JPS60254644A - 沸騰冷却用回路基板の実装構造 - Google Patents

沸騰冷却用回路基板の実装構造

Info

Publication number
JPS60254644A
JPS60254644A JP59109473A JP10947384A JPS60254644A JP S60254644 A JPS60254644 A JP S60254644A JP 59109473 A JP59109473 A JP 59109473A JP 10947384 A JP10947384 A JP 10947384A JP S60254644 A JPS60254644 A JP S60254644A
Authority
JP
Japan
Prior art keywords
circuit board
chip
cooling
semiconductor chip
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59109473A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0315822B2 (https=
Inventor
Kishio Yokouchi
貴志男 横内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59109473A priority Critical patent/JPS60254644A/ja
Publication of JPS60254644A publication Critical patent/JPS60254644A/ja
Publication of JPH0315822B2 publication Critical patent/JPH0315822B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59109473A 1984-05-31 1984-05-31 沸騰冷却用回路基板の実装構造 Granted JPS60254644A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59109473A JPS60254644A (ja) 1984-05-31 1984-05-31 沸騰冷却用回路基板の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59109473A JPS60254644A (ja) 1984-05-31 1984-05-31 沸騰冷却用回路基板の実装構造

Publications (2)

Publication Number Publication Date
JPS60254644A true JPS60254644A (ja) 1985-12-16
JPH0315822B2 JPH0315822B2 (https=) 1991-03-04

Family

ID=14511123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59109473A Granted JPS60254644A (ja) 1984-05-31 1984-05-31 沸騰冷却用回路基板の実装構造

Country Status (1)

Country Link
JP (1) JPS60254644A (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51141462U (https=) * 1975-05-07 1976-11-15
JPS52114271A (en) * 1976-03-22 1977-09-24 Hitachi Ltd Semiconductor pellet mounting structure for substrate
JPS5887836A (ja) * 1981-11-20 1983-05-25 Hitachi Ltd 基板およびそれを用いたペレツトボンデイング方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51141462U (https=) * 1975-05-07 1976-11-15
JPS52114271A (en) * 1976-03-22 1977-09-24 Hitachi Ltd Semiconductor pellet mounting structure for substrate
JPS5887836A (ja) * 1981-11-20 1983-05-25 Hitachi Ltd 基板およびそれを用いたペレツトボンデイング方法

Also Published As

Publication number Publication date
JPH0315822B2 (https=) 1991-03-04

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