JPS63146697A - Manufacture of two-dimension array transducer - Google Patents
Manufacture of two-dimension array transducerInfo
- Publication number
- JPS63146697A JPS63146697A JP61293896A JP29389686A JPS63146697A JP S63146697 A JPS63146697 A JP S63146697A JP 61293896 A JP61293896 A JP 61293896A JP 29389686 A JP29389686 A JP 29389686A JP S63146697 A JPS63146697 A JP S63146697A
- Authority
- JP
- Japan
- Prior art keywords
- pedestal
- elements
- prismatic
- front plate
- backing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000004020 conductor Substances 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 13
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 238000005304 joining Methods 0.000 claims 1
- 230000008878 coupling Effects 0.000 abstract description 4
- 238000010168 coupling process Methods 0.000 abstract description 4
- 238000005859 coupling reaction Methods 0.000 abstract description 4
- 238000012856 packing Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000010408 film Substances 0.000 description 5
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- OQCFWECOQNPQCG-UHFFFAOYSA-N 1,3,4,8-tetrahydropyrimido[4,5-c]oxazin-7-one Chemical compound C1CONC2=C1C=NC(=O)N2 OQCFWECOQNPQCG-UHFFFAOYSA-N 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 235000011888 snacks Nutrition 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Transducers For Ultrasonic Waves (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は角柱状エレメントが碁盤目状に配列される２次
元アレイトランスデユーサのＦＪ ＪＺｈ法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to the FJJZh method of a two-dimensional array transducer in which prismatic elements are arranged in a grid pattern.
（従来の技術）
従来から、角柱状エレメントが碁盤目状に配ｊ１される
２次元７レイトランスデユーサを製造する方法が種々知
られている。例えば、ＩＥ［［ＴＲＡＮＳ−ＡＣＴＩＯ
ＮＳ ＯＮ ５ＯＮＩＣ３ＡＮＤ ＩＩＬＴＲＡ
ｓＯＮＩｃｓ、ＶＯＬ、５Ｕ−１９゜ＮＯ，４，０ＣＴ
ＯＢ［Ｒ１９７２にその一例が開示されている。(Prior Art) Various methods have been known for manufacturing a two-dimensional seven-ray transducer in which prismatic elements are arranged in a grid pattern. For example, IE [[TRANS-ACTIO
NS ON 5ONIC3AND IILTRA
sONIcs, VOL, 5U-19°NO, 4,0CT
An example is disclosed in OB[R1972.
上記開示によれば、２次元アレイトランスデユーサは第
６図（ａ）乃至（Ｃ）に丞す工程で作られる。According to the above disclosure, the two-dimensional array transducer is manufactured through the steps shown in FIGS. 6(a) to 6(C).
叩ら、
（１）薄いＩＩ電根１の一方の面を（（盤目状にダイシ
ングする（切込みは１ｇさ方向の約９３％）。これによ
り■４！（け状（Ｊ配’／１１された角ｔ１状エレメン
ト２が構成される（第６図（ａ））。(1) Dice one side of the thin II power root 1 in the shape of a board (the cut is about 93% in the 1g direction). A corner t1-shaped element 2 is constructed (FIG. 6(a)).
（２）ダイシングしない側から角柱状エレメント２の」
−ブにｄ通穴３を設ける（第６図（ｂ））。(2) From the non-dicing side of the prismatic element 2.
- Provide a d through hole 3 in the tube (Fig. 6(b)).
（３）バッキング材４（圧電板１に対向する面が導体膜
で被覆されている）に支持される絶縁被覆されたｎＩ！
１１５をｔ′１通穴３に挿通し、バッキング材４を圧電
板３に接合して一体化する（第６図（Ｃ））。(3) An insulating coated nI supported by the backing material 4 (the surface facing the piezoelectric plate 1 is coated with a conductive film)!
115 is inserted into the t'1 through hole 3, and the backing material 4 is joined to the piezoelectric plate 3 to be integrated (FIG. 6(C)).
