WO1994003302A1 - Photo-scanning type laser machine - Google Patents

Photo-scanning type laser machine Download PDF

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Publication number
WO1994003302A1
WO1994003302A1 PCT/JP1993/001036 JP9301036W WO9403302A1 WO 1994003302 A1 WO1994003302 A1 WO 1994003302A1 JP 9301036 W JP9301036 W JP 9301036W WO 9403302 A1 WO9403302 A1 WO 9403302A1
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Prior art keywords
beam diameter
lens
laser beam
moving
laser
Prior art date
Application number
PCT/JP1993/001036
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French (fr)
Japanese (ja)
Inventor
Norio Karube
Yoshinori Nakata
Original Assignee
Fanuc Ltd
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Publication date
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Publication of WO1994003302A1 publication Critical patent/WO1994003302A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

Definitions

  • the present invention relates to an optical scanning laser beam machine that performs processing by condensing and irradiating a laser beam onto a beam using a moving focusing system, and more particularly to a stroke (optical scanning stroke) of a moving focusing system.
  • the present invention relates to an enlarged optical scanning laser processing machine. Background technology
  • Laser processing machines are widely used for processing such as cutting and welding.
  • As the laser beam machine there is known an optical scanning type laser beam machine in which a movable condensing system is moved to perform laser irradiation.
  • FIG. 2 is a diagram schematically showing a conventional optical scanning type laser beam machine.
  • the laser oscillator 1 comprises a total reflection mirror 2 and an output coupling mirror 3, and outputs a laser beam 4.
  • the laser beam 4 expands in diameter due to a diffraction phenomenon when propagating in free space, and is incident on the moving light focusing system 8.
  • the laser beam 4 incident on the moving condensing system 8 is deflected by the reflecting mirror 5 and then condensed by the converging lens 6 to irradiate the work ⁇ .
  • the position of the moving condensing system 8 changes as indicated by an arrow 9, and the laser beam 4 is scanned on the work 7 according to the change.
  • the beam diameter D of the laser beam 4 is D 1 on the focusing lens 6. Further, on the work 7, the light is not condensed at one point of the focal point, but is condensed on the spot diameter D2.
  • the above conventional optical scanning type laser beam machine has the following disadvantages.
  • the spot diameter D 2 depends on the beam diameter D 1 on the focusing lens 6. Since the beam diameter D 1 changes as a function of the position of the moving light collecting system 8, the spot diameter D 2 also changes as a function of the position of the moving light collecting system 8. This means that the kerf (cut groove) changes at different positions on the peak 7, so that uniform cut quality cannot be guaranteed.
  • spot diameter D2 varies depending on various conditions such as the material, plate thickness, surface condition, and required cut surface roughness of the work 7, and it is difficult to always optimize the spot diameter D2.
  • the allowable stroke S of the moving light focusing system 8 is in the range from the nearest point S1 to the farthest point S2 shown in the figure, but the range is excessively small for general use. As described above, in the conventional optical scanning laser processing machine, the laser processing range was limited to a narrow range. Disclosure of the invention
  • the present invention has been made in view of such a point, and an object of the present invention is to provide an optical scanning laser beam machine capable of performing laser machining in a wide range by expanding an allowable stroke.
  • Another object of the present invention is to provide an optical scanning laser beam machine that can perform laser beam machining with an optimum kerf for each work.
  • a focusing lens and an optical component whose distance between the focusing lens and the focusing lens can be controlled are provided in the moving focusing system. For this reason, even if the moving condensing system moves and the beam diameter on the condensing lens changes due to the movement, the beam diameter can be maintained at a constant value by controlling the position of the optical component. Therefore, the allowable stroke of the moving condensing system can be expanded, and laser irradiation can be performed over a wide range.
  • the beam is controlled by controlling the position of the optical components.
  • the diameter can always be controlled to its optimal beam diameter. Therefore, the spot diameter is always optimally controlled, and laser processing can be performed with optimal force for each work.
  • FIG. 1 is a diagram schematically showing an optical scanning laser beam machine according to the present invention
  • FIG. 2 is a diagram schematically showing a conventional optical scanning laser beam machine.
