KR19990050155A - Clip Heatsink - Google Patents

Abstract

The present invention relates to a clip-type heat sink that can be attached to the outside of the package body for heat dissipation of the semiconductor chip package, and is made of a thermally conductive material, wherein the package body of the semiconductor chip package is fitted to at least two sides of the package body. It characterized in that it has a connecting portion for determining the distance between the first pressing portion and the second pressing portion and the first pressing portion and the second pressing portion facing each other to elastically clamp in contact with the above and integrally connect them. Such a clip type heat sink effectively dissipates heat generated from the package to the outside by a simple mounting process after assembling a semiconductor chip package, especially a package having a high power consumption. There is an advantage that can be obtained (利 點).

Description

Clip type heatsink for semiconductor chip package

The present invention relates to a heat sink for a semiconductor chip package, and more particularly, to a clip type heat sink that can be attached to the outside of a package body for heat dissipation of a semiconductor chip package.

In order to solve the data bottleneck that the general DRAM (DRAM) cannot keep up with the information processing speed of the central processing unit, products that enable high speed and high frequency of devices have emerged. As such, unlike a conventional package structure for mounting a product, a vertical mount package (SVP; Surfacemount Vertical Package) or a horizontal mount package (SHP) to which an external lead that serves as an electrical connection terminal is attached to one side of the package. Packages such as Surfacemount Horizontal package have emerged.

1 is a side view of a typical vertically mounted package.

As shown in FIG. 1, the outer lead 12 protrudes to one side of the package body 11 and is bent to be suitable for vertical mounting. Since the external lead 12 is located on one side, the input / output path of the data is shortened and the data path between pins is similar, so that it is easy to cope with high frequency, which is advantageous for the operation of a high-speed device. Is being applied.

The package 10 has a higher power consumption than the conventional products, and external leads for data transmission and power supply are located on the short side and mounted vertically or horizontally on the printed circuit board. It is disadvantageous for heat dissipation through a printed circuit board because it has a structure having an external lead 12, and when a vertically mounted package is actually used, a plurality of packages (4 to 32) are mounted at a small pitch, Not only does heat dissipate effectively, but it also affects adjacent packages, creating a harsh environment compared to a single package. Therefore, in the package of high power products, heat dissipation is an important factor even when the module is mounted together with heat dissipation of each component.

2 is a cross-sectional view of a general type semiconductor chip package having a heat sink.

In order to solve the heat dissipation problem, the conventional semiconductor chip package 20 attaches a heat sink 23 to the lead frame 22 as shown in FIG. 2, and the heat sink 23 is also provided with the semiconductor chip 24. We tried to solve the heat dissipation problem by incorporating a heat sink in a form that allows it to be attached or by assembling a package with the heat sink exposed to the outside.

However, in the past, the package was assembled with the heat sink attached to the lead frame or the heat sink was attached during the package assembly process. For this reason, the package assembly process had to consider various factors such as stability of resin molding (molding) forming the package body due to the heat sink, problems of cracking after the resin molding, productivity problems due to the increase of the process, and the like.

An object of the present invention is to provide a heat sink for a semiconductor chip package that can be easily mounted after assembly for effective heat dissipation of a semiconductor chip package, especially a package having a high power consumption.

1 is a side view of a typical vertically mounted package,

2 is a cross-sectional view of a semiconductor chip package of a general type having a heatsink;

3 is a perspective view showing a first embodiment of a clip heat sink according to the present invention;

4 is a side view illustrating a state in which the clip heat sink of FIG. 3 is applied;

5 is a side view showing a state in which a second embodiment of a clip heat sink according to the present invention is applied;

6 is a perspective view showing a third embodiment of a clip-type heat sink according to the present invention;

7 is a side view illustrating a state in which the clip type heat sink of FIG. 6 is applied;

8 is a side view showing a fourth embodiment of a clip-type heat sink according to the present invention;

9 is a side view showing a fifth embodiment of a clip-type heat sink according to the present invention.