（４）角柱状エレメント２側に導かれた導線５を各エレ
メント２の頭に半田付けする（第６図（ｄ）及び（ｅ）
。（ｄ）図ではＩＯＸ １０個の角柱状エレメントが半
田付けされており、（８１図はその半田付は部の拡大図
である）。半田付けされるエレメントの頭が個別電極と
なり、ダイシングされない１ｆ電体１の面に接合される
導体膜が共通電極となる。(4) Solder the conductive wire 5 led to the prismatic element 2 side to the head of each element 2 (Fig. 6 (d) and (e))
. In the figure (d), ten prismatic elements of IOX are soldered (Figure 81 is an enlarged view of the soldered part). The heads of the elements to be soldered serve as individual electrodes, and the conductor film bonded to the surface of the 1f electric body 1 that is not diced serves as a common electrode.
ところで、Ｆ記の方法による２次元アレイトランスデユ
ーりにＪ３いて、各エレメントは完全に切離されていな
いので、各エレメント間に畠費的結合が存在する。この
ような結合があると音響特性が低下りる。従って、８響
特性上から言えば２次元アレイトランスデユーサの各エ
レメントは完全に切離されていた方が望ましい。By the way, in the two-dimensional array transducer J3 using the method described in F, since each element is not completely separated, there is a connection between the elements. Such coupling degrades acoustic properties. Therefore, from the viewpoint of eight-tone characteristics, it is desirable that each element of the two-dimensional array transducer be completely separated.
（発明が解決しようとする問題点）
しかし、従来の製造方法にあっては、圧電板を完全にダ
イシング、叩ら上記工程（１）における切込みを１００
χにすると、各エレメントがばらばらになるため、共通
電極の引出し線の接続処理が難しくなる（アース電極の
引出し方が難しくなる）。(Problem to be Solved by the Invention) However, in the conventional manufacturing method, the piezoelectric plate is completely diced and hammered, and the cut in the above step (1) is reduced to 100 mm.
If it is set to χ, each element will be separated, making it difficult to connect the lead wire of the common electrode (making it difficult to lead out the ground electrode).
又、従来の製造方法における個別電極の引出し方法は、
各電極位置に対応させて圧電板に設ける貫通穴に引出し
線を挿通させるようになっているため、その作業は非常
に煩わしいという問題がある。In addition, the method of drawing out individual electrodes in the conventional manufacturing method is as follows:
Since the lead wires are inserted through through holes provided in the piezoelectric plate in correspondence with the positions of the respective electrodes, there is a problem in that the work is very troublesome.
即ち、従来の製造方法は、８８＋特性の改杏が難しい上
に、４産に適していないと言える。That is, it can be said that the conventional manufacturing method is difficult to modify the 88+ characteristics and is not suitable for 4-product production.
本発明は、かかる点に鑑みてなされたものであり、その
目的は、ｇＷ的結合が小さい２次元アレイトランスミ’
：Ｉ−サを出産し得る製造方法を実現するにある。The present invention has been made in view of this point, and its purpose is to provide a two-dimensional array transmitter with small gW coupling.
: To realize a manufacturing method that can produce I-sa.
〈問題点を解決でるだめの１段）
上記目的を達成する本発明の２次元アレイトランスデユ
ーりの第１の製造方法は、圧電板を台座の上に仮接着し
、非接着側から圧電板を碁盤目状に完全にダイシングし
て多数の角柱状エレメントを作り、接合面を導体化した
バッキング材を角柱状エレメントの非台座側に接着し、
台Ｐトを角手１状ニレメン］−から除去した後、角柱状
エレメントの台頭にイ１°１シＪ用導線を接続し、角１
１状エレメント間で形成される溝に設置して外部に引出
すと共に、バッキングＨの導体化面にグラウンド用引出
し線を接続するようになっている。(The first step to solving the problem) The first manufacturing method of the two-dimensional array transducer of the present invention that achieves the above object is to temporarily bond a piezoelectric plate onto a pedestal, and then insert the piezoelectric plate from the non-bonded side. A large number of prismatic elements are created by completely dicing the board in a checkerboard pattern, and a backing material with conductive joint surfaces is glued to the non-pedestal side of the prismatic elements.
