CN 208430224U
- Authority
- CN
- China
- Prior art keywords
- potsherd
- fixture
- revolution
- turntable
- magnetron sputtering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
A kind of fixture of the potsherd magnetron sputtering plating for chip components and parts, including revolution turntable, several sample discs for being placed in revolution disk upper surface, connection revolution turntable and revolution turntable can be driven with its driving device with the rotation axis turned and for connecting and driving rotation axis to rotate, by positioning component relative positioning between sample disc and revolution turntable, sample disc upper surface forms the accommodation groove for placing potsherd to be coated.The utility model is placed directly on revolution turntable using sample disc as the station clamp for placing plated film potsherd, and by sample disc, using vertical sputtering mode, plated film potsherd is directly placed into sample disc, and it is not necessary that plated film potsherd is fixed, the uniformity of plating diaphragm can be improved, guarantee the integrality of plating diaphragm, it is provided with class indication in sample disc, Classification and Identification can be carried out after plated film, the production efficiency of plated film can be greatly improved, it is easy to operate, high reliablity, using flexible are applied widely.
Description
Technical field
The utility model relates to a kind of microwave ceramic materials to metallize magnetic control film coating fixture, especially one kind for chip member
The fixture of the potsherd magnetron sputtering plating of device.
Background technique
With the continuous development of microwave communication, more and more metallized film products are widely used, and phase therewith
The manufacture of the vacuum coating equipment and corresponding special fixture answered also becomes further important in the promotion of coating technique.Magnetic control splashes
Penetrating plated film is exactly one of coating technique being widely used, and principle is to accelerate to fly under the action of electric field using electronics
It being collided during substrate with sputter gas argon gas, ionizes out a large amount of argon ion and generate electronics, electronics flies to base film,
It is constantly collided in the process with ar atmo, generates more argon ions and electronics.Argon ion accelerates under the action of electric field
Metal targets are bombarded, diffraction goes out a large amount of target atom, and the target atom (or molecule) being in neutrality is deposited on the plating of substrate surface
Membrane technology.
The potsherd of chip components and parts, such as microwave single-layer chip capacitor, need in process of production to ceramic substrate into
Row is thin film metallized, needs to guarantee the integrality, uniformity and identity of potsherd plated film during thin film metallized.It passes
The magnetically controlled sputtering coating clamp of system generally can be divided into the several ways such as vertical, suspension type, and fix potsherd using approach screw,
And microwave single-layer chip capacity ceramic substrate thickness only has 0.15mm, traditional approach load is easy to cause damaged substrate, and is splashing
It penetrates in coating process and is difficult to ensure the integrality and uniformity of sputter coating, in subsequent cutting finished product, it may appear that chip list
Electrode incomplete phenomenon in face leads to the final failure welding of product, to weld failure occur.So for preparing microwave list
Layer chip capacitor metallized film, there are great defects for conventional brace.The potsherd of other chip components and parts, which metallizes, to be plated
Also there is the above problem in membrane process mostly.
Utility model content
The main purpose of the utility model is the shortcomings that overcoming the prior art, and providing one kind can be in magnetron sputtering membrane process
In, guarantee integrality, the uniformity of plated film potsherd, greatly improve the production efficiency of plated film, easy to operate, using flexible is fitted
With the fixture of the wide potsherd magnetron sputtering plating for chip components and parts of range.
The utility model adopts the following technical solution:
A kind of fixture of the potsherd magnetron sputtering plating for chip components and parts includes revolution turntable, is placed in public affairs
Turn several sample discs of disk upper surface, connect revolution turntable and can drive revolution turntable with it with the rotation axis turned and for connecting
The driving device for connecing and rotation axis being driven to rotate passes through positioning component relative positioning, sample between the sample disc and revolution turntable
Product disk upper surface forms the accommodation groove for placing potsherd to be coated.
Further, the revolution turntable is detachably sheathed in rotation axis, and is fixed in rotation axis for fixed public
It walks around the fixation bottom plate of disk, revolution turntable is fixedly connected by fastener with fixation bottom plate.
Further, the revolution center of turntable offers the through-hole for wearing rotation axis, through-hole by circular through hole and
It extends radially outward the limited bayonet formed by circular through hole to constitute, the rotation axis, which protrudes above, to be provided with and revolution turntable
The positioning strip that limited bayonet matches, revolution turntable are sheathed in rotation axis and by the cooperation of limited bayonet and positioning strip
Realize horizontal direction positioning.
