JPS58178250A - Manufacture of probe for ultrasonic wave inspector - Google Patents
Manufacture of probe for ultrasonic wave inspectorInfo
- Publication number
- JPS58178250A JPS58178250A JP57060291A JP6029182A JPS58178250A JP S58178250 A JPS58178250 A JP S58178250A JP 57060291 A JP57060291 A JP 57060291A JP 6029182 A JP6029182 A JP 6029182A JP S58178250 A JPS58178250 A JP S58178250A
- Authority
- JP
- Japan
- Prior art keywords
- supporting plate
- cylindrical surface
- adhesive
- probe
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/26—Arrangements for orientation or scanning by relative movement of the head and the sensor
Abstract
Description
【発明の詳細な説明】
この発明σ超音波検査装置用探触子の製造方法に係り、
探触子における振動子まわシの製造方法に関している。[Detailed Description of the Invention] This invention relates to a method for manufacturing a probe for a σ ultrasonic inspection device,
This article relates to a method of manufacturing a transducer holder in a probe.
超音波検査装置用探触子において、微少振動子を一足ギ
ャップを形成１．かつ一定ピツチで、円筒面を形成する
ように列状に並べ、超音波を広い角ｒｆ
度に放射できるようにしたものは、たとえば実開昭５６
−７１２１１号公報にて提供されている。In a probe for an ultrasonic inspection device, a minute gap is formed between the micro-oscillators.1. For example, a device that is arranged in rows at a constant pitch to form a cylindrical surface and can emit ultrasonic waves over a wide angle of RF
It is provided in Publication No.-71211.
本発明は、このよう彦探触子における、振動子列を容易
にかつ精密に製造できるようにすることにある。The object of the present invention is to enable the transducer array in such a Hiko probe to be manufactured easily and precisely.
本発明の製造方法は、圧電材の薄板を可撓性ある支持板
に接着し、圧電材薄板のみを公知の仕方で一定ギャップ
會形成して一定ピッチで切断し、前記接着剤より４耐熱
性のたかい接着剤によって切断された圧電材薄板を円筒
表面をもつ吸音材の円筒表面に接着し、それから圧電材
薄板と支持板との間の接着剤が溶けるまで加熱して支持
板を除去してなること、ｔ−特徴としている。In the manufacturing method of the present invention, a thin plate of piezoelectric material is adhered to a flexible support plate, and only the thin plate of piezoelectric material is cut at a constant pitch by forming a constant gap in a known manner. The cut piezoelectric thin plate is glued to the cylindrical surface of the sound absorbing material with a cylindrical surface using a strong adhesive, and then heated until the adhesive between the piezoelectric thin plate and the support plate melts, and the support plate is removed. Becoming is a t-characteristic.
本発明の製造方法によれば、圧電材薄板をフラットな状
態で切断して微少振動子を得ることができるので、リニ
ア電子走査形超音診断装置における切断技術と切断装置
と金利用して、微少振動子が精密なピッチとギャップと
を形成して配列された振動子アレイを容易に得ることが
でき、この配列を維持したまま振動子アレイを吸音材に
固定さ３ｃ１
せることができ、吸音材への固定と同時に振動子に円筒
面を形成させることができるので、微少振動子が一定ギ
ャップを形成して一定ピッチで並びかつ円筒面を形成す
る振動子アレイをもつ振動子組立体をきわめて容易に、
しかもｎｔａな配列でもって製造することができる。According to the manufacturing method of the present invention, minute vibrators can be obtained by cutting a thin piezoelectric material plate in a flat state. A vibrator array in which minute vibrators are arranged with precise pitches and gaps can be easily obtained, and the vibrator array can be fixed to a sound absorbing material while maintaining this arrangement, resulting in sound absorption. Since it is possible to form a cylindrical surface on the vibrator at the same time as fixing it to the material, it is possible to create a vibrator assembly with a vibrator array in which minute vibrators form a constant gap and are arranged at a constant pitch and form a cylindrical surface. easily,
Moreover, it can be manufactured with an nta arrangement.
支持板はぺＩＪ リウム銅、りん青銅、合成樹脂フィル
ムを用いることができる。圧電材薄板を支持板に固定す
る接着剤は常温で硬化しかつ第二接着剤の溶融温度より
も低いものｔ使用する。この目的のためにパラフィン系
接着剤が望しい。The support plate can be made of peIjium copper, phosphor bronze, or synthetic resin film. The adhesive used to fix the thin piezoelectric material plate to the support plate is one that hardens at room temperature and has a melting temperature lower than the melting temperature of the second adhesive. Paraffin adhesives are preferred for this purpose.
以下、本発明の探触子の製造方法の一爽施例を、添付図
面とともに説明する。Hereinafter, an embodiment of the method for manufacturing a probe according to the present invention will be described with reference to the accompanying drawings.
圧電材はＰＺＴ系のもので、たとえば厚さ０．４■の薄
板からなっている。支持板は厚さ０．２ ｍ、のべＩＪ
ＩＪウム銅板からなっている。圧電材薄板はこの支持
板にパラフィン系接着剤、たとえばエレクトロンワック
ス（商品名）によって接着される。The piezoelectric material is made of PZT, and is made of a thin plate having a thickness of, for example, 0.4 cm. The support plate is 0.2 m thick, total IJ
It is made of IJum copper plate. The thin piezoelectric material plate is adhered to this support plate using a paraffin adhesive such as Electron Wax (trade name).
第１図はこの状態を示していて、１１は圧電材薄板、１
２は支持板、１３は接着剤層をそれぞれ示している。Figure 1 shows this state, where 11 is a piezoelectric thin plate;
Reference numeral 2 indicates a support plate, and reference numeral 13 indicates an adhesive layer.