Explanation of symbols on the main parts of the drawings

10; Vertical mount package 11; Package body

12; Outer lead 20; Horizontal mount package

30,40,50; Clip-type heat sinks 31,41; First crimping part

32,42; Second crimp sections 33,43; Connection

51; Heatsink

The heat sink for a semiconductor chip package according to the present invention for achieving the above object is characterized in that it has a clip form detachable to the package body of the semiconductor chip package to mount the heat sink after the package assembly.

The clip-shaped heat sink is made of a thermally conductive material, and includes first and second compression parts facing each other so that the package body of the semiconductor chip package is fitted and contacts and elastically clamps at least two surfaces of the package body. The distance between the first compression portion and the second compression portion can be divided into a connection portion for integrally connecting them.

The clip-type heatsink can be easily applied by having a “⊂” shape, which is the simplest form suitable for clamping the package body.

The clip-type heatsink can also be applied to either vertically mounted or horizontally mounted packages. In the case of a vertically mounted package, the clip heat sink causes at least one of the first and second compression parts to be in surface contact with the package body of the semiconductor chip package, and the connection part is clamped by the first and second compression parts. It is good to have the structure bent to make it. In the case of the horizontally mounted package, the clip heat sink may have a structure in which the first crimping portion and the second crimping portion are bent, and the connecting portion is in surface contact with one surface of the package body.

In order to maximize the effect of heat dissipation, it is possible to have a structure in which a plurality of clip-type heat sinks of the above structure are attached to a separate heat sink made of a thermally conductive material. Of course, a heat sink can also be attached to a single heat sink. The heat dissipation plate may further improve heat dissipation effect because the surface area of the heat sink is increased by increasing the surface area in contact with air.

Hereinafter, a clip type heat sink according to the present invention will be described in detail with reference to the accompanying drawings.

3 is a perspective view showing a first embodiment of a clip heat sink according to the present invention;

4 is a side view illustrating a state in which the clip heat sink of FIG. 3 is applied;

5 is a side view showing a state in which the second embodiment of the clip heat sink according to the present invention is applied.

Referring to FIG. 3, the clip heat sink 30 according to the present invention has a “⊂” shape and is divided into a first crimping part 31, a second crimping part 33, and a connecting part 32. The first crimping portion 31 and the second crimping portion 33 are in the form of a flat plate and the connecting portion 32 is curved. The clip type heat sink 30 may be applied to the vertical package 10 as shown in FIG. 4. That is, the first pressing part 31 and the second pressing part 33 are in surface contact so as to have good adhesion to both surfaces of the package body 11, respectively, to clamp the package body 11. The heat generated from the package body 11 is transmitted to the first compression part 31 and the second compression part 33 to be distributed or released to the outside.

Referring to FIG. 5, in the clip type heat sink 35, only the second pressing portion 37 is in surface contact with one surface of the package body 11, and the first pressing portion 36 and the second pressing portion 37 are also in surface contact. ) Is clamping the package body 11.

That is, in the clip type heat sink according to the present invention, at least one of the first pressing parts 31 and 36 and the second pressing parts 33 and 37 is brought into surface contact with the package body 11 and the first pressing part is provided. By allowing the 31 and 36 and the second pressing portions 33 and 37 to clamp the package body 11, it can be easily applied to the vertically mounted package 10.

Figure 6 is a perspective view showing a third embodiment of the clip-type heat sink according to the present invention, Figure 7 is a side view showing a state in which the clip-type heat sink of Figure 6 is applied.

Clip heatsink according to the present invention, as shown in Figure 6, the first crimping portion 41 and the second crimping portion 43 has a curved shape, and the connecting portion 42 to have a flat plate form Figure 7 As can be seen in the horizontally mounted package 20 can be applied. That is, the first crimping part 41 and the second crimping part 43 serve to clamp the package body 21 purely, and the connection part 42 is brought into surface contact with one surface of the package body 21. Its application is possible. The horizontally mounted package 20, which can be preferably applied, has a form in which the outer lead 22 protrudes on both sides, since the outer lead 22 can clamp the two sides on which the outer lead 22 does not protrude.