After removing the base P from the corner 1-shaped element, connect the conductor wire for the corner 1
It is installed in the groove formed between the single elements and drawn out to the outside, and a grounding lead wire is connected to the conductive surface of the backing H.
又、本発明の２次元アレイトランスデユーサの第２の製
造方法は、Ｆ記の台座の１にｌ盤目状の角柱状Ｊ、エレ
メント作る工程復、接合面を導体化した正面板を角柱状
エレメントの非台座側に接着する工程と、この状態で台
座を角柱状エレメントから除去する工程と、正面板にバ
ッキング材を接合一体化する工程を備え、以後上記の引
出し線を接続するＪ−程に入るようになっている。In addition, the second manufacturing method of the two-dimensional array transducer of the present invention is to repeat the step of making the L-shaped prismatic J on the pedestal F, and then attach the front plate whose joint surface is conductive to the rectangular shape. The J- It's starting to get better.
（実施例） 以下、本発明について図面を参照して詳細に説明する。(Example) Hereinafter, the present invention will be explained in detail with reference to the drawings.
第１図は本発明の一実施例による製造方法の］ニ稈の説
明図である。以下、（ａ）図から（Ｃ）図に至る−［程
を説明する。FIG. 1 is an explanatory diagram of two culms in a manufacturing method according to an embodiment of the present invention. The process from Figure (a) to Figure (C) will be explained below.
（１） ＰＩＴ等の圧゛重板１１を台座１２上にホット
メルト等で仮接着する（第１図（ａ））。圧電板１１の
両面は極めて薄い膜で被覆されている（図丞せず）。台
座１２は溶剤で溶解する物体、又【ま、所定の温度で融
解若しくは分解する物体、例えばエボプイトのようなで
）や柔らかみのある物体で構成される。(1) A pressure plate 11 such as PIT is temporarily bonded onto the pedestal 12 using hot melt or the like (FIG. 1(a)). Both sides of the piezoelectric plate 11 are coated with extremely thin films (not shown). The pedestal 12 is made of an object that dissolves in a solvent, an object that melts or decomposes at a predetermined temperature, such as evoput, or a soft object.
（２）圧電板１１を非接着側から公知のカッタでｌ盤目
状に完全にダイシングす・る。これにより、台座１２上
に多数の角柱状エレメント１３が作られる（第１図（ｂ
））。(2) Completely dice the piezoelectric plate 11 from the non-adhesive side using a known cutter into l-cut shapes. As a result, a large number of prismatic elements 13 are created on the pedestal 12 (Fig. 1(b)
)).
（３）導電性接着剤を用いて、角柱状エレメント１３の
非台座側（エレメントの頭）を正面板１４上に）き看す
る（第１図（Ｃ））。正面板１４の本体はガラス、プラ
スナック等で構成され、接合面は薄い導電性膜でｗ１着
されている（接合面が導体化されている）。(3) Using a conductive adhesive, glue the non-pedestal side (head of the element) of the prismatic element 13 onto the front plate 14 (FIG. 1(C)). The main body of the front plate 14 is made of glass, plastic snacks, etc., and the joint surface is coated with a thin conductive film (the joint surface is made conductive).
（４）台座１２の融Ｍ温麿の下で台座１２を溶解して角
柱状エレメントから除去する（第１図（ｄ））。(4) The pedestal 12 is melted under the melting temperature of the pedestal 12 and removed from the prismatic element (FIG. 1(d)).
（５）正面板１４を角柱状エレメント１３の集合体の形
（圧電板１１の形）に合せて切る。(5) Cut the front plate 14 to match the shape of the assembly of the prismatic elements 13 (the shape of the piezoelectric plate 11).
（６）正面板１４の非角柱状エレメント側にバッキング
材１５を接合し一体化する（第１図（ｅ））。(6) The backing material 15 is joined and integrated with the non-prismatic element side of the front plate 14 (FIG. 1(e)).
