JPS60246634A - Manufacture of elastic surface wave device - Google Patents
Manufacture of elastic surface wave deviceInfo
- Publication number
- JPS60246634A JPS60246634A JP59104247A JP10424784A JPS60246634A JP S60246634 A JPS60246634 A JP S60246634A JP 59104247 A JP59104247 A JP 59104247A JP 10424784 A JP10424784 A JP 10424784A JP S60246634 A JPS60246634 A JP S60246634A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- resist
- interdigital electrodes
- exposed
- wave device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は弾性表面波装置の製造方法に係り、とくに等間
隔の交叉指電極を精度よく形成するようにした弾性表面
波装置の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a surface acoustic wave device, and more particularly to a method of manufacturing a surface acoustic wave device in which equally spaced intersecting finger electrodes are formed with high precision.
(a) 産業上の利用分野
弾性表面波装置に用いられる弾性表面波素子は、弾性表
面波を伝播させる基板と、電気と弾性波のエネルギー変
換を行なわせるトランスジューサから構成され、弾性表
面波を駆動、検出するには種々の方法があるが、現在も
っとも多く用いられるのは、圧電基板上にすだれ状の交
叉指電極を形成したものであるが、弾性表面波装置の特
性の良否は交叉指電極を如何に精度良く形成するかに係
っている。(a) Industrial application field Surface acoustic wave elements used in surface acoustic wave devices consist of a substrate that propagates surface acoustic waves and a transducer that converts energy between electricity and acoustic waves, and drives surface acoustic waves. There are various methods for detection, but currently the most commonly used method is to form interdigitated interdigitated electrodes on a piezoelectric substrate, but the quality of the surface acoustic wave device's characteristics depends on the interdigitated electrode It depends on how accurately it is formed.
この圧電基板上に形成には交叉指電極に対応するガラス
マスクを用いてフォトエツチングにより行なわれている
が、交叉指電極幅および交叉指電極幅が1μm以下とな
る場合光の回折、干渉によってパターンと一致する交叉
指電極を形成することが困難なので、交叉指電極を簡易
且つ正確に形成される製造方法の改善が強く要望されて
いる。Formation on this piezoelectric substrate is carried out by photoetching using a glass mask corresponding to the interdigitated finger electrodes, but when the interdigital electrode width is less than 1 μm, the pattern is formed by light diffraction and interference. Since it is difficult to form interdigitated electrodes that match the above, there is a strong demand for an improved manufacturing method that allows the interdigitated electrodes to be formed easily and accurately.
(bl 従来の技術
第2図は、従来の弾性表面波装置の製造方法を説明する
ための(8)はガラスマスクの側面図、(b)はレジス
トの感光分布を示す側面図、(C)は現像エツチング後
の側面図である。(bl) Conventional technology Figure 2 is for explaining the conventional manufacturing method of a surface acoustic wave device, (8) is a side view of a glass mask, (b) is a side view showing the photosensitive distribution of resist, (C) is a side view after development and etching.
例えば水晶等からなる圧電基板1の上に、金属例えばア
ルミニューム等からなる電極部材2を蒸着し、電極部材
2の上に光により感光するレジスト3を塗布する。そし
てガラスマスク4には交叉指電極7に対応する等間隔(
A)のパターン5を形成する。そして第2図(b)に示
す如くガラスマスク4のパターン5側をレジスト3に密
着させた状態で、図示しないuvg光機からの光線6で
照射してレジスト3を感光すると、レジスト3は交叉指
電極7に対応するパターン5を除く全てが感光され、こ
の感光されたレジスト3と一体の圧電基板lを現像、エ
ツチングを行なうと、パターン5に対応する交叉指電極
7が形成されると考えられている。ところが、レジスト
3とガラスマスク4とのギャップにより光線6が回折し
て曲光線61となって感光してはならないパターン5に
対応するレジスト3を感光して第2図(clの如く正確
な交叉指電極7を形成するのは非常に困難であるという
問題点があった。An electrode member 2 made of a metal such as aluminum is deposited on a piezoelectric substrate 1 made of, for example, crystal, and a resist 3 that is sensitive to light is applied onto the electrode member 2. The glass mask 4 has equally spaced (
A) pattern 5 is formed. Then, with the pattern 5 side of the glass mask 4 in close contact with the resist 3 as shown in FIG. It is thought that all of the patterns except the pattern 5 corresponding to the finger electrodes 7 are exposed to light, and when the piezoelectric substrate 1 integrated with the exposed resist 3 is developed and etched, the intersecting finger electrodes 7 corresponding to the patterns 5 are formed. It is being However, due to the gap between the resist 3 and the glass mask 4, the light ray 6 is diffracted and becomes a curved light ray 61, which exposes the resist 3 corresponding to the pattern 5 that should not be exposed, resulting in accurate intersection as shown in Fig. 2 (cl). There was a problem in that it was very difficult to form the finger electrodes 7.