  • FIG. 1 is a view schematically showing an optical scanning type laser beam machine according to the present invention.
  • the optical scanning type laser beam machine according to the present invention comprises a CNC 100, a laser oscillator 1 and a moving focusing system 8.
  • the laser oscillator 1 comprises a total reflection mirror 2 and an output coupling mirror 3, and outputs a laser beam 4.
  • the moving focusing system 8 is composed of a beam diameter correcting lens 2 °, a reflecting mirror 5 and a focusing lens 6, and its position is controlled by a command from the CNC 100 as indicated by an arrow 9. You.
  • the beam diameter correction lens 20 is provided in front of the reflecting mirror 5, and its position is controlled by a command from CNC 100 as indicated by an arrow 21. By controlling the position of the beam diameter correction lens 20, the mutual distance between the focusing lens 6 and the beam diameter correction lens 0 can be controlled. A long focal length lens or the like is used as the beam diameter correction lens 20.
  • the position control of the moving light focusing system 8 and the beam diameter correction lens 20 is performed via a servo motor and a ball screw mechanism (not shown).
  • the CNC 100 is configured around a processor (not shown) and controls the entire laser processing machine based on a processing program. That is, a laser output command is output to the laser oscillator 1, and a movement command is output to the moving focusing system 8 and the beam diameter correction lens 20 as described above. , Control.
  • the memory (not shown) that composes the CNC 100 has an optimum beam diameter on the focusing lens 6 for various conditions such as the material, thickness, surface condition, and required cut surface roughness of the work 7.
  • D 10 is set in advance. The CNC 100 outputs a position command signal of the beam diameter correction lens 20 based on the optimum beam defect D 10.
  • the beam diameter correction lens 20 and the reflecting mirror 5 After the laser beam 4 output from the laser oscillator 1 enters the moving condensing system 8, the beam diameter correction lens 20 and the reflecting mirror 5 Then, the light is irradiated onto the work ⁇ ⁇ via the condenser lens 6. Laser processing is performed by the irradiated laser beam 4.
  • the movable condenser system 8 includes the condenser lens 6 and the beam diameter correction lens 20 capable of controlling the distance between the condenser lens 6 and the condenser lens 6. Is provided. Therefore, even if the moving condensing system 8 moves and the beam diameter D 1 on the converging lens 6 changes due to the movement, the position of the beam diameter correcting lens 20 is controlled by controlling the position of the beam diameter correcting lens 20. Thus, the beam diameter D 1 can be maintained at a constant value.
  • the beam diameter D 1 can be maintained at a constant value, and The movable range of system 8 is greatly expanded. Therefore, laser processing over a wide range is possible while maintaining uniform processing quality. Further, an optimum beam diameter D 10 is set in advance for various conditions such as the material of the work 7, and the beam diameter correction lens is set so that the beam diameter D 1 is maintained at the optimum beam diameter D 10. The 20 position is controlled.
  • the optimal beam diameter D 10 is set so that the force is reduced.
  • the optimal beam diameter D10 is set so that the kerf becomes larger.
  • the position of the beam diameter correction lens 20 is controlled according to the optimum beam diameter D10. Therefore, laser processing can be performed with an optimum spot diameter D 2 corresponding to each work 7, and laser processing with an optimum force can be performed. In this way, the laser processing is performed at the optimum force for each work 7, so the advanced knowledge of the laser processing machine Functionalization can be achieved.
  • a condensing lens and an optical component capable of controlling the mutual distance between the condensing lens are provided in the moving condensing system of the optical scanning laser processing machine. . Therefore, even if the moving condensing system moves and the beam diameter on the converging lens changes due to the movement, the beam diameter can be maintained at a constant value by controlling the position of the optical component. Therefore, the allowable stroke of the moving condensing system can be expanded, and laser processing can be performed over a wide range while maintaining uniform processing quality. Further, the beam diameter on the focusing lens can be controlled to an optimum beam diameter set corresponding to each condition of the work. Therefore, the spot diameter is always optimally controlled, and laser processing with optimal power is possible.

