JPS60255295A - Automatic laser beam machine - Google Patents

Abstract

PURPOSE:To machine a material to be worked with high accuracy at a high speed by setting preliminarily the thickness, material quality and machining method of the material and setting and adjusting automatically machining conditions. CONSTITUTION:The machining figure stored by a numerical control device 14 is inputted to a microcomputer 24 and the machining method, sheet thickness and material are set manually by setters 22, 21, 23 and are inputted to the computer 24. Prescribed arithmetics are made by the computer 24 and the results thereof are outputted to a laser oscillator 11, a servocontrol motor 13, a means 25 for matching the focusing position, regulators 9A-9C and solenoid valves 10A-10C by which the adjustment of the oscillating method, focusing position, etc. of the oscillator 1 is made and the metal 11 is drilled. The output signal for the machining conditions is outputted to the oscillator 1, etc. when a discriminator 26 for the drilling confirms the end of the drilling. Then discriminator selects the laser oscillating method, laser output, focusing position and the kind of the machining gas and starts machining of the material 11.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to automatic laser processing that can automatically set and control appropriate processing conditions according to the type of workpiece. It is.

[Prior art]

FIG. 4 is a schematic configuration diagram showing a conventional laser processing machine.

In the figure, (1) is a laser oscillator that outputs laser light (2), and (3) is a lens (4) that focuses laser light (2).
and a processing head having a nozzle (5) for supplying processing gas; (6) is a bend mirror that changes the direction of the laser beam (2) passing through the beam duct (7) for safety purposes and makes it enter the processing head (3); (8) is the regulator (9) for controlling the processing gas.
), a processing gas storage cylinder for supplying to the nozzle (5) via the solenoid valve 001. 01) is the workpiece, (1
2+ is a processing table on which the workpiece 01) is placed, 03,
(13A) is a servo motor that moves the processing table 02 to an arbitrary position, and 0 (A) is a numerical control device that commands the movement position of the processing table 02 and outputs an operation signal for the servo motor (121, (12A)) It is.

A conventional laser processing machine is configured as described above, and the oscillation method (continuous or pulsed) of the laser oscillator (1) is determined depending on the thickness and material of the workpiece (11) and processing methods such as cutting, welding, and heat treatment. , set the output manually. Also, the processing head (3
) is determined according to the above conditions, the focus position is manually adjusted, and the type and gas pressure of the processing gas are manually set. For example, when drilling a hole in a workpiece of 0υ, use the laser oscillator (1).
The oscillation method is set to pulse oscillation, and the pressure of the processing gas is set to a predetermined pressure.

After setting the oscillation method of the laser oscillator (1) and the position of the processing head (3) as described above, the laser beam (2) is focused and processing is performed while moving the workpiece aυ into a predetermined shape. I am doing it.

Conventional laser processing machines are configured as described above, so the output of the laser oscillator (1) and the processing head (3) vary depending on the thickness, material, and processing method of the workpiece (11). It is necessary to manually set and adjust the position relative to 0υ and the machining gas, which poses a problem in that it is not easy to perform high-precision, high-speed machining.

[Summary of the invention]

This invention was made to improve the problems of the conventional ones as described above, and by setting the thickness, material, and processing method of the workpiece, We propose an automatic laser processing machine that processes workpieces with high precision and high speed by automatically setting and adjusting processing conditions such as laser oscillation method, laser output, focus alignment, processing gas type, and pressure. It is something.

[Embodiments of the invention]

FIG. 1 is an overall configuration diagram showing an embodiment of the present invention.
In the figure, (1) to (7) and aυ to Oa are the same as those of the conventional device described above. (8A), (8B), (
8C) are processing gas cylinders that store processing gases oxygen, nitrogen, and argon, respectively; (9A), (9B), and (9C) are regulators installed in each processing gas supply pipe;
10A), (10B).

(10C) is a solenoid valve for supplying processing gas, and these constitute a processing gas supply device. 0]) is the workpiece (
11) Plate thickness setting device to set the plate thickness, (2) is a processing method setting device to set the processing method for the workpiece 0υ such as cutting, welding, heat treatment, etc. (23) is to set the material of the workpiece θυ (24) is a microcomputer for controlling machining conditions (hereinafter referred to as microcomputer).

), the plate thickness setting device 0υ, the processing method setting device (A/D converter 0 which converts the input signals from the two hot metals and processing material setting device (c) into digital signals), and the A/D converter C311. an input circuit 02 which receives the output of the input circuit 02, a ROMC 13 which stores the contents such as the laser output for determining the processing conditions and the processing method, and the input circuit (3) which stores the contents such as the plate thickness, processing method, etc. Processing material signal and ROMC
33) which calculates and determines the machining conditions based on the contents stored in the CPU (3), an output circuit 0ω which outputs the machining conditions determined by the CPU0a, and converts the output signal of this output circuit 09 into an analog signal. The D/A converter (3'?) is a RAM that stores the machining shape output from the numerical control device αa and the machining conditions determined by the CPU C34.

Cω is a focusing means for focusing the processing head (3) upon receiving the output of processing conditions from the microcomputer Ca, and adjusts the position of the processing head (3) by a servo motor (25A). 00 is a judgment device that determines the drilling to determine the processing start position, and the tuning fork is a detection sensor that detects the end of the drilling by reflecting light (inputs the signal of 2'6, and the drilling is the end signal. Microcomputer C24)
Enter. (to) is a plate thickness detector that automatically detects the plate thickness of the workpiece Qη, and the detected plate thickness is transferred to the plate thickness setting device (
21). f2□□□ is a power fan F roller, which converts the laser output signal of the laser oscillator (1) output from the microcomputer CI'4) according to the speed signal of the servo motor (131, (13A)) on the processing table α. For example, when cutting shapes,
When machining the edge part, a servo motor (1 wrinkle) is used.

