JPS6025151U - Soldering iron parts for flat pack ICs, etc. - Google Patents

Soldering iron parts for flat pack ICs, etc.

Info

Publication number
JPS6025151U
JPS6025151U JP11629783U JP11629783U JPS6025151U JP S6025151 U JPS6025151 U JP S6025151U JP 11629783 U JP11629783 U JP 11629783U JP 11629783 U JP11629783 U JP 11629783U JP S6025151 U JPS6025151 U JP S6025151U
Authority
JP
Japan
Prior art keywords
soldering iron
electrical component
terminal
flat pack
convex wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11629783U
Other languages
Japanese (ja)
Inventor
浩二 八代
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP11629783U priority Critical patent/JPS6025151U/en
Publication of JPS6025151U publication Critical patent/JPS6025151U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はフラットパックICと回路基板との関係を示す
斜視図、第2図は従来の自動半田付は装置の半田鏝部分
を示す生新側面図、第3図は第2図のものを用いて回路
基板にフラットパックICを半田付けする状態の断面図
、第4図と第5図は第1図の半田鏝部の生新側面図と下
面図、第6図と第′7図は本案の一実施例の半田鏝部の
生新側面図と下面図である。 18は電気部品、10はケース、12は端子、13は回
路基板、20は半田鏝部、25は凸壁、24は凹部、2
1は加熱部材、26は先端部、27は根元部、26aは
先端面、26bは傾斜側面を示す。 82、1 15 \J≦ユ==ユユユイイエユ2工、三耐\−く
Figure 1 is a perspective view showing the relationship between the flat pack IC and the circuit board, Figure 2 is a new side view showing the soldering iron part of the conventional automatic soldering equipment, and Figure 3 is the same as that shown in Figure 2. Figures 4 and 5 are side and bottom views of the new soldering iron in Figure 1, and Figures 6 and 7 are cross-sectional views of the soldering iron used to solder a flat pack IC onto a circuit board. FIG. 2 is a new side view and a bottom view of a soldering iron part according to an embodiment of the present invention. 18 is an electric component, 10 is a case, 12 is a terminal, 13 is a circuit board, 20 is a soldering iron part, 25 is a convex wall, 24 is a recessed part, 2
1 is a heating member, 26 is a tip, 27 is a base, 26a is a tip, and 26b is an inclined side. 82, 1 15 \J≦Yu==Yuyuyuiyueyu 2nd, 3rd grade\-ku

Claims (1)

【実用新案登録請求の範囲】 所定の電気回路素子が内蔵されたケースと、該ケースの
側面から突出され、前記ケースの内部で前記電気回路素
子に接続された複数の端子とを備えたフラットパックI
C等の電気部品が、前記端子に対応した半田ランド部を
有する回路基板に半田付けをするか又は該半田付けを解
除する際に使用され、 前記電気部品の端子に対応して突出した所定幅の凸壁を
表面に有し、該凸壁の内側に前記電気部品のケースが入
る凹部を、外側に張出したフランジ部を夫々有し、前記
凸壁が前記電気部品の端子を前記回路基板の半田ランド
部へ圧接することによって前記電気部品の端子と前記回
路基板の半田ランド部との間を加熱し、その間にある半
田を溶かし、半田付けをするか又はその半田付けを解除
する半田鏝部を備えたものにおいて、 前記半田鏝部の凸壁は外側面が先端から根元方向へ漸次
厚くなる様に傾斜していることを特長とするフラットパ
ックIC等の半田鏝部材。
[Claims for Utility Model Registration] A flat pack comprising a case containing a predetermined electric circuit element and a plurality of terminals protruding from the side of the case and connected to the electric circuit element inside the case. I
An electrical component such as C is used when soldering or unsoldering to a circuit board having a solder land portion corresponding to the terminal, and a predetermined width protruding corresponding to the terminal of the electrical component. It has a convex wall on its surface, and has a concave portion inside the convex wall into which the case of the electrical component is placed, and a flange portion projecting outward, and the convex wall connects the terminal of the electrical component to the circuit board. a soldering iron that heats the space between the terminal of the electrical component and the solder land of the circuit board by pressing against the solder land, melts the solder therebetween, and performs soldering or unsoldering; A soldering iron member for a flat pack IC or the like, characterized in that the convex wall of the soldering iron part is inclined so that the outer surface thereof becomes gradually thicker from the tip to the root.
JP11629783U 1983-07-26 1983-07-26 Soldering iron parts for flat pack ICs, etc. Pending JPS6025151U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11629783U JPS6025151U (en) 1983-07-26 1983-07-26 Soldering iron parts for flat pack ICs, etc.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11629783U JPS6025151U (en) 1983-07-26 1983-07-26 Soldering iron parts for flat pack ICs, etc.

Publications (1)

Publication Number Publication Date
JPS6025151U true JPS6025151U (en) 1985-02-20

Family

ID=30268139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11629783U Pending JPS6025151U (en) 1983-07-26 1983-07-26 Soldering iron parts for flat pack ICs, etc.

Country Status (1)

Country Link
JP (1) JPS6025151U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5561033A (en) * 1978-10-31 1980-05-08 Fujitsu Ltd Floating head
JPS56109158A (en) * 1980-01-16 1981-08-29 American Coldset Corp Thermoocompression connecting tool

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5561033A (en) * 1978-10-31 1980-05-08 Fujitsu Ltd Floating head
JPS56109158A (en) * 1980-01-16 1981-08-29 American Coldset Corp Thermoocompression connecting tool

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