（７）角柱状Ｊ−レメント１３の非バッキング材側（エ
レメントの頭）夫々に信号用導線を接続し、束ねて隣合
う角柱状エレメント間で形成される溝に設置して外部に
引出す。引出された信号用導線をケーブルに接続する。(7) Signal conductors are connected to the non-backing material side (element head) of each of the prismatic J-elements 13, bundled together, placed in a groove formed between adjacent prismatic elements, and pulled out to the outside. Connect the pulled out signal conductor to the cable.
（８）正面板１４の導体膜にグラウンド用引出し線を接
続する。(8) Connect a ground lead wire to the conductor film of the front plate 14.
工程（１）によって設置される引出し線は第２図及び第
３図の構成となる。第２図はトランスデユーサの縦断面
概念図、第３図はトランスデユーサの平面概念図である
（いずれもトランスデユーサの一部を入り）。信弓用導
ＩＱ１６と角柱状エレメント１３の頭の接続はボンディ
ング１７で行われる（半田付けや接肴で（ｊうこともで
さる）。接続後のエレメントの頭は、エボ↑シからなる
マツチング層１８によって被覆される。信号用導線１６
の引出し方向は満１９に沿って夫々反対に導かれる２方
向となっている（第３図参照）。The lead wire installed in step (1) has the configuration shown in FIGS. 2 and 3. FIG. 2 is a conceptual vertical cross-sectional view of the transducer, and FIG. 3 is a conceptual plan view of the transducer (both include a part of the transducer). The connection of the head of the Shinkyu guide IQ 16 and the prismatic element 13 is done by bonding 17 (soldering or patching (also possible). After connection, the head of the element is made of mating made of ebo↑shi. coated by layer 18. Signal conductor 16
There are two directions in which the drawer is drawn out in opposite directions along the line 19 (see FIG. 3).
上記の各工程によって作られる２次元アレイ［ヘランス
デューりにおいて、角柱状エレメント１３は完全にダイ
シングされる。又、角柱状エレメント１３は正確なｉ！
盤１１配列を保持して正面板１４の導体股上（共通電極
上）に固定される。更に、個別電極の引出し線１６は束
ねられ、角柱状エレメント１３間で形成される溝１９の
中に確実に設置される。The two-dimensional array produced by each of the above steps [in the Hellensdew process, the prismatic elements 13 are completely diced. Moreover, the prismatic element 13 has accurate i!
It is fixed to the conductor rise (above the common electrode) of the front plate 14 while holding the board 11 arrangement. Further, the lead wires 16 of the individual electrodes are bundled and securely placed in the grooves 19 formed between the prismatic elements 13.
次に、本発明の他の実施例について説明する。Next, other embodiments of the present invention will be described.
本発明の他の実施例の特徴は、正面板を用いないで、接
合面を導体化したバッキング材にダイシングされた角柱
状エレメントを直接設置する点にある。即ら、以下の工
程を備える。Another embodiment of the present invention is characterized in that a diced prismatic element is directly installed on a backing material whose joint surface is made conductive, without using a front plate. That is, it includes the following steps.
（１１Ｐ ｉ Ｉ ′、ｔ；の圧電板を台座上にホット
メルト等で仮１ｆｉ着する。圧電板の両面は極めて薄い
膜で被覆されている。台座は溶剤で溶解する物体、又は
、所定の温度で融解若しくは分解する物体、例えばＪポ
リイトのようなやや柔らかみのある物体で構成される。Temporarily attach the piezoelectric plate (11P i I ′, t; 1fi on the pedestal with hot melt etc.) Both sides of the piezoelectric plate are coated with an extremely thin film. It is composed of a substance that melts or decomposes depending on the temperature, such as a slightly soft substance such as J Polyte.
（２） Ｉｆ雷仮を非接着側から公知のカッタでＥＳ盤
目状に完全にダイシングする。これにより、台座上に多
数の角（ｌ状エレメントが作られる。(2) Completely dice the If lightning in the shape of an ES board from the non-adhesive side using a known cutter. This creates a large number of corners (l-shaped elements) on the pedestal.
