JPS5999743A - Package for integrated circuit - Google Patents

Abstract

PURPOSE:To simplify the mounting of a transmission member, and to transfer heat excellently by setting up a guide sliding and guiding the transmission member along the flat surface of the IC package. CONSTITUTION:Leads 12 on both sides of the DIL type package 11 made of a resin are soldered with a printed substrate 1. Guide grooves 11B are formed to both side walls of a recessed section 11A at the center of the upper surface of the package 11. The size of the groove 11B is set adequately in consideration of the thickness of the heat transfer member 13 inserted, and the heat transfer member 13 and the bottom of the recessed section 11A are fast stuck. According to the constitution, the flat surface of the heat transfer member 13 can be fast stuck directly and uniformly to the surface of the recessed section 11A of the package only by inserting the heat transfer member 13 along the grooves 11B. Consequently, work is simplified, and heat transfer property between the package and the heat transfer member can be kept excellently.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an integrated circuit package with improved heat dissipation.

Integrated circuits are sensitive to heat, so when using them in unfavorable thermal environments such as high-density packaging or high-temperature environments,
A method has been adopted in which a heat transfer member with good thermal conductivity is brought into contact with the integrated circuit package, and this heat transfer member is connected to a heat sink, a heat pipe, etc. to improve the heat dissipation performance of the integrated circuit package or to cool the integrated circuit package. There is.

In this case, as shown in FIG. 1, an integrated circuit package 3, which is attached to a printed circuit board 1 through leads 2, does not conventionally have any special means for fixing the heat transfer member.

For this reason, as shown in FIG.
Alternatively, attach the screws 6 to the heat transfer member 4, fix the heat transfer member 4 to the printed circuit board 1 by tightening the screws 6', and connect the heat transfer member 4 and the printed circuit board. By holding the integrated circuit package 3 between the shoes, you can make contact with it! However, in the method of using adhesive, the thermal conductivity between the package 3 and the heat transfer member 4 is reduced due to the presence of the adhesive. ″ □Also, when fixing with screws, the heat transfer member 4 is curved between the screw fixing part and the contact area with the package 3 is insufficient. Only □+: Number of parts such as outer screw 6, etc. Both had problems, such as an increase in the number of

The present invention has been made in view of the above-mentioned circumstances, and is an integrated circuit package that eliminates the need for screws, adhesives, etc., and also improves heat transfer between the two by bringing the heat transfer member into good contact with the package surface. The integrated circuit package is provided with a guide portion that slides and guides the heat transfer member along a flat surface, and the package and the heat transfer member can be brought into close contact by simply inserting the heat transfer member through the guide portion.

Embodiments of the present invention will be described in detail below with reference to the drawings. Incidentally, the same parts as in the conventional drawings are given the same reference numerals and the description thereof will be omitted.

FIG. 3 shows one embodiment of an integrated circuit package according to the present invention.

In the figure, reference numeral 11 denotes a dual in-line type integrated circuit chip cage according to this embodiment, which is molded from, for example, resin. Integrated circuit glue 12 is attached to both sides of this nut cage 11, and the glue 12 is soldered to the printed circuit board 1. The center part of the upper surface of the package 11 is formed into a concave shape, and a guide groove 11B is formed along both side walls of the concave part 11A.The dimension in the height direction of the guide groove 11B is; Considering the thickness of the heat transfer member 13, the thickness is set to an appropriate value so that the heat transfer member 13 and the bottom surface of the recess 11A come into close contact.

According to this configuration, as shown in FIG. 4, the heat transfer member 13 is moved in the direction of the arrow along the guide groove 11B of the heat transfer member guide portion provided on the upper surface of the integrated circuit pancage 11 arranged on the printed circuit board 1. The flat surface of the heat transfer member 13 can be directly and uniformly brought into close contact with the bottom surface of the recess 11A of the package 11 by simply inserting the heat transfer member 13 through the heat transfer member 13. Therefore, the package 11 and the heat transfer member 13
Improves heat transfer between the Moreover, even if the arranged integrated circuit packages 11 are slightly shifted from each other, the heat transfer member 1
It is preferable to make the width between the guide grooves 11B somewhat larger than the width of the heat transfer member 130 so that the guide grooves 11B can be inserted easily.

Note that the heat transfer member guide portion is located only on the top surface of the package.
It may be provided on both the upper and lower surfaces as shown in the figure, or it may be provided only on the lower surface side. Further, the integrated circuit package to which the present invention is applied is not limited to the dual in-line package 7.

As described above, according to the present invention, the integrated circuit package is provided with a guide portion that guides the heat transfer member along the integrated circuit package surface and in close contact with the package surface. There is no need to use screws or adhesives when contacting and fixing the package to the package surface, and the heat transfer between the package and the heat transfer member can be improved compared to conventional methods. In short, mounting the heat transfer member can be done extremely easily.

[Brief explanation of the drawing]

Fig. 1 is a front view of a conventional integrated circuit package, Fig. 2 is a perspective view showing a conventional heat transfer member attached state, Fig. 3 is a front view showing an embodiment of the present invention, and Fig. 4 is an implementation of the same. FIG. 5 is a perspective view showing an example of a state in which the heat transfer member is attached, and FIG. 5 is a front view showing another embodiment of the present invention. 11...Integrated circuit package 11A...Four parts 1
1B... Guide groove 13... Heat transfer member patent applicant Fujio Sasashima, patent attorney representing Nissan Motor Co., Ltd.

Claims (1)

[Claims] An integrated circuit package, comprising: a guide portion that guides the heat transfer member along the flat surface of the package to bring the flat surface of the integrated circuit package and the flat surface of the heat transfer member into close contact with each other.