JPS60254700A - Cooling liquid dipping circuit board - Google Patents
Cooling liquid dipping circuit boardInfo
- Publication number
- JPS60254700A JPS60254700A JP10948484A JP10948484A JPS60254700A JP S60254700 A JPS60254700 A JP S60254700A JP 10948484 A JP10948484 A JP 10948484A JP 10948484 A JP10948484 A JP 10948484A JP S60254700 A JPS60254700 A JP S60254700A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- groove
- cooling liquid
- chip
- immersed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
技術分野
本発明は、基板に搭載したチップの冷却を促進する冷却
液浸漬回路基板に関する。Description: TECHNICAL FIELD The present invention relates to a coolant immersion circuit board that facilitates cooling of chips mounted on the board.
技術の背景
ガリウムひ素手導体素子は液体窒素に接触させて冷却す
る浸漬冷却を行ないながら動作させる。Background of the Technology Gallium arsenide hand conductor elements are operated while being immersed cooled by contacting them with liquid nitrogen.
従来技術と問題点
通常の浸漬冷却法では、平坦な基板２の上にチップ４を
搭載する。そのため冷却液がチップの上部表面にのみ接
触する。本発明者らは特願昭５８−１５５１８号におい
て、基板に搭載したチップ４の裏面にも冷却液が接触す
る回路基板を開示した。Prior Art and Problems In the usual immersion cooling method, a chip 4 is mounted on a flat substrate 2. Therefore, the coolant contacts only the top surface of the chip. In Japanese Patent Application No. 58-15518, the present inventors have disclosed a circuit board in which the cooling liquid also contacts the back surface of the chip 4 mounted on the board.
発明の目的
本発明の目的は、接続・千ッド数を増加した場合に冷却
効率を改良する冷却液浸漬回路基板を提供することであ
る。OBJECTS OF THE INVENTION It is an object of the present invention to provide a coolant immersion circuit board that improves cooling efficiency when increasing the number of connections.
発明の構成
本発明の上記目的は、冷却用液体に浸漬した回路基板が
溝を有し、この溝を跨いで搭載したチップを裏面からも
冷却する冷却液浸漬回路基板であって、溝内に、溝の側
壁の方向に隔壁を設けて複数の溝に分割したことを特徴
とする冷却液浸漬回路基板によって達成される・
実施例
以下本発明の好ましい実施例を図面を参照して説明する
。Structure of the Invention The above-mentioned object of the present invention is to provide a cooling liquid immersed circuit board in which the circuit board immersed in a cooling liquid has a groove, and a chip mounted across the groove is cooled from the back side. This is achieved by a coolant-immersed circuit board characterized in that the groove is divided into a plurality of grooves by providing a partition wall in the direction of the side wall of the groove.Examples Preferred embodiments of the present invention will be described below with reference to the drawings.
第１図に示すように、溝１が回路基板２に設けてあシ、
この溝４を跨ぐようにチップ４を基板２の上面３に載置
し、チップ４の下の溝１・林島溝の側壁の方向に隔壁５
によって複数個に分割されている。チップ４を基板２に
接続する・やラド６は、第２図に示すように基板の上面
３の他に隔壁５の上面にも設けることができ、これによ
って多数の接続・臂ツドを有するチップの搭載が可能と
なる。As shown in FIG. 1, a groove 1 is provided in a circuit board 2,
The chip 4 is placed on the upper surface 3 of the substrate 2 so as to straddle this groove 4, and the partition wall 5 is placed in the direction of the side wall of the groove 1 and Lindao groove below the chip 4.
It is divided into multiple parts by. The pads 6 for connecting the chip 4 to the substrate 2 can be provided not only on the top surface 3 of the substrate but also on the top surface of the partition wall 5, as shown in FIG. It becomes possible to install
５０Ｘ５０Ｘ２ｍのセラミック基板の上に、幅および深
さを変えた溝を１つ穿ち、溝を跨いで６Ｘ６Ｘ０．４ｍ
ｍのシリコンチップを基板に固着し、チップには予め出
力可変の発熱体を埋設し、また温度検出端をチップの表
面に取付けておいた。基板を液体窒素に浸漬し、溝の幅
および深さに対応して変化する放熱量をめた。その結果
を第３図に示す。このグラフよシ、１つの大きい溝、た
とえば幅５■、深さ０．５−の溝の放熱量は約２６ｗ１
５＋２である。幅３置、深さ０．５ ｗｍの小さい溝の
放熱量は約２４Ｗ々ｉでｌｂ ’） ２ｗ７．ｉ シか
減少していないが、・９ツドを設は得る面積は飛躍的に
増大する。Drill one groove of varying width and depth on a 50 x 50 x 2 m ceramic substrate, and straddle the groove to form a 6 x 6 x 0.4 m
A silicon chip of m was fixed to a substrate, a heating element with variable output was embedded in the chip in advance, and a temperature detection end was attached to the surface of the chip. The substrate was immersed in liquid nitrogen, and the amount of heat dissipation that varied depending on the width and depth of the groove was measured. The results are shown in FIG. According to this graph, the amount of heat dissipated from one large groove, for example, a groove with a width of 5 cm and a depth of 0.5 cm, is approximately 26 w1.