8 is a side view showing a fourth embodiment of the clip type heat sink according to the present invention, and FIG. 9 is a side view showing a fifth embodiment of the clip type heat sink according to the present invention.

The clip type heat sink according to the present invention can be applied to a module by having a structure as shown in FIGS. 8 and 9. FIG. 8 is a clip-type heat sink 50 suitable for a case where a plurality of vertically mounted packages 10 are mounted at predetermined intervals, and the connection portion 32 is attached to a heat sink 51 having a flat plate shape. Have In the clip heat sink 50 having such a structure, heat generated in each package 10 is conducted to the first crimping portion 31, the second crimping portion 33, and the connecting portion 32, and the heat is again radiated to the heat sink. It may be conducted to 51 to be dispersed or diverged. 9 is a shape applied to the horizontal package 20, the concave-convex is formed on the top of the heat sink 56, the surface area is increased by the concave-convex to increase the area in contact with air to improve the heat dissipation effect Can be. The clip type heat sink 55 may be manufactured by forming the heat sink 56 itself to have irregularities or by attaching a fin to the heat sink 56 itself. Of course, a fan may be attached to the heat sink 55 to forcibly cool the heat from the package.

As described above, the clip-type heat sink is manufactured by a separate process in addition to the assembly process centering on the semiconductor element, and the heat dissipation effect of the package is achieved by a simple operation of inserting the semiconductor chip package in close contact with the package body. Can be raised. Of course, the heat sink is made by bending and forming a material having good thermal conductivity and elasticity in consideration of adhesion strength and adhesion to the package.

Therefore, according to the structure of the clip-type heat sink according to the present invention, there is an effect of effectively dissipating heat generated from the package to the outside by a process of simply mounting after assembling the semiconductor chip package, especially a package having a high power consumption, and is also simple to the module. It is advantageously applied to obtain a heat dissipation effect.

Claims (10)

It is made of a thermally conductive material, the first body and the second compression and the first compression and the first pressing portion facing each other so that the package body of the semiconductor chip package is fitted and in contact with at least two sides of the package body to elastically clamp 2 Clip-type heat sink with connection to determine the distance of the crimp. The clip type heat sink according to claim 1, wherein the clip type heat sink has a "⊂" shape. The method of claim 1, wherein the clip-type heat sink is at least one of the first pressing portion and the second pressing portion is in surface contact with the surface of the package body of the semiconductor chip package, the connecting portion is the first pressing portion and the first 2. The clip-type heat sink, which is bent at least once so as to generate a clamping force in the crimping portion. The clip-type heat sink of claim 2, wherein the semiconductor chip package is a vertically mounted package in which an external lead protrudes to one side. The clip-type heat sink of claim 1, wherein the clip-type heat sink is bent by the first crimping portion and the second crimping portion, and the clip-type heat sink has a flat surface such that the connection portion is in surface contact with one surface of the package body of the semiconductor chip package. Heatsink. 6. The clip type heat sink as claimed in claim 5, wherein the semiconductor chip package is a horizontally mounted semiconductor chip package in which external leads protrude to both sides. The clip-type heat sink according to claim 1, further comprising a heat sink attached to the connection portion and having a flat heat sink. The clip type heat sink as set forth in claim 7, wherein the heat sink is formed with irregularities on the opposite surface of the heat sink. It is made of a thermally conductive material, the first body and the second compression and the first compression and the first pressing portion facing each other so that the package body of the semiconductor chip package is fitted and in contact with at least two sides of the package body to elastically clamp A clip-type heat sink having a connecting portion for determining a distance between the two pressing portions; A heat sink having at least one heat sink and having a flat plate shape made of a thermally conductive material; Clip type heat sink, characterized in that having a. 10. The clip type heat sink as set forth in claim 9, wherein the heat sink is provided with irregularities at an upper portion thereof.