JPS60256039A - Preparation of ultrasonic probe - Google Patents
Preparation of ultrasonic probeInfo
- Publication number
- JPS60256039A JPS60256039A JP11339384A JP11339384A JPS60256039A JP S60256039 A JPS60256039 A JP S60256039A JP 11339384 A JP11339384 A JP 11339384A JP 11339384 A JP11339384 A JP 11339384A JP S60256039 A JPS60256039 A JP S60256039A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric
- piezoelectric vibrator
- grooves
- heat
- ultrasonic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は非破壊検査用の探傷器や超音波診断袋るもので
ある。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a flaw detector and an ultrasonic diagnostic bag for non-destructive testing.
従来例の構成とその問題点
従来の超音波探触子の基本的な構造を示した第1図にお
いて、(1)は圧電振動子、(2)は超音波吸収体、(
3)は切削加工溝、(4)は音響マツチング層である。Structure of the conventional example and its problems In Fig. 1, which shows the basic structure of a conventional ultrasonic probe, (1) is a piezoelectric vibrator, (2) is an ultrasonic absorber, and (2) is an ultrasonic absorber.
3) is a cut groove, and (4) is an acoustic matching layer.
この場合、圧電振動子(1)の上面は音響マツチング層
(4)の上面と平行ではなく、圧電振動子(1)の向き
配列位置が乱れている。In this case, the top surface of the piezoelectric vibrator (1) is not parallel to the top surface of the acoustic matching layer (4), and the orientation and arrangement position of the piezoelectric vibrator (1) is disordered.
次に、第2図および第3図を用いて、従来の超音波探触
子の製造方法を説明する。第2図に示すように、圧電振
動板(5)を超音波吸収体(2)の上に接着した後、ス
クライバ−、ワイヤーソー等で圧電振動板(5)を超音
波吸収体(2)とともしこ第3図のように切削加工(溝
(3)の形成)を行なう。超音波吸収体(2)は圧電振
動板(5)の切削加工により分割された圧電振動子(1
)のダンピングを行なうとともに、圧電振動子(1)に
より発生した下方向に伝播する超音波を吸収し、圧電振
動子(1)に超音波吸収体(2)の下面からの反射波が
入射することを肪1トするもので、一般に防振ゴム、コ
ルク等の外力に対して極めて変形し易いもので構成され
ている。また、圧電振動板(5)の切削加工時に超音波
吸収体(2)も同1時に切断されるために切削加工時お
よび音響マツチング層(4)を加圧接着により固着する
時に、超音波吸収体(2)が変形し、圧電振動子(1)
の配列が乱れ易いに
のように圧電振動子(1)の配列が乱れると。Next, a conventional method of manufacturing an ultrasonic probe will be explained using FIGS. 2 and 3. As shown in Figure 2, after bonding the piezoelectric diaphragm (5) onto the ultrasonic absorber (2), use a scriber, wire saw, etc. to attach the piezoelectric diaphragm (5) to the ultrasonic absorber (2). Totomoshi: Cutting (forming grooves (3)) is performed as shown in Figure 3. The ultrasonic absorber (2) has a piezoelectric vibrator (1) divided by cutting a piezoelectric diaphragm (5).
) and absorbs the downwardly propagating ultrasonic waves generated by the piezoelectric vibrator (1), and the reflected waves from the bottom surface of the ultrasonic absorber (2) enter the piezoelectric vibrator (1). It is generally made of anti-vibration rubber, cork, or other materials that are extremely easily deformed by external forces. In addition, since the ultrasonic absorber (2) is also cut at the same time when the piezoelectric diaphragm (5) is cut, the ultrasonic absorber (2) is The body (2) deforms and the piezoelectric vibrator (1)
When the arrangement of the piezoelectric vibrators (1) is disturbed, as in the case of a crab, the arrangement of the piezoelectric vibrators (1) is easily disturbed.
圧電振動子(1)から発生される超音波ビームは、配列
ピッチおよび向きが一様でなくなり、均一に発生するこ
とができず、音響マツチング層(4)の上面に被検体を
置いて、被検体内部に超音波を入射させ、被検体からの
反射超音波を受波する時に、正確な情報を得ることが不
可能となる。The ultrasonic beams generated from the piezoelectric vibrator (1) are not uniform in array pitch and direction, and cannot be generated uniformly. It becomes impossible to obtain accurate information when injecting ultrasound waves into the interior of a specimen and receiving reflected ultrasound waves from the specimen.
発明の目的
本発明は、上記問題を解消するもので、圧電振動子の配
列の乱れのない超音波探触子の製造方法を提供すること
を目的とする。OBJECTS OF THE INVENTION The present invention solves the above-mentioned problems, and aims to provide a method for manufacturing an ultrasonic probe in which the arrangement of piezoelectric vibrators is not disturbed.