The laser output of the laser oscillator (1) is controlled in accordance with the acceleration/deceleration of the speed in accordance with the change in the speed command of (13A). This will be explained with reference to FIGS. 2 and 3. FIG. 2 is a flowchart for cutting a workpiece according to the above-mentioned embodiment, and FIG. 6 is a diagram showing a machining pattern pattern stored in the numerical control device OJ.

First, start the automatic laser processing machine by following the steps. In step (101), the machining figure 6, for example as shown in FIG.
to be memorized. Step (102) to step (104)
Set the processing method, plate thickness and material of the workpiece (11) using the processing method setting device (2 hot water, plate thickness setting device 0υ, processing material setting device).
C) is manually set and input into the microcomputer (24). Workpiece OD set on plate thickness setting device (21)
The plate thickness of the workpiece a detected by the plate thickness detector (24)
It can also be set automatically by inputting the plate thickness of υ.

In step (105), microcomputer CI! 4)
The CPU e141 of the CPU e141 is inputted from the numerical control device (1
and the machining start position (!i3.65 positions of the square hole 61), calculate the laser oscillation method, etc., and store the calculated drilling conditions in the RAM (36) in step (106).Set in step (107) plate thickness, processing method, material and RO
Based on the contents stored in M (331), the laser oscillator (
Processing conditions such as oscillation method, laser output, focal position, type of processing gas, and gas pressure in step 1) are calculated, and step (108
) and store it in RA, M ('36).

Next, the conditions and the oscillation output of the laser oscillator (]) are stored in the RAM (36) in step (109).
Call out the processing conditions of laser output and focus position, and send this output signal to the laser oscillator (1), numerical controller 0, focus positioning means (25+, regulators (9A) to (9C))
and outputs to the electromagnetic valves (10A) to (IDC), and while adjusting the oscillation method of the laser oscillator (), focal position, etc., drilling starts in step (110). In step (111), the detection sensor (goods) and the hole are determined by the judgment device (
26) After confirming the completion of drilling, step (
112) calls the processing conditions stored in the RAM (%), outputs the output signal of the processing conditions to the laser oscillator (1), etc., and outputs the laser oscillation method, laser output, focal position, and type of processing gas, such as a metal plate. When cutting the workpiece θ1), select oxygen and gas pressure and cut the workpiece θ1) in step (113).
Start processing. In step (114), if the machining progresses at the etched portion (531t) shown in FIG. 3 and the machining speed changes, the power controller (
29) while controlling the laser output.
Process l. In step (115), it is determined whether there is secondary machining or not, for example, whether the machining start positions N of the square holes G and v of the machining figure 6I shown in FIG. 6 → In other words, if there is any drilling required at the start of machining, return to step (109), machine the workpiece Ql) again from the machining start position 6■ of the square hole 64), and then drill the workpiece Ql) in step (116). All processing of the workpiece aυ is completed.

〔Effect of the invention〕

As explained above, in this invention, by setting the plate thickness, material, and processing method of the workpiece, processing conditions such as laser oscillation method 2, laser output, focus alignment, and processing gas type are automatically determined. Furthermore, since the laser output and processing speed can be feedback-controlled during processing, the workpiece can be processed with high accuracy and high speed, which has the effect of easily performing precision processing.

[Brief explanation of the drawing]

FIG. 1 is an overall configuration diagram showing an embodiment of the present invention, FIG. 2 is a 70-chart when cutting a workpiece by the embodiment shown in FIG. 1, and FIG. 3 is a diagram of a processed figure pattern. Fourth
The figure is a configuration diagram showing a conventional laser processing machine. (1)...Laser oscillator, (2)...Laser light, (
3)...Processing head, (8), (8A), (8B)
, (8C)...Processing gas storage cylinder (9), (9
A), (9B), (9C) ・v kitter,
(10, (10A). (10B), (10C)... Solenoid valve, (11)...
・Workpiece, 02... Processing table, (13), (
13A)...Servo motor, 041...Numerical controller, 0υ...Plate thickness setting device, (2..Processing method setting device, (2,1...Processing material setting device, C4) ... Microcomputer for controlling processing conditions, (c) ... Focusing means, (26) ... Hole determination device, c'7) ... Detection sensor, (c) ... Plate thickness detection instrument, Cgl... power controller, 6 [... machining figure. Note that the same reference numerals in each figure indicate the same or corresponding parts. Agent Patent Attorney Sanro Kimura

Claims (4)

[Claims] (1) A laser oscillator that outputs laser light according to a laser output command value and a processing head that focuses the laser light output from the i-laser oscillator with a lens and performs force II machining on the workpiece; Processing on which the workpiece is placed. a table; a focusing means for aligning the focus of the machining head and the workpiece; a numerical control device that outputs a signal to move the machining head or the machining table to an arbitrary position; a processing gas supply device for selectively supplying a processing gas such as , argon, etc.; means for setting plate thickness, processing method, and processing material; outputs of the numerical control device, plate thickness setting means, processing method setting means, and processing material setting means; An automatic laser processing machine comprising processing condition control means for selecting and controlling a laser output command value stored in advance, the output of a focus positioning means, and the type and pressure of processing gas. (2) The automatic laser processing machine according to claim 1, wherein the plate thickness setting means comprises a plate thickness detector. (3) Claim 1 or 2, wherein the processing condition control means has feedback control of laser output and processing speed.
Automatic laser processing machine described in section. (4) The automatic laser processing machine according to claim 1, 2 or 6, wherein the processing condition control means is implemented by a microcomputer.