Abstract

This invention relates to a photo-scanning type laser machine capable of effecting laser machining in a broader range by expanding an allowable stroke. A movable condenser system (8) comprises a beam diameter correction lens (20), a reflecting mirror (5) and a condenser lens (6), and its position is controlled by an instruction from a CNC (100) as indicated by an arrow (9). The beam diamter correction lens (20) is disposed in front of the reflecting mirror (5), and its position is controlled by an instruction from the CNC (100) as indicated by an arrow (21). Accordingly, even when the movable condenser system (8) moves and the beam diameter (D1) on the condenser lens (6) changes due to the movement of the former, the beam diameter (D1) can be kept constant by controlling the position of the beam diameter correction lens (20). In other words, even when the stroke of the movable condenser system (8) is expanded from the nearest point S (3) to the remotest point (S4), laser machining can be carried out in a broad range while keeping uniform machining quality.

Description

明 細 書 光走査型レーザ加工機 技 術 分 野  Description Optical Scanning Laser Processing Machine Technology
本発明は移動集光系を用いてレーザビームをヮ一ク上に集光 照射し加工を行う光走査型レーザ加工機に関し、 特に移動集光 系のス ト ローク （光走査ス ト ローク） を拡大した光走査型レ一 ザ加工機に関する。 背 景 技 術  BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical scanning laser beam machine that performs processing by condensing and irradiating a laser beam onto a beam using a moving focusing system, and more particularly to a stroke (optical scanning stroke) of a moving focusing system. The present invention relates to an enlarged optical scanning laser processing machine. Background technology
レーザ加工機は、 切断、 溶接等の加工に広く使用されている。 そのレーザ加工機において、 移動集光系を移動させてレーザ加 ェを行うタイプの光走査型レーザ加工機が知られている。  Laser processing machines are widely used for processing such as cutting and welding. As the laser beam machine, there is known an optical scanning type laser beam machine in which a movable condensing system is moved to perform laser irradiation.
図 2は従来の光走査型レーザ加工機を概略的に示す図である。 レーザ発振器 1 は全反射鏡 2 と出力結合鏡 3から成り、 レーザ ビーム 4を出力する。 レーザビーム 4は、 自由空間を伝播する 際に回折現象によつて径が拡大し、 移動集光系 8に入射する。 移動集光系 8に入射したレーザビーム 4は、 反射鏡 5によって 偏向した後、 集光レ ンズ 6 によって集光しワーク Ίに照射する。 移動集光系 8はその位置が矢印 9で示す様に変化し、 その変化 に応じてレ一ザビーム 4はワーク 7上を走査される。  FIG. 2 is a diagram schematically showing a conventional optical scanning type laser beam machine. The laser oscillator 1 comprises a total reflection mirror 2 and an output coupling mirror 3, and outputs a laser beam 4. The laser beam 4 expands in diameter due to a diffraction phenomenon when propagating in free space, and is incident on the moving light focusing system 8. The laser beam 4 incident on the moving condensing system 8 is deflected by the reflecting mirror 5 and then condensed by the converging lens 6 to irradiate the work Ί. The position of the moving condensing system 8 changes as indicated by an arrow 9, and the laser beam 4 is scanned on the work 7 according to the change.
レーザビーム 4のビ一厶径 Dは、 集光レ ンズ 6上では D 1 で ある。 また、 ワーク 7上では焦点の一点に集光されず、 スポ ッ ト径 D 2に集光される。  The beam diameter D of the laser beam 4 is D 1 on the focusing lens 6. Further, on the work 7, the light is not condensed at one point of the focal point, but is condensed on the spot diameter D2.