（３）導電性接着剤を用いて、角柱状エレメントの非台
座側（エレメントのＤｆｉ ）をバッキング材に接着す
る。バッキング材の接合面は銅、銀秀でメッキされてい
る。(3) Adhere the non-pedestal side of the prismatic element (Dfi of the element) to the backing material using a conductive adhesive. The joint surface of the backing material is plated with copper and silver.
（４）台座の融解温度の手で台座を溶解して角柱状エレ
メントから除去する。(4) Melt the pedestal at the melting temperature of the pedestal and remove it from the prismatic element.
（５）角柱状ｒレメン１−の非バッキング材側（エレメ
ントの頭）夫々にｆｉ ￥ｊ Ｊｌ導線を接続し、束ね
て隣合う角柱状ニレメン］へ間で形成される溝に設置し
て外部に引出す。引出された信号用導線をケーブルに接
続する。(5) Connect the conductive wires to each of the non-backing material sides (heads of the elements) of the prismatic element 1-, bundle them together, install them in the grooves formed between the adjacent prismatic elements, and connect them to the outside. Pull it out. Connect the pulled out signal conductor to the cable.
（６）バッキング材の導体にグラウンド用引出し線を接
続する。(6) Connect the ground lead wire to the conductor of the backing material.
このようなＴ稈に」、つても、先の工程の場合と同様に
角柱状エレメント１３は完全にダイシングされる。又、
角柱状エレメントは正確なＬ！ ｓ ［＋配列を保持し
てバッキング材の導体上（共通電極上）に固定される。Even in such a T-culm, the prismatic elements 13 are completely diced as in the previous step. or,
The prismatic element is exactly L! s [+ is fixed on the conductor (on the common electrode) of the backing material while maintaining the arrangement.
更に、個別電極の引出し線は束ねられ、角柱状エレメン
ト間で形成される満の中に確実に設置される。Further, the lead wires of the individual electrodes are bundled and securely placed in the spaces formed between the prismatic elements.
尚、本発明はｆｌｉ号用専用導線柱状エレメントとの接
続の構成を上記実施例に限定するものではなく、例えば
第４図又は第５図に示す構成であってもよい（各図の符
号は第２図と同じである）。第４図の例では、信号用導
線１６は角柱状エレメント１３の頭の而を含む水平向を
越えないようにして（ニレメンｌ−の頭を含む水平面に
凹凸を形成しないようにして）、導体層（膜）２０の端
面に接合されている。叉、第５図の例では、満１９の側
に一部を突出させて導体層（膜）２０に単層される導体
層２１を崗え、信号用導線１６はこの導体層２１の突出
部に接続されている。Note that the present invention does not limit the configuration of the connection with the dedicated conducting wire columnar element for fli to the above-mentioned embodiment, and may be, for example, the configuration shown in FIG. 4 or FIG. 5 (the reference numerals in each figure are (same as Figure 2). In the example shown in FIG. 4, the signal conducting wire 16 is arranged so that it does not go beyond the horizontal direction that includes the head of the prismatic element 13 (so as not to form any unevenness on the horizontal plane that includes the head of the prismatic element 13). It is bonded to the end surface of the layer (membrane) 20. In the example shown in FIG. 5, a conductor layer 21 is provided as a single layer on the conductor layer (film) 20 with a part protruding toward the side 19, and the signal conductor 16 is connected to the protruding portion of the conductor layer 21. It is connected to the.
このような各図において、角柱状エレメント１３３の頭
を３む水Ｐ面が平坦となるのｒ（凹凸がない）、マツチ
ング層をガラス２２、トリアセチルセルロース２３等か
らなる２層構造を容易に実現することがＣきる。In each of these figures, the surface of the water P surrounding the head 3 of the prismatic element 133 is flat (no unevenness), and the matching layer can be easily formed into a two-layer structure consisting of glass 22, triacetyl cellulose 23, etc. It is possible to realize it.