It is 5+2. The amount of heat dissipated from a small groove with a width of 3 positions and a depth of 0.5 wm is approximately 24W2lb') 2w7. Although the number of square meters has not decreased, the area that can be obtained by installing 900 square meters will increase dramatically.
発明の効果
冷却液浸漬回路基板は、チップの下の冷却用溝７の数を
増す方が、１つの溝の大きさを増すよシも接続・母、ド
数を増加した場合の冷却効果が大きい＠Effects of the Invention In the cooling liquid immersion circuit board, increasing the number of cooling grooves 7 under the chip is better than increasing the size of one groove. big@
第１図は本発明の回路基板の実施態様の斜視図であシ、
第２図は第１図の回路基板の要部断面図であシ、第３図
は回路基板に設けた溝の幅、深さと冷却能力との関係を
示すグラフである。
１・・・溝、２・・・回路基板、３・・・基板の上面、
４・・・チップ、５・・・隔壁、６・・・・母、ド。
特許出願人
富士通株式会社
特許出願代理人
弁理士 青 木 朗
弁理士西舘和之
弁理士内田幸男
弁理士 山 口 昭 之
ＷＪ１図
第２図
第３図
溝の深さ （ｍｍ）Fig. 1 is a perspective view of an embodiment of the circuit board of the present invention, Fig. 2 is a cross-sectional view of the main part of the circuit board of Fig. 1, and Fig. 3 is a width of a groove provided in the circuit board. , is a graph showing the relationship between depth and cooling capacity. 1...Groove, 2...Circuit board, 3...Top surface of board,
4...chip, 5...bulkhead, 6...mother, de. Patent applicant Fujitsu Limited Patent agent Akira Aoki Patent attorney Kazuyuki Nishidate Patent attorney Yukio Uchida Akira Yamaguchi WJ1 Figure 2 Figure 3 Groove depth (mm)
Claims (1)
を跨いそ搭載したチップを裏面からも冷却する冷却液浸
漬回路基板であって、溝内に、溝の側壁の方向に隔壁を
設けて複数の溝に分割したことを特徴とする冷却液浸漬
回路基板。 ２、チップと基板とを接続するパッドが、基板の上部表
面の他に、溝の隔壁の上面にも設けである、特許請求の
範囲第１項記載の冷却液浸漬回路基板０[Scope of Claims] 1. A circuit board immersed in a cooling liquid, in which the circuit board immersed in a cooling liquid has a groove, and the chip mounted on the circuit board is cooled from the back side by straddling the groove. A coolant-immersed circuit board characterized in that the circuit board is divided into a plurality of grooves by providing a partition wall in the direction of the side wall of the circuit board. 2. The coolant immersion circuit board 0 according to claim 1, wherein the pads for connecting the chip and the substrate are provided not only on the upper surface of the substrate but also on the upper surface of the partition wall of the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10948484A JPS60254700A (en) | 1984-05-31 | 1984-05-31 | Cooling liquid dipping circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10948484A JPS60254700A (en) | 1984-05-31 | 1984-05-31 | Cooling liquid dipping circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60254700A true JPS60254700A (en) | 1985-12-16 |
| JPH0557755B2 JPH0557755B2 (en) | 1993-08-24 |
Family
ID=14511409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10948484A Granted JPS60254700A (en) | 1984-05-31 | 1984-05-31 | Cooling liquid dipping circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60254700A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5729158U (en) * | 1980-07-25 | 1982-02-16 | ||
| JPS57103338A (en) * | 1980-12-19 | 1982-06-26 | Hitachi Ltd | Boiling cooling device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5621600A (en) * | 1979-07-30 | 1981-02-28 | Yamasa Shoyu Co Ltd | Determination of lipid peroxide |
-
1984
- 1984-05-31 JP JP10948484A patent/JPS60254700A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5729158U (en) * | 1980-07-25 | 1982-02-16 | ||
| JPS57103338A (en) * | 1980-12-19 | 1982-06-26 | Hitachi Ltd | Boiling cooling device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0557755B2 (en) | 1993-08-24 |
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