上記従来の光走査型レーザ加工機には下記の欠点がある。 スポ ッ ト径 D 2は、 集光レ ンズ 6上でのビーム径 D 1 に依存 する。 そのビーム径 D 1 は、 移動集光系 8の位置の関数と して 変化するので、 結果としてスポ ッ ト径 D 2 も移動集光系 8の位 置の関数として変化する。 このことは、 カーフ （切断溝） がヮ ーク 7上の異なった位置で変化することを意味するため、 一様 な切断品質が保証できないことになる。 The above conventional optical scanning type laser beam machine has the following disadvantages. The spot diameter D 2 depends on the beam diameter D 1 on the focusing lens 6. Since the beam diameter D 1 changes as a function of the position of the moving light collecting system 8, the spot diameter D 2 also changes as a function of the position of the moving light collecting system 8. This means that the kerf (cut groove) changes at different positions on the peak 7, so that uniform cut quality cannot be guaranteed.
また、 スポッ ト径 D 2は、 ワーク 7の材質、 板厚、 表面状態、 所要切断面粗さ等の諸条件によつて異なり、 それを常時最適化 するのは困難である。  In addition, the spot diameter D2 varies depending on various conditions such as the material, plate thickness, surface condition, and required cut surface roughness of the work 7, and it is difficult to always optimize the spot diameter D2.
したがって、 たまたまビーム径 D 1がワーク 7 の諸条件に適 合している場合のみ、 スポ ッ ト径 D 2及びカーフが最適となる ように保持される。 その場合、 移動集光系 8の許容ス トロ ーク Sは、 図に示す最近点 S 1から最遠点 S 2の範囲となるが、 そ の範囲は、 一般の用途には過度に小さい。 このように、 従来の 光走査型レーザ加工機では、 レーザ加工できる範囲が狭い範囲 に限定されていた。 発 明 の 開 示  Therefore, only when the beam diameter D1 happens to conform to the various conditions of the work 7, the spot diameter D2 and the kerf are maintained to be optimal. In that case, the allowable stroke S of the moving light focusing system 8 is in the range from the nearest point S1 to the farthest point S2 shown in the figure, but the range is excessively small for general use. As described above, in the conventional optical scanning laser processing machine, the laser processing range was limited to a narrow range. Disclosure of the invention
本発明はこのような点に鑑みてなされたものであり、 許容ス トロークを拡大して広範囲でレーザ加工を行うことができる光 走査型レーザ加工機を提供する ことを目的とする。  The present invention has been made in view of such a point, and an object of the present invention is to provide an optical scanning laser beam machine capable of performing laser machining in a wide range by expanding an allowable stroke.
また、 本発明の他の目的は、 ワーク毎に最適カ ーフでレーザ 加工を行う ことができる光走査型レーザ加工機を提供すること である。  Another object of the present invention is to provide an optical scanning laser beam machine that can perform laser beam machining with an optimum kerf for each work.
本発明では上記課题を解決するために、  In the present invention, in order to solve the above section,
レーザ発振器から出力されたレーザビームを移動集光系を用 いてヮ ーク上に集光照射し加工を行う光走査型レーザ加工機に おいて、 前記移動集光系の集光レンズと、 前記移動集光系に設 けられ前記集光レンズとの間の相互間距離が制御可能な光学部 品と、 を有することを特徴とする光走査型レーザ加工機が、 提 供される。 Moves the laser beam output from the laser oscillator using a focusing system In a light-scanning laser beam machine that performs processing by condensing and irradiating a laser beam on a workpiece, between the condensing lens of the moving condensing system and the condensing lens provided in the moving condensing system An optical component having a controllable distance between the optical components, and an optical scanning type laser beam machine, comprising:
移動集光系内に、 集光レンズと、 その集光レンズとの間の相 互間距離が制御可能な光学部品とが設けられる。 このため、 移 動集光系が移動し、 その移動によって集光レンズ上のビーム径 が変化しても、 光学部品の位置を制御することによってビーム 径を一定値に保持することができる。 したがって、 移動集光系 の許容ス トロークを拡大することができ、 広範囲でのレーザ加 ェが可能となる。  A focusing lens and an optical component whose distance between the focusing lens and the focusing lens can be controlled are provided in the moving focusing system. For this reason, even if the moving condensing system moves and the beam diameter on the condensing lens changes due to the movement, the beam diameter can be maintained at a constant value by controlling the position of the optical component. Therefore, the allowable stroke of the moving condensing system can be expanded, and laser irradiation can be performed over a wide range.