Further, the revolution turntable is corresponding on fixed bottom plate offers positioning spiro pit, revolve turntable and fixation
Bottom plate is fixedly connected by the bolt and nut component being arranged in positioning spiro pit.
Further, the positioning component includes the positioning protrusion being set on revolution turntable and is set to sample pan bottom
The locating slot matched with positioning protrusion.
Further, several sample discs are arranged circumferentially along revolution turntable.
Further, the accommodation groove of the sample disc upper surface is circular groove.
Further, class indication is provided in the sample disc.
Further, the class indication is surface covering or dent with different markup shapes.
Further, the driving device is the motor for connecting and driving rotation axis to rotate.
From the above description of the utility model, it can be seen, compared with prior art, the utility model has following beneficial to effect
Fruit:
First, the station clamp using sample disc as placement plated film potsherd, and sample disc is placed directly in revolution
On turntable, using vertical sputtering mode, plated film potsherd is directly placed into sample disc, it is not necessary that plated film potsherd is fixed,
Plating diaphragm that will not be thin to thickness, frangible generates damage, simplifies operation, and the uniformity of plating diaphragm can be improved, and guarantees plating
The integrality of diaphragm, meanwhile, fixture installation is simple, and it is easy to operate, it can reuse for a long time;
Second, sample disc is set on revolution turntable by positioning component, and sample disc upper surface forms accommodation groove, can protect
Sample disc even running is demonstrate,proved, prevents plated film potsherd from skidding off in revolution, increases the reliability of fixture;
Third disposably can carry out gold by the microwave ceramics piece to multiple types by the way that class indication is arranged in sample disc
Categoryization plated film, after plated film potsherd can Classification and Identification, production efficiency can be improved, solve that potsherd is many kinds of, nothing after plated film
The problem of differentiation from the appearance of method simplicity;
4th, it is applicable not only to the potsherd plated film of chip components and parts, for all vertical sputtering modes, can be used
The fixture of the utility model, it is applied widely;
In short, compared with the magnetic control film coating fixture of the prior art, the utility model can during magnetron sputtering plating,
Guarantee integrality, uniformity and the identity of plated film potsherd, while also substantially increasing the production efficiency of plated film, and operates
Simplicity disposably can carry out plating filmed metals by the microwave ceramics piece to multiple types, and station can also be adjusted according to demand,
Using flexible, it is applied widely.
Detailed description of the invention
Fig. 1 is the overall structure top view of specific embodiment of the present invention;
Fig. 2 is the overall structure bottom view of specific embodiment of the present invention;
Fig. 3 is the revolution turntable of specific embodiment of the present invention and the mounting structure cross-sectional view of fixed bottom plate;
Fig. 4 is the cross-sectional view of the sample disc of specific embodiment of the present invention;
Fig. 5 is the top view of the sample disc of specific embodiment of the present invention;
Fig. 6 is that the revolution turntable of specific embodiment of the present invention and sample disc cooperate location structure cross-sectional view.
In figure: 1. revolution turntables, 2. sample discs, 20. accommodation grooves, 21. locating slots, 3. rotation axis, 30. positioning strips, 4.
Through-hole, 40. circular through holes, 41. limited bayonets, 5. fixed bottom plates, 6. positioning spiro pits, 7. positioning protrusion, 8. class indications.
Specific embodiment
Below by way of specific embodiment, the utility model will be further described.
Referring to figs. 1 to Fig. 6, a kind of folder of potsherd magnetron sputtering plating for chip components and parts of the utility model
Tool includes revolution turntable 1, is arranged circumferentially eight sample discs 2 in revolution 1 upper surface of turntable, connection along revolution turntable 1
Revolution turntable 1 and can drive revolution turntable 1 with its with turn rotation axis 3 and for connect and drive rotation axis 3 rotation motor,
By positioning component relative positioning between sample disc 2 and revolution turntable 1,2 upper surface of sample disc is formed for placing pottery to be coated
The accommodation groove 20 of tile, accommodation groove 20 are circular groove.