特開昭５８−１７８２５０ （２）
圧電材薄板は、支持板に固定されたｔま、リニア電子走
査形超音波診断装置の探触子における圧電材切断技術に
よって、一定ギャップを形成しかつ一定ピッチで切断さ
れる。切断は、勿論、圧電材薄板のみである。JP-A-58-178250 (2) A thin piezoelectric material plate is fixed to a support plate, and is cut at a constant gap and at a constant pitch using a piezoelectric material cutting technique in a probe of a linear electronic scanning ultrasound diagnostic device. will be cut off. Of course, only the piezoelectric thin plate is cut.
切断がおわった圧電材薄板と支持板との接着物は、第２
図に示すように、前述の接着剤よシも融点のたがい接着
剤によって、吸音材に接着される。After cutting, the adhesive between the thin piezoelectric material plate and the support plate is
As shown in the figure, the above-mentioned adhesives are also bonded to the sound absorbing material using adhesives having different melting points.
吸音材１４は振動子列が形成するべき半径に関連する半
径′１ｔもつ円筒表面１５ヲ有している。切断のおわっ
た圧電材薄板は、支持板に固定されたｔま、支持板に１
１着された面と反対匈の面を吸音材の円筒表面１５にそ
って接着される。この接着剤層は図面に符号１６で示さ
れていて、たとえばエポキシ樹脂系接着剤からなってい
る。The sound-absorbing material 14 has a cylindrical surface 15 with a radius '1t related to the radius at which the transducer array is to be formed. After cutting, the thin piezoelectric material plate is fixed to the support plate.
The opposite side of the first attached side is glued along the cylindrical surface 15 of the sound absorbing material. This adhesive layer is designated by the reference numeral 16 in the drawing and is made of, for example, an epoxy resin adhesive.
接着剤層１５が固化したら、接着剤層１３が溶ける壕で
全体が加熱される。加熱温度は、接着剤層がパラフィン
系接着剤の場合、５０−１００℃である。Once the adhesive layer 15 has solidified, the entire body is heated in a trench where the adhesive layer 13 is melted. The heating temperature is 50 to 100°C when the adhesive layer is a paraffin adhesive.
この加熱によって、支持板１２が圧電材薄板あるいは振
動プレイから除去される。それによって、−’
ｔｉ
定ギヤツプ管形成しかつ一定ビツチて所要半径の円筒面
を形成するように配列された振動子アレイが吸音材に配
列された振動子組立体管得ることができる。This heating causes the support plate 12 to be removed from the piezoelectric sheet or vibratory play. Thereby, −'
A vibrator assembly tube can be obtained in which a vibrator array is arranged on a sound absorbing material, forming a constant gap tube and having a constant pitch to form a cylindrical surface with a required radius.
第１図ないし第３図は本発明の探触子製造方法の過程を
楔形的に示す貌明図である。
１１・・・圧電材薄板、１２・・・支持板、１３・・・
接着剤層、１４・・・吸音材、１５・・・吸音材の円筒
表面、１６・・・接着剤層。
特許 出 願人 株式会社日立メデイコ代理人 弁理
士 秋 本 正 実第１図
１ど
第２図
４
第３図1 to 3 are wedge-shaped diagrams showing the process of the probe manufacturing method of the present invention. 11... Piezoelectric material thin plate, 12... Support plate, 13...
Adhesive layer, 14... Sound absorbing material, 15... Cylindrical surface of sound absorbing material, 16... Adhesive layer. Patent Applicant Hitachi Medeico Co., Ltd. Agent Patent Attorney Tadashi Akimoto Figures 1, 1, 2, 4, and 3
Claims (1)
［４し、圧電薄板のみを公知の仕方によって一定ギャッ
グを形成して一定ピッチで切断し、前記接着剤よりも耐
熱性のたがい接着剤によって切断された圧電材薄板を円
筒表面をもつ吸音材の円筒表面に接着し、そのおと圧電
材薄板と支持板との間にある接着剤が浴けるまで加熱し
て支持板を除去してなること、を％徴としている超音波
検査装置用探触子の製造方法。l A thin plate of piezoelectric material is made into a flexible support plate with an adhesive [4], and only the piezoelectric thin plate is cut at a constant pitch by forming a gag in a known manner, and is bonded to each other with more heat resistance than the adhesive. The piezoelectric material thin plate cut with an adhesive is adhered to the cylindrical surface of a sound absorbing material having a cylindrical surface, and the supporting plate is removed by heating until the adhesive between the piezoelectric material thin plate and the supporting plate is exposed. A method for manufacturing a probe for an ultrasonic inspection device, which has the following characteristics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57060291A JPS58178250A (en) | 1982-04-13 | 1982-04-13 | Manufacture of probe for ultrasonic wave inspector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57060291A JPS58178250A (en) | 1982-04-13 | 1982-04-13 | Manufacture of probe for ultrasonic wave inspector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58178250A true JPS58178250A (en) | 1983-10-19 |
Family
ID=13137903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57060291A Pending JPS58178250A (en) | 1982-04-13 | 1982-04-13 | Manufacture of probe for ultrasonic wave inspector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58178250A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60259247A (en) * | 1984-06-06 | 1985-12-21 | 株式会社東芝 | Ultrasonic probe and its production |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57188195A (en) * | 1981-05-14 | 1982-11-19 | Yokogawa Hokushin Electric Corp | Manufacture for conformal array oscillator |
-
1982
- 1982-04-13 JP JP57060291A patent/JPS58178250A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57188195A (en) * | 1981-05-14 | 1982-11-19 | Yokogawa Hokushin Electric Corp | Manufacture for conformal array oscillator |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60259247A (en) * | 1984-06-06 | 1985-12-21 | 株式会社東芝 | Ultrasonic probe and its production |
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