また、 ワークの材質、 板厚、 表面状態、 所要切断面粗さ等の 諸条件に対して、 集光レンズ上の最適ビーム径が設定された場 合、 光学部品の位置を制御することによってビーム径をその最 適ビーム径に常時制御することができる。 したがって、 スポ ッ ト径も常時最適に制御され、 ヮーク毎に最適力一フでのレーザ 加工が可能になる。 図 面 の 簡 単 な 説 明  Also, if the optimum beam diameter on the condenser lens is set for various conditions such as the work material, plate thickness, surface condition, and required cut surface roughness, the beam is controlled by controlling the position of the optical components. The diameter can always be controlled to its optimal beam diameter. Therefore, the spot diameter is always optimally controlled, and laser processing can be performed with optimal force for each work. Brief explanation of drawings
図 1 は本発明の光走査型レーザ加工機を概略的に示す図、 図 2 は従来の光走査型レーザ加工機を概略的に示す図である。 発明を実施するための最良の形態  FIG. 1 is a diagram schematically showing an optical scanning laser beam machine according to the present invention, and FIG. 2 is a diagram schematically showing a conventional optical scanning laser beam machine. BEST MODE FOR CARRYING OUT THE INVENTION
以下、 本発明の一実施例を図面に基づいて説明する。  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
図 1 は本発明の光走查型レーザ加工機を概略的に示す図であ る。 本発明の光走査型レーザ加工機は、 C N C 1 0 0 、 レーザ 発振器 1及び移動集光系 8から構成される。 FIG. 1 is a view schematically showing an optical scanning type laser beam machine according to the present invention. You. The optical scanning type laser beam machine according to the present invention comprises a CNC 100, a laser oscillator 1 and a moving focusing system 8.
レーザ発振器 1 は全反射鏡 2 と出力結合鏡 3から成り、 レー ザビーム 4を出力する。 移動集光系 8は、 ビーム径補正レ ンズ 2 ◦、 反射鏡 5及び集光レ ンズ 6から構成され、 その位置が矢 印 9で示すように C N C 1 0 0からの指令によつて制御される。 ビーム径補正レ ンズ 2 0は、 反射鏡 5の手前に設けられ、 その 位置が矢印 2 1で示すように C N C 1 0 0からの指令によって 制御される。 このビーム径補正レ ンズ 2 0の位置制御によって、 集光レ ンズ 6 とビーム径補正レ ンズ 0 との間の相互間距離が 制御可能となる。 ビーム径補正レ ンズ 2 0には長焦点レ ンズ等 が用いられる。 なお、 移動集光系 8及びビーム径補正レ ンズ 2 0の位置制御は、 ここでは図示されていないサーボモータとボ ールネジの機構を介して行われる。  The laser oscillator 1 comprises a total reflection mirror 2 and an output coupling mirror 3, and outputs a laser beam 4. The moving focusing system 8 is composed of a beam diameter correcting lens 2 °, a reflecting mirror 5 and a focusing lens 6, and its position is controlled by a command from the CNC 100 as indicated by an arrow 9. You. The beam diameter correction lens 20 is provided in front of the reflecting mirror 5, and its position is controlled by a command from CNC 100 as indicated by an arrow 21. By controlling the position of the beam diameter correction lens 20, the mutual distance between the focusing lens 6 and the beam diameter correction lens 0 can be controlled. A long focal length lens or the like is used as the beam diameter correction lens 20. The position control of the moving light focusing system 8 and the beam diameter correction lens 20 is performed via a servo motor and a ball screw mechanism (not shown).