(cl 発明を解決しようとする問題点本発明は、上記
従来の問題点を解決するために、等間隔の交叉指電極に
対応するパターンの幅を交叉指電極の間隔より狭く形成
し、光の回折、干渉等の影響を考慮して精度の良好な交
叉指電極を簡易に製造可能とした新規なる弾性表面波装
置の製造方法を提供することを目的とするものである。(cl Problems to be Solved by the Invention) In order to solve the above-mentioned conventional problems, the present invention forms the width of the pattern corresponding to the equally spaced intersecting finger electrodes to be narrower than the interval between the intersecting finger electrodes. It is an object of the present invention to provide a novel method for manufacturing a surface acoustic wave device, which makes it possible to easily manufacture interdigitated electrodes with good accuracy while taking into account the effects of diffraction, interference, etc.
fdl 問題点を解決するための手段
その目的は、等間隔のくし歯状交叉指電極をフォトエツ
チングにより基板上に形成する弾性表面波装置の製造方
法を、前記等間隔の交叉指電極を形成するためのガラス
マスクに、前記電極指の間隔より小さくした光の透過し
ない電極指パターンを形成したことによって達成される
。fdl Means for Solving Problems The purpose is to provide a method for manufacturing a surface acoustic wave device in which equally spaced comb-shaped interdigitated electrodes are formed on a substrate by photoetching, and to form the equally spaced interdigitated finger electrodes. This is achieved by forming an electrode finger pattern on a glass mask that does not transmit light and is smaller than the spacing between the electrode fingers.
tel 作用
即ち本発明においては、従来のガラスマスクに形成する
パターンの幅を電極指間隔より小さく形成することによ
って、等間隔の交叉指電極を製造するようにしたもので
ある。In other words, in the present invention, the width of a pattern formed on a conventional glass mask is made smaller than the electrode finger spacing, thereby producing evenly spaced interdigitated finger electrodes.
ff) 実施例
以下図面を参照しながら本発明に係る弾性表面波装置の
製造方法の実施例について詳細に説明する。ff) Examples Examples of the method for manufacturing a surface acoustic wave device according to the present invention will be described in detail with reference to the drawings.
第1図は本発明に係る弾性表面波装置の製造方法の一実
施例を説明するための(81はガラスマスクの側面図、
(b)はレジストの感光分布を示す側面図。FIG. 1 is a diagram for explaining an embodiment of the method for manufacturing a surface acoustic wave device according to the present invention (81 is a side view of a glass mask;
(b) is a side view showing the photosensitive distribution of the resist.
(C)は現像エツチング後の側面図である。第1図にお
いて、この発明の弾性表面波装置の製造方法は第2図と
同様、圧電基板、電極部材、レジストガラスマスクなら
びにパターン等からなっているが、該パターンを改善し
た点に特徴を有する。したがってパターン以外の部分に
は第2図と同じ符号を付しており、ここではこれらの部
分の説明は省略するものとする。本発明を特徴づけるパ
ターン8は交叉指電極の幅より小さくしたものである。(C) is a side view after development and etching. In FIG. 1, the method for manufacturing a surface acoustic wave device of the present invention is composed of a piezoelectric substrate, an electrode member, a resist glass mask, a pattern, etc., as in FIG. 2, but is characterized in that the pattern is improved. . Therefore, parts other than the pattern are given the same reference numerals as in FIG. 2, and explanations of these parts will be omitted here. Pattern 8, which characterizes the present invention, has a width smaller than that of the interdigital electrodes.
即ちパターン8の幅(Ao)より交叉指電極の間隔(B
)をガラスマスク4上で大きく形成したものである。In other words, the interval between the interdigital electrodes (B
) is formed in a large size on the glass mask 4.