発明の構成
本発明は、上記目的を達成するために、圧電振動板と剛
性の高いダミー板とを熱溶融性ワックスで接着した後、
圧電振動板に溝を切削加工することによりダミー板上に
この溝により間隔をあけられた圧電振動子を多数配列さ
せ、このダミー板と一体になった圧電振動子を接着剤に
より超音波吸収体に加圧接着した後、熱溶融性ワックス
を軟化させることによりダミー板を圧電振動子から取り
はずし、次に圧電振動子間の溝に樹脂を充填した後、熱
溶融性ワックスを除去し、圧電振動子上に音響マツチン
グ層を接着固定することによりなる超音波探触子の製造
方法を提供する。Structure of the Invention In order to achieve the above object, the present invention provides the following steps: After bonding a piezoelectric diaphragm and a highly rigid dummy plate with hot-melt wax,
By cutting grooves in the piezoelectric diaphragm, a large number of piezoelectric vibrators spaced apart by the grooves are arranged on a dummy plate, and the piezoelectric vibrators integrated with the dummy plate are attached to an ultrasonic absorber using adhesive. The dummy plate is removed from the piezoelectric vibrator by softening the hot-melt wax, and then the groove between the piezoelectric vibrators is filled with resin, the hot-melt wax is removed, and the piezoelectric vibrator is removed. The present invention provides a method for manufacturing an ultrasonic probe by adhesively fixing an acoustic matching layer on the probe.
実施例の説明
以下、本発明の一実施例を第4図ないし第8図を用いて
説明する。なお、これらの図において第1図ないし第3
図に示したものと同一の部材には同一の参照番号を付し
である。DESCRIPTION OF THE EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 4 to 8. In addition, in these figures, figures 1 to 3
Components that are the same as those shown in the figures are provided with the same reference numerals.
まず、第1の段階においては、第4図に示すように、圧
電振動板(5)と剛性の高いダミー板(6)とを、両者
間に介在させた熱溶融性ワックス(7)を加熱溶解した
上で冷却硬化させることにより接着させる。次いで、第
5図に示すように、ダミー板(6)と一体になった圧電
振動板(5)にスクライバ−やワイヤーソー等で溝(3
)を切削加工した後、溝(3)により隔てられた(分割
された)圧電振動子(1)を超音波吸収体(2)の上に
接着剤を用いて、第6図に示すように接着固定する。こ
の接着固定は。First, in the first step, as shown in Fig. 4, a piezoelectric diaphragm (5) and a highly rigid dummy plate (6) are interposed between the heat-melting wax (7) and heated. It is bonded by melting and cooling and hardening. Next, as shown in Fig. 5, grooves (3
), the piezoelectric vibrator (1) separated (divided) by the groove (3) is placed on the ultrasonic absorber (2) using adhesive, as shown in Figure 6. Fix with adhesive. This adhesive fixes.
その際の加圧力により圧電振動子(1)の位置ずれが生
じないように、熱溶融性ワックス(7)が軟化しない温
度範囲で行なわなければならない。次に、加熱により熱
溶融性ワックス(7)を軟化させてダミー板(6)を圧
電振動子(1)から取り外した後、第7図に示すように
、圧電振動子(1)の表面に熱溶融性ワックス(7)が
付着した状態で、切削加工溝(3)に樹脂(8)を浸透
充填させる。樹脂(8)を熱溶融性フラックス(7)が
溶融しない温度範囲で硬化させて圧電振動子(1)の固
定強化を行なった後、圧電振動子(1)に付着および切
削加工溝(3)に一部侵入した熱溶融性ワックス(7)
を溶剤等で清浄除去する。最後に、圧電振動子(1)の
上に音響マツチング層(4)を、第8図に示すように、
加圧接着する。なお、第8図において、(9)は熱溶融
性フラックス(7)が除去された部分に入りこんだ接着
剤である。In order to prevent displacement of the piezoelectric vibrator (1) due to the pressure applied at that time, the heating must be carried out within a temperature range in which the hot-melt wax (7) does not soften. Next, after softening the hot melt wax (7) by heating and removing the dummy plate (6) from the piezoelectric vibrator (1), as shown in FIG. With the heat-melting wax (7) attached, the resin (8) is infiltrated and filled into the cut groove (3). After hardening the resin (8) in a temperature range in which the thermofusible flux (7) does not melt to strengthen the fixation of the piezoelectric vibrator (1), it is attached to the piezoelectric vibrator (1) and a groove (3) is cut. Heat-melting wax partially penetrated into the (7)
Clean and remove with a solvent, etc. Finally, an acoustic matching layer (4) is placed on the piezoelectric vibrator (1) as shown in FIG.
Adhere under pressure. In FIG. 8, (9) is adhesive that has entered the area where the hot-melt flux (7) has been removed.