C N C 1 0 0は、 プロセッサ （図示せず） を中心に構成され、 加工プログラムに基づいてレーザ加工機全体を制御する。 すな わち、 レーザ発振器 1 に対してはレーザ出力指令を、 また、 上 述したように、 移動集光系 8及びビーム径補正レ ンズ 2 0に対 しては、 移動指令をそれぞれ出力し、 制御する。 さらに、 C N C 1 0 0を構成するメモリ （図示せず） には、 ワーク 7の材質、 板厚、 表面状態、 所要切断面粗さ等の諸条件に対する集光レ ン ズ 6上の最適ビーム径 D 1 0が予め設定されている。 C N C 1 0 0 は、 その最適ビー厶怪 D 1 0 に基づいて、 ビー厶径補正レ ンズ 2 0の位置指令信号を出力する。  The CNC 100 is configured around a processor (not shown) and controls the entire laser processing machine based on a processing program. That is, a laser output command is output to the laser oscillator 1, and a movement command is output to the moving focusing system 8 and the beam diameter correction lens 20 as described above. , Control. In addition, the memory (not shown) that composes the CNC 100 has an optimum beam diameter on the focusing lens 6 for various conditions such as the material, thickness, surface condition, and required cut surface roughness of the work 7. D 10 is set in advance. The CNC 100 outputs a position command signal of the beam diameter correction lens 20 based on the optimum beam defect D 10.
レーザ発振器 1から出力されたレーザビーム 4は、 移動集光 系 8に入射した後、 さらにビ一ム径補正レ ンズ 2 0、 反射鏡 5 及び集光レ ンズ 6を経由してワーク Ί に照射される。 その照射 されたレーザビーム 4 によってレーザ加工が行われる。 After the laser beam 4 output from the laser oscillator 1 enters the moving condensing system 8, the beam diameter correction lens 20 and the reflecting mirror 5 Then, the light is irradiated onto the work 経 由 via the condenser lens 6. Laser processing is performed by the irradiated laser beam 4.
このように、 本実施例では、 移動集光系 8内に、 集光レ ンズ 6 と、 その集光レ ンズ 6 との間の相互間距離が制御可能なビー ム径補正レ ンズ 2 0 とを設ける。 このため、 移動集光系 8が移 動し、 その移動によって集光レ ンズ 6上のビ一厶径 D 1が変化 しても、 ビーム径補正レンズ 2 0の位置を制御することによつ てビーム径 D 1を一定値に保持することができる。 すなわち、 移動集光系 8 のス トロークを、 図に示すように最近点 S 3から 最遠点 S 4まで拡大しても、 ビーム径 D 1を一定値に保持する ことができ、 移動集光系 8の可動範囲が大幅に広がる。 したが つて、 一様な加工品質を維持したままで、 広範囲でのレーザ加 ェが可能となる。 また、 ワーク 7の材質等の諸条件に対して、 最適ビーム径 D 1 0が予め設定され、 ビーム径 D 1がその最適 ビー厶径 D 1 0に保持されるように、 ビーム径補正レ ンズ 2 0 の位置が制御される。  As described above, in the present embodiment, the movable condenser system 8 includes the condenser lens 6 and the beam diameter correction lens 20 capable of controlling the distance between the condenser lens 6 and the condenser lens 6. Is provided. Therefore, even if the moving condensing system 8 moves and the beam diameter D 1 on the converging lens 6 changes due to the movement, the position of the beam diameter correcting lens 20 is controlled by controlling the position of the beam diameter correcting lens 20. Thus, the beam diameter D 1 can be maintained at a constant value. That is, even if the stroke of the moving condensing system 8 is expanded from the closest point S 3 to the farthest point S 4 as shown in the figure, the beam diameter D 1 can be maintained at a constant value, and The movable range of system 8 is greatly expanded. Therefore, laser processing over a wide range is possible while maintaining uniform processing quality. Further, an optimum beam diameter D 10 is set in advance for various conditions such as the material of the work 7, and the beam diameter correction lens is set so that the beam diameter D 1 is maintained at the optimum beam diameter D 10. The 20 position is controlled.