Rotation axis 3 is set to inside equipment cavity, and revolution 1 center of turntable offers the through-hole 5 for wearing rotation axis 3,
Through-hole 4 is by circular through hole 40 and extends radially outward the limited bayonet 41 formed by circular through hole 40 and constitutes, and rotation axis 3 is convex
It is provided with the positioning strip 30 matched with the limited bayonet 41 of revolution turntable 1 out, revolution turntable 1 is detachably sheathed on rotation axis
Horizontal direction positioning is realized on 3 and by the cooperation of limited bayonet 41 and positioning strip 30.3 lower end of rotation axis is connected with for fixing
The fixation bottom plate 5 of revolution turntable 1, revolution turntable 1 is corresponding on fixed bottom plate 5 to offer positioning spiro pit 6,1 He of turntable of revolving
Fixed bottom plate 5 is fixedly connected by the bolt and nut component being arranged in positioning spiro pit 6.
Positioning component includes the positioning protrusion 7 being set on revolution turntable 1 and is set to 2 bottom of sample disc and positioning protrusion
7 locating slots 21 matched, 2 bottom of sample disc protrusion are formed with step cutting pattern, and step cutting pattern and sample disc are formed between 2 bottom
Above-mentioned locating slot 21.
Class indication 8 is respectively arranged in sample disc 2, class indication 8 is to pass through with the dent of different markup shapes
Laser marking mode is beaten respectively on each sample disk 2, the class indication 8 of digital 1 to 8 shapes is respectively formed, after to plated film
Potsherd simply distinguished.
Referring to figs. 1 to Fig. 6, when the utility model is used for microwave single-layer capacitor magnetron sputtering plating, will first revolve turntable 1
It is sheathed in rotation axis 3, and passes through bolt and nut component and be fixedly connected with revolution turntable 1 with fixed bottom plate 5;Then by microwave list
Layer capacitor potsherd is directly lain in corresponding sample disc 2, and the potsherd of differing dielectric constant is put into different digital classification
It identifies in 8 corresponding sample discs 2, then sample disc 2 is put on revolution turntable 1, and is positioned by positioning component;Finally, passing through
Motor driven rotation axis 3 rotates, and entire revolution turntable 1 is driven to rotate, to make 2 turns of sample disc be placed on revolution turntable 1
It is dynamic, guarantee the uniformity and integrality of the potsherd plated film to be coated in sample disc 2.
The fixture of the utility model is applicable not only to the potsherd plated film of the chip components and parts such as microwave single-layer capacitor, for
All vertical sputtering modes, can be used the fixture of the utility model.
It above are only a specific embodiment of the utility model, but the design concept of the utility model is not limited to
This, all non-essential modifications to the present invention made by this concept should belong to infringement scope of protection of the utility model
Behavior.
Claims (10)
1. a kind of fixture of the potsherd magnetron sputtering plating for chip components and parts, it is characterised in that: include revolution turntable,
Several sample discs of revolution disk upper surface are placed in, revolution turntable is connected and can drive revolution turntable with it with the rotation axis turned
And the driving device for connecting and driving rotation axis to rotate, it is opposite by positioning component between the sample disc and revolution turntable
Positioning, sample disc upper surface forms the accommodation groove for placing potsherd to be coated.
2. a kind of fixture of the potsherd magnetron sputtering plating for chip components and parts as described in claim 1, feature exist
In: the revolution turntable is detachably sheathed in rotation axis, and the fixation bottom for fixed revolution turntable is fixed in rotation axis
Plate, revolution turntable are fixedly connected by fastener with fixed bottom plate.
3. a kind of fixture of the potsherd magnetron sputtering plating for chip components and parts as claimed in claim 2, feature exist
In: the revolution center of turntable offers the through-hole for wearing rotation axis, and through-hole is by circular through hole and by circular through hole along diameter
It is constituted to the limited bayonet extended outward to form, the rotation axis is protruded above to be provided with and be matched with the limited bayonet of revolution turntable
Positioning strip, revolution turntable is sheathed in rotation axis and by limited bayonet and positions the cooperation of strip and realize that horizontal direction is fixed
Position.
4. a kind of fixture of the potsherd magnetron sputtering plating for chip components and parts as claimed in claim 2, feature exist
In: the revolution turntable is corresponding on fixed bottom plate to offer positioning spiro pit, and revolution turntable and fixed bottom plate are by being arranged in
Bolt and nut component in positioning spiro pit is fixedly connected.