史に、第２の実施例の（３）の工程における角柱状エレ
メントとバッキング材とのＪｌｆ−１をフラックスと２
ｒ ＩＩＩからなる重層した薄いシートで行ってもよい
。この場合、該シートをニレメン１〜とバツＶング祠間
に介在させ、Ｊｌｌｌ Ｊ、ｔ してその状態を保持し
、半田溶解温度（約２００〜２２０℃）に−ＬＪ、￥？
温してから常温に戻り。これにより角柱状エレメントを
バッキング材に接着させることができる。この接右手段
では、熱サイクルに耐える台座及びバッキング材を用い
る必要があるが、例えばバッキング材としでエボＶシ、
ポリイミド等を母材にしてフェライトｒＪ）末等の吸？
’＋ ＪＭを混在させたものであれば問題がない。Historically, Jlf-1 of the prismatic element and backing material in step (3) of the second embodiment was mixed with flux and Jlf-2.
It may also be done with superimposed thin sheets of r III. In this case, the sheet is interposed between the Niremen 1~ and the X-V ring, Jlll J,t is maintained in that state, and the solder melting temperature (approximately 200~220°C) is -LJ,\?
Warm it up and then return it to room temperature. This allows the prismatic element to be adhered to the backing material. This contact means requires the use of a pedestal and backing material that can withstand thermal cycles; for example, as a backing material,
Is it possible to absorb ferrite rJ) powder etc. using polyimide etc. as the base material?
There is no problem if it is a mixture of '+ JM.
史に言えば、本発明の製造方法を１次元アレイトランス
デユーサの製造方法に応用することは容易である。イし
て、例えば凹曲面配列のアレイトランスデユー号を作る
用台、台座を凸曲面にり−れば所望の曲面の７レイ配列
を得ることがでさる。。Historically speaking, it is easy to apply the manufacturing method of the present invention to the manufacturing method of a one-dimensional array transducer. Then, for example, if the base and pedestal for making an array transducer with a concave curved surface array are made into a convex curved surface, a 7-ray array with a desired curved surface can be obtained. .
（発明の効果）
以上説明の通り、本発明の２次元アレイ！−ノンスデュ
ーサの製造方法よれば、完全なダイシングで形成される
角柱状エレメントの配列を共通？ｉイ極に固定する工程
が済むまＣ台座に仮接着しているため、２次元の配列を
精度良く保持することができる。又、個別電極の引出し
線を各エレメント間で形成される溝に設問するため、貫
通穴を挿通する作業に比べて簡単になる。従って、本発
明の製造Ｉｊ法にＪ、れば音響的結合が小さい２次元ア
レイトランスデユーサを４産することができる。(Effects of the Invention) As explained above, the two-dimensional array of the present invention! - According to the nonsducer manufacturing method, is the arrangement of prismatic elements formed by complete dicing common? Since it is temporarily bonded to the C pedestal until the step of fixing it to the i-pole is completed, the two-dimensional arrangement can be maintained with high precision. Furthermore, since the lead wires of the individual electrodes are inserted into the grooves formed between the respective elements, the work is simpler than the work of inserting the lead wires into through holes. Therefore, if J is applied to the manufacturing method Ij of the present invention, four two-dimensional array transducers with small acoustic coupling can be produced.
第１図（ａ）乃至（ｅ）は本発明の一実施例によるの製
造工程の説明図、第２図及び第３図は本発明の一実施例
における個別電極の引出し線の構成図、第４図は本発明
の他の実施例における個別電極の引出し線の構成図、第
５図は本発明の更に伯の実施例における個別電極の引出
し線の構成図、第６図は従来の２次元アレイトランスデ
ユー４ノの製造工程の説明図である。
１１・・・圧電体、１２・・・台座、１３・・・角柱状
エレメント、１４・・・正面板、１５・・・バッキング
材、１６・・・信号用導線、１７・・・ボンディング、
１８・・・マツチング層、１９・・・溝。FIGS. 1(a) to (e) are explanatory diagrams of the manufacturing process according to an embodiment of the present invention, FIGS. 2 and 3 are configuration diagrams of lead lines of individual electrodes in an embodiment of the present invention, FIG. 4 is a configuration diagram of an individual electrode lead line in another embodiment of the present invention, FIG. 5 is a configuration diagram of an individual electrode lead line in a further embodiment of the present invention, and FIG. 6 is a conventional two-dimensional diagram. FIG. 4 is an explanatory diagram of the manufacturing process of the array transducer 4. DESCRIPTION OF SYMBOLS 11... Piezoelectric body, 12... Pedestal, 13... Prismatic element, 14... Front plate, 15... Backing material, 16... Signal conducting wire, 17... Bonding,
18... Matching layer, 19... Groove.