例えば、 薄板の切断加工時には、 カーフを小さ く して高速化 と面精度の向上が必要となるので、 力一フが小さ くなるように 最適ビーム径 D 1 0を設定する。 また、 厚板の切断加工時には、 カーフを拡大して補助ガスの流れを滑らかにする必要があるの で、 カーフが大き くなるように最適ビー厶径 D 1 0を設定する。 ビ一厶径補正レ ンズ 2 0 は、 その最適ビーム径 D 1 0に従って 位置が制御される。 したがって、 ワーク 7毎に対応して最適な ス ポ ッ ト径 D 2 で レーザ加工を行う ことができ、 最適力 ーフで のレーザ加工が可能になる。 このように、 ワーク 7毎に最適力 一フでのレーザ加工が行われるので、 レーザ加工機の高度の知 能化を達成することができる。 For example, when cutting a thin plate, it is necessary to increase the speed and improve the surface accuracy by reducing the size of the kerf. Therefore, the optimal beam diameter D 10 is set so that the force is reduced. Also, when cutting thick plates, it is necessary to enlarge the kerf to smooth the flow of auxiliary gas, so the optimal beam diameter D10 is set so that the kerf becomes larger. The position of the beam diameter correction lens 20 is controlled according to the optimum beam diameter D10. Therefore, laser processing can be performed with an optimum spot diameter D 2 corresponding to each work 7, and laser processing with an optimum force can be performed. In this way, the laser processing is performed at the optimum force for each work 7, so the advanced knowledge of the laser processing machine Functionalization can be achieved.
以上説明したように本発明では、 光走査型レーザ加工機の移 動集光系内に、 集光レンズと、 その集光レンズとの間の相互間 距離が制御可能な光学部品とを設けた。 このため、 移動集光系 が移動し、 その移動によって集光レ ンズ上のビーム径が変化し ても、 光学部品の位置を制御することによってビーム径を一定 値に保持することができる。 したがって、 移動集光系の許容ス ト ロ一クを拡大することができ、 一様な加工品質を維持したま まで、 広範囲でのレーザ加工が可能となる。 また、 集光レ ン ズ上のビーム径を、 ワークの諸条件毎に対応して設定された最 適ビーム径に制御することができる。 したがって、 スポ ッ ト径 も常時最適に制御され、 最適力ーフでのレーザ加工が可能にな る  As described above, in the present invention, a condensing lens and an optical component capable of controlling the mutual distance between the condensing lens are provided in the moving condensing system of the optical scanning laser processing machine. . Therefore, even if the moving condensing system moves and the beam diameter on the converging lens changes due to the movement, the beam diameter can be maintained at a constant value by controlling the position of the optical component. Therefore, the allowable stroke of the moving condensing system can be expanded, and laser processing can be performed over a wide range while maintaining uniform processing quality. Further, the beam diameter on the focusing lens can be controlled to an optimum beam diameter set corresponding to each condition of the work. Therefore, the spot diameter is always optimally controlled, and laser processing with optimal power is possible.

Claims

請求の範囲 The scope of the claims
1 . レーザ発振器から出力されたレーザビームを移動集光系 を用いてヮーク上に集光照射し加工を行う光走査型レーザ加工 機において、  1. An optical scanning laser beam machine that focuses and irradiates a laser beam output from a laser oscillator onto a workpiece using a moving focusing system.
前記移動集光系の集光レンズと、  A focusing lens of the moving focusing system,
前記移動集光系に設けられ、 前記集光レンズとの間の相互間 距離が制御可能な光学部品と、  An optical component provided in the moving condensing system, wherein an optical distance between the condensing lens and the condensing lens is controllable;
を有することを特徴とする光走査型レーザ加工機。  An optical scanning laser beam machine comprising:
2 . 前記相互間距離の制御は C N Cによって行われることを 特徴とする請求項 1記載の光走査型レーザ加工機。  2. The optical scanning laser beam machine according to claim 1, wherein the control of the mutual distance is performed by CNC.
3 . 前記相互間距離の制御は、 前記ワークに対して最適加工 を行えるように予め設定されたデータに基づいて行われること を特徴とする請求項 1記載の光走査型レーザ加工機。  3. The optical scanning laser beam machine according to claim 1, wherein the control of the mutual distance is performed based on data set in advance so that the workpiece can be optimally processed.
PCT/JP1993/001036 1992-08-03 1993-07-23 Photo-scanning type laser machine WO1994003302A1 (en)

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