5. a kind of fixture of the potsherd magnetron sputtering plating for chip components and parts as described in claim 1, feature exist
In: the positioning component includes being set to the positioning protrusion to revolve on turntable and being set to sample pan bottom to match with positioning protrusion
The locating slot of conjunction.
6. a kind of fixture of the potsherd magnetron sputtering plating for chip components and parts as described in claim 1, feature exist
In: several sample discs are arranged circumferentially along revolution turntable.
7. a kind of fixture of the potsherd magnetron sputtering plating for chip components and parts as described in claim 1, feature exist
In: the accommodation groove of the sample disc upper surface is circular groove.
8. a kind of fixture of the potsherd magnetron sputtering plating for chip components and parts as described in claim 1, feature exist
In: class indication is provided in the sample disc.
9. a kind of fixture of the potsherd magnetron sputtering plating for chip components and parts as claimed in claim 8, feature exist
In: the class indication is surface covering or dent with different markup shapes.
10. a kind of fixture of potsherd magnetron sputtering plating for chip components and parts as described in any one of claim 1 to 9,
It is characterized by: the driving device is the motor for connecting and driving rotation axis to rotate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821019052.3U CN208430224U (en) | 2018-06-29 | 2018-06-29 | A kind of fixture of the potsherd magnetron sputtering plating for chip components and parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821019052.3U CN208430224U (en) | 2018-06-29 | 2018-06-29 | A kind of fixture of the potsherd magnetron sputtering plating for chip components and parts |
Publications (1)
Publication Number | Publication Date |
---|---|
CN208430224U true CN208430224U (en) | 2019-01-25 |
Family
ID=65099384
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201821019052.3U Active CN208430224U (en) | 2018-06-29 | 2018-06-29 | A kind of fixture of the potsherd magnetron sputtering plating for chip components and parts |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN208430224U (en) |
-
2018
- 2018-06-29 CN CN201821019052.3U patent/CN208430224U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4259166A (en) | Shield for plating substrate | |
US4622121A (en) | Apparatus for coating materials by cathode sputtering | |
CN105887036B (en) | A kind of workpiece fixture | |
JPS63259078A (en) | Magnetron sputtering cathode for vacuum coating apparatus | |
CN105543792A (en) | Magnetron sputtering device and magnetron sputtering method | |
TW345684B (en) | Sputtering apparatus | |
JPS59154093A (en) | Method of forming adhesive metal layer on synthetic materialboard | |
CA2232638A1 (en) | Cationic electrodeposition process and coating composition for cationic electrodeposition | |
JPS59208069A (en) | Evaporation device having radiation heat portion for evaporating many substances | |
CN208430224U (en) | A kind of fixture of the potsherd magnetron sputtering plating for chip components and parts | |
EP3943638A1 (en) | Method for metallizing plastic by pre-plating for electroplating | |
US4741077A (en) | End terminations for capacitors | |
CN106435499B (en) | A kind of magnetron sputtering coater | |
CN101082123A (en) | Sputtering device and method | |
CN209533113U (en) | A kind of rotary target substrate sand blasting unit | |
CN116695074A (en) | Processing method of ball cover conducting ring | |
CN206907741U (en) | Magnetron sputtering chamber and semiconductor processing equipment for silicon hole filling | |
CN205839122U (en) | A kind of vacuum coating equipment | |
CN213295499U (en) | Tool and die ion plating clamp capable of reducing pollution of residual plating fragments | |
CN107761059A (en) | Silver alloy coating on surface of electrical alloy part, preparation method of silver alloy coating and electrical alloy part | |
CN216155953U (en) | Fixing mechanism of vertical plate coating machine | |
JPS60211065A (en) | Manufacture of foil | |
CN213172553U (en) | Transmission system of vacuum coating machine | |
CN206232806U (en) | A kind of roller pin hanger | |
CN208038537U (en) | A kind of comprehensive vacuum coater |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210716 Address after: 510000 No. 6, Changli Road, Dongyong Town, Nansha District, Guangzhou City, Guangdong Province Patentee after: Guangzhou Tianji Electronic Technology Co.,Ltd. Address before: 362000 No.58, Taixin street, Changtai street, Licheng District, Quanzhou City, Fujian Province Patentee before: FUJIAN MMELEC ELECTRONICS Co.,Ltd. |
|
TR01 | Transfer of patent right |