かくして第1図(blに示す如くガラスマスク4のパタ
ーン8側をレジスト3に密着させた状態で、図示しない
UVn光機からの光線6で照射してレジスト3を感光す
ると、回折せずに直接レジスト3に到達する光線6に比
べ光線6の一部である曲光線61は非常に弱く、レジス
ト3は斜線の如く感光し、レジスト3は交叉指電極7に
対応するパターン8を除く全てレジスト3が感光され、
この感光されたレジスト3と一体の圧電基板]を現像。Thus, when the pattern 8 side of the glass mask 4 is brought into close contact with the resist 3 as shown in FIG. The curved light ray 61, which is a part of the light ray 6, is very weak compared to the light ray 6 that reaches the resist 3, and the resist 3 is exposed to light as indicated by diagonal lines. is exposed to light,
The piezoelectric substrate integrated with the exposed resist 3 is developed.
エツチングを行なうと、第1図(clに示すような交叉
指電極7が形成される。When etching is performed, interdigitated electrodes 7 as shown in FIG. 1 (cl) are formed.
(3)発明の効果
以上の説明から明らかなように本発明に係る弾性表面波
装置の製造方法によれば、光の回折、干渉等の影響を考
慮して精度の良好な交叉指電極を簡易に製造することを
可能にするとともに、弾性表面波装置の品質の向上に寄
与するところが大である。(3) Effects of the invention As is clear from the above explanation, according to the method for manufacturing a surface acoustic wave device according to the present invention, cross-finger electrodes with good accuracy can be easily manufactured by taking into consideration the effects of light diffraction, interference, etc. This greatly contributes to improving the quality of surface acoustic wave devices.
【図面の簡単な説明】
第1図は本発明に係る弾性表面波装置の製造方法の−・
実施例を説明するためのfalはガラスマスクの側面図
、(b)は感光現象の側面図、(C)は現像エツチング
後の側面図、
第2図は、従来の弾性表面波装置の製造方法を説明する
ための+a)はガラスマスクの側面図、(b)はレジス
トの感光分布を示す側面図、(C)は現像エノヂング後
の側面図である。
図において、1は圧電基板、2は電極部材、3はl/シ
スト、4はガラスマスク、5.8はパターン、6は光線
、7は交叉指電極、61は曲光線をそれぞれ示す。
第1図
(Q)
・第2図
(Q)[Brief Description of the Drawings] Fig. 1 shows a method for manufacturing a surface acoustic wave device according to the present invention.
For explaining the examples, fal is a side view of a glass mask, (b) is a side view of the photosensitive phenomenon, (C) is a side view after development and etching, and Figure 2 is a conventional method for manufacturing a surface acoustic wave device. For explaining, +a) is a side view of the glass mask, (b) is a side view showing the photosensitive distribution of the resist, and (C) is a side view after development and etching. In the figure, 1 is a piezoelectric substrate, 2 is an electrode member, 3 is a l/cyst, 4 is a glass mask, 5.8 is a pattern, 6 is a light beam, 7 is a crossed finger electrode, and 61 is a curved light line. Figure 1 (Q) ・Figure 2 (Q)
Claims (1)
基板上に形成する弾性表面波装置の製造方法を、前記等
間隔の交叉指電極を形成するためのガラスマスクに、前
記電極指の間隔より小さくした光の透過しない電極指パ
ターンを形成したことを特徴とする弾性表面波装置の製
造方法。A method for manufacturing a surface acoustic wave device in which equally spaced comb-shaped interdigitated finger electrodes are formed on a substrate by photoetching is provided. 1. A method of manufacturing a surface acoustic wave device, characterized in that an electrode finger pattern is formed through which light does not pass through.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59104247A JPS60246634A (en) | 1984-05-22 | 1984-05-22 | Manufacture of elastic surface wave device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59104247A JPS60246634A (en) | 1984-05-22 | 1984-05-22 | Manufacture of elastic surface wave device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60246634A true JPS60246634A (en) | 1985-12-06 |
Family
ID=14375607
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59104247A Pending JPS60246634A (en) | 1984-05-22 | 1984-05-22 | Manufacture of elastic surface wave device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60246634A (en) |
-
1984
- 1984-05-22 JP JP59104247A patent/JPS60246634A/en active Pending
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