Claims (2)
から圧電板を碁盤目状に完全にダイシングし、台座上に
多数の角柱状エレメントを作る工程と、接合面を導体化
したバツキング材を角柱状エレメントの非台座側に接着
する工程と、台座を角柱状エレメントから除去する工程
と、非バッキング材側に位置する角柱状エレメントの各
頭に信号用導線を接続し、隣合う角柱状エレメント間で
形成される溝に設置して外部に引出すと共に、バッキン
グ材の導体化面にグラウンド用引出し線を接続する工程
を備えることを特徴とする２次元アレイトランスデュー
サの製造方法。(1) The process of temporarily adhering the piezoelectric plate onto the pedestal, the process of completely dicing the piezoelectric plate in a grid pattern from the non-adhesive side to create a large number of prismatic elements on the pedestal, and making the bonding surface conductive. A step of gluing the backing material to the non-pedestal side of the prismatic element, a step of removing the pedestal from the prismatic element, and a step of connecting a signal conductor to each head of the prismatic element located on the non-backing material side, A method for manufacturing a two-dimensional array transducer, comprising the steps of installing it in a groove formed between matching prismatic elements and drawing it out to the outside, and connecting a grounding lead wire to a conductive surface of a backing material.
から圧電板を碁盤目状に完全にダイシングし、台座上に
多数の角柱状エレメントを作る工程と、接合面を導体化
した正面板を角柱状エレメントの非台座側に接着する工
程と、台座を角柱状エレメントから除去する工程と、バ
ッキング材を正面板の非各柱状エレメント側に接合する
工程と、非バッキング材側に位置する角柱状エレメント
の各頭に信号用導線を接続し、隣合う角柱状エレメント
間で形成される溝に設置して外部に引出すと共に、バッ
キング材の導体化面にグラウンド用引出し線を接続する
工程を備えることを特徴とする２次元アレイトランスデ
ユーサの製造方法。(2) The process of temporarily bonding the piezoelectric plate onto the pedestal, the process of completely dicing the piezoelectric plate in a grid pattern from the non-adhesive side to create a large number of prismatic elements on the pedestal, and making the bonding surface conductive. a step of adhering the front plate to the non-pedestal side of the prismatic element; a step of removing the pedestal from the prismatic element; a step of joining the backing material to the non-base side of the front plate; A signal conductor is connected to each head of the located prismatic elements, installed in the groove formed between adjacent prismatic elements and pulled out to the outside, and a ground lead wire is connected to the conductive surface of the backing material. A method for manufacturing a two-dimensional array transducer, comprising the steps of:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61293896A JPS63146697A (en) | 1986-12-10 | 1986-12-10 | Manufacture of two-dimension array transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61293896A JPS63146697A (en) | 1986-12-10 | 1986-12-10 | Manufacture of two-dimension array transducer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63146697A true JPS63146697A (en) | 1988-06-18 |
Family
ID=17800555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61293896A Pending JPS63146697A (en) | 1986-12-10 | 1986-12-10 | Manufacture of two-dimension array transducer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63146697A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60242800A (en) * | 1984-05-17 | 1985-12-02 | Yokogawa Medical Syst Ltd | Manufacture of diced transducer |
| JPS60256039A (en) * | 1984-06-01 | 1985-12-17 | Matsushita Electric Ind Co Ltd | Preparation of ultrasonic probe |
-
1986
- 1986-12-10 JP JP61293896A patent/JPS63146697A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60242800A (en) * | 1984-05-17 | 1985-12-02 | Yokogawa Medical Syst Ltd | Manufacture of diced transducer |
| JPS60256039A (en) * | 1984-06-01 | 1985-12-17 | Matsushita Electric Ind Co Ltd | Preparation of ultrasonic probe |
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