以上の製造方法によると、圧電振動子(1)が切削加工
される時は剛性の高いダミー板(6)に固定されている
ことにより配列乱れは発生せず、所要の配列精度の状態
で圧電振動子(1)を超音波吸収体(2)上に接着固定
でき、更に圧電振動子(1)の表面に音響マツチング層
(4)を加圧接着する時には、超音波吸収体(2)に切
削加工溝がないことと、圧電振動子(1)の少なくとも
下部が切削加工溝(3)に充填された樹脂(8)により
固定強化されていることにより圧電振動子(1)の配列
乱れが生じることを防止することができ、極めて配列精
度の優れた超音波探触子が得られる。According to the above manufacturing method, when the piezoelectric vibrator (1) is cut, the piezoelectric vibrator (1) is fixed to the highly rigid dummy plate (6), so no alignment disorder occurs, and the piezoelectric vibrator (1) is cut with the required alignment accuracy. The vibrator (1) can be adhesively fixed onto the ultrasonic absorber (2), and when the acoustic matching layer (4) is pressure-adhered to the surface of the piezoelectric vibrator (1), the ultrasonic absorber (2) can be adhesively fixed. Because there is no cutting groove and at least the lower part of the piezoelectric vibrator (1) is fixed and reinforced by the resin (8) filled in the cutting groove (3), the arrangement of the piezoelectric vibrator (1) is prevented. This can be prevented, and an ultrasonic probe with extremely excellent alignment accuracy can be obtained.
発明の詳細
な説明したように、本発明の超音波探触子の製造方法に
よれば、溝の切削加工時に圧電振動板に接着されるダミ
ー板と音響マツチング層の加圧接着の際に圧電振動子を
固定強化する樹脂との組合せにより、極めて微小な圧電
振動子を高精度に配列してなる超音波探触子を製造でき
る優れた効化を有する。As described in detail, according to the method of manufacturing an ultrasonic probe of the present invention, the piezoelectric probe is bonded to the dummy plate bonded to the piezoelectric diaphragm during the groove cutting process and the acoustic matching layer is bonded under pressure. In combination with a resin that fixes and strengthens the vibrator, it has an excellent effect in manufacturing an ultrasonic probe in which extremely small piezoelectric vibrators are arranged with high precision.
□□4よ、、)□波探触−PIオ□お4第 第1図2図
および第3図は同探触子の製造過程を示す断面図、第4
図ないし第8図は本発明の一実施例にかかる超音波探触
子の製造方法を示す断面図である。
(1)・・圧電振動子、(2)・・超音波吸収体、(3
)・・・(8)・・・樹脂、(9)・・・接着剤代理人
森 本 義 弘
第3図□□4,,)□Wave probe - PI O□O 4 Fig. 1 Fig. 2 and Fig.
8 through 8 are cross-sectional views showing a method of manufacturing an ultrasonic probe according to an embodiment of the present invention. (1) Piezoelectric vibrator, (2) Ultrasonic absorber, (3
)...(8)...Resin, (9)...Adhesive agent Yoshihiro MorimotoFigure 3
Claims (1)
クスで接着した後、圧電振動板に溝を切削加工すること
によりダミー板上にこの溝により間隔をあけられた圧電
振動子を多数配列させ、このダミー板と一体になった圧
電振動子を接着剤により超音波吸収体に加圧接着した後
、熱溶融性ワックスを軟化させることによりダミー板を
圧電振動子から取りはずし、次に圧電振動子間の溝に樹
脂を充填した後、熱溶融性ワックスを除去し、圧電振動
子上に音響マツチング層を接着固定することによりなる
超音波探触子の製造方法。1. After bonding the piezoelectric diaphragm and a highly rigid dummy plate with hot-melt wax, grooves are cut into the piezoelectric diaphragm to create a large number of piezoelectric vibrators spaced apart by the grooves on the dummy plate. After the piezoelectric vibrators integrated with the dummy plates are pressure-bonded to the ultrasonic absorber using an adhesive, the dummy plates are removed from the piezoelectric vibrators by softening the hot melt wax, and then the piezoelectric vibrators are A method of manufacturing an ultrasonic probe by filling the groove between the transducers with resin, removing the heat-melting wax, and adhesively fixing an acoustic matching layer on the piezoelectric transducer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11339384A JPS60256039A (en) | 1984-06-01 | 1984-06-01 | Preparation of ultrasonic probe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11339384A JPS60256039A (en) | 1984-06-01 | 1984-06-01 | Preparation of ultrasonic probe |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60256039A true JPS60256039A (en) | 1985-12-17 |
Family
ID=14611167
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11339384A Pending JPS60256039A (en) | 1984-06-01 | 1984-06-01 | Preparation of ultrasonic probe |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60256039A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63146697A (en) * | 1986-12-10 | 1988-06-18 | Yokogawa Medical Syst Ltd | Manufacture of two-dimension array transducer |
US7714482B2 (en) | 2007-09-28 | 2010-05-11 | Denso Corporation | Ultrasonic sensor |
US8528174B2 (en) * | 2009-07-29 | 2013-09-10 | Imacor Inc. | Method of manufacturing an ultrasound imaging transducer acoustic stack with integral electrical connections |
-
1984
- 1984-06-01 JP JP11339384A patent/JPS60256039A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63146697A (en) * | 1986-12-10 | 1988-06-18 | Yokogawa Medical Syst Ltd | Manufacture of two-dimension array transducer |
US7714482B2 (en) | 2007-09-28 | 2010-05-11 | Denso Corporation | Ultrasonic sensor |
US8528174B2 (en) * | 2009-07-29 | 2013-09-10 | Imacor Inc. | Method of manufacturing an ultrasound imaging transducer acoustic stack with integral electrical connections |
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