JPS6024266A - 自動半田付け方法及び装置 - Google Patents

自動半田付け方法及び装置

Info

Publication number
JPS6024266A
JPS6024266A JP13313183A JP13313183A JPS6024266A JP S6024266 A JPS6024266 A JP S6024266A JP 13313183 A JP13313183 A JP 13313183A JP 13313183 A JP13313183 A JP 13313183A JP S6024266 A JPS6024266 A JP S6024266A
Authority
JP
Japan
Prior art keywords
printed circuit
soldering
circuit board
carrier
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13313183A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0361355B2 (enrdf_load_stackoverflow
Inventor
Hachiji Yokota
八治 横田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YOKOTA KIKAI KK
Original Assignee
YOKOTA KIKAI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YOKOTA KIKAI KK filed Critical YOKOTA KIKAI KK
Priority to JP13313183A priority Critical patent/JPS6024266A/ja
Publication of JPS6024266A publication Critical patent/JPS6024266A/ja
Publication of JPH0361355B2 publication Critical patent/JPH0361355B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0669—Solder baths with dipping means
    • B23K3/0676—Conveyors therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
JP13313183A 1983-07-21 1983-07-21 自動半田付け方法及び装置 Granted JPS6024266A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13313183A JPS6024266A (ja) 1983-07-21 1983-07-21 自動半田付け方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13313183A JPS6024266A (ja) 1983-07-21 1983-07-21 自動半田付け方法及び装置

Publications (2)

Publication Number Publication Date
JPS6024266A true JPS6024266A (ja) 1985-02-06
JPH0361355B2 JPH0361355B2 (enrdf_load_stackoverflow) 1991-09-19

Family

ID=15097498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13313183A Granted JPS6024266A (ja) 1983-07-21 1983-07-21 自動半田付け方法及び装置

Country Status (1)

Country Link
JP (1) JPS6024266A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0335108U (enrdf_load_stackoverflow) * 1989-08-18 1991-04-05
JPH03116990U (enrdf_load_stackoverflow) * 1990-03-15 1991-12-03
CN113814515A (zh) * 2021-10-14 2021-12-21 南通东野光电科技有限公司 一种pcb板的焊接设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5236540A (en) * 1975-09-19 1977-03-19 Hitachi Ltd Method and device for soldering
JPS5492545A (en) * 1977-12-29 1979-07-21 Tamura Seisakusho Kk Automatic soldering apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5236540A (en) * 1975-09-19 1977-03-19 Hitachi Ltd Method and device for soldering
JPS5492545A (en) * 1977-12-29 1979-07-21 Tamura Seisakusho Kk Automatic soldering apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0335108U (enrdf_load_stackoverflow) * 1989-08-18 1991-04-05
JPH03116990U (enrdf_load_stackoverflow) * 1990-03-15 1991-12-03
CN113814515A (zh) * 2021-10-14 2021-12-21 南通东野光电科技有限公司 一种pcb板的焊接设备

Also Published As

Publication number Publication date
JPH0361355B2 (enrdf_load_stackoverflow) 1991-09-19

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