JPS60242629A - Wire-bonding device - Google Patents

Abstract

PURPOSE:To avoid poor bonding or improper contact bonding by a method wherein wire fed out of a feed opening of a wire pressing tool is subjected to a mechanical or ultrasonic vibration. CONSTITUTION:A wedge 4 is subjected to vibration in a process wherein wire is fed from a feed opening and through a calmp 6. The wire ocassinally arrested at the angle of the wedge 4 may be easily released due to vibration, which ensures a regular supply of wire through the champ 6. In the conventional method, the wedge 4 is to experience two ultrasonic vibrations in a single bonding process. In this device, a third shock of vibration, which may be of mechanical nature, adds to the wire feeding process. Consequently, accidental lack of bonding and geometrical impropriety due to shortage in the quantity of wire supplied are greatly reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to ultrasonic wire bonding, and is primarily directed to wire bonding in which electrodes of a semiconductor device are assembled by ultrasonic bonding using wires.

Referring to Fig. 1, the ultrasonic wire bonding method uses a wedge (a wedge-shaped rod-shaped body) to hold down the wire during bonding, and a heel part (heel) 5 serving as the holding part.
This is a wire bonding method that is performed by applying ultrasonic vibration to the wedge while pressing a wire (for example, A) against an aluminum electrode.
Bonding is performed in the order shown in fl. (a) shows a state in which the clamper 6 is closed and the wire 3 is supplied, (bl
In , the wire 3 is pressed with the heel 5 of the wedge 4 and bonded to the electrode 2 of the chip 1 by applying ultrasonic vibration. state, (d+
(e) is a state in which the wire 3 is pressed again with the heat/I15 of the wedge 4 and bonded to the lead 7 by applying ultrasonic vibration, and (e) is a state in which the clamper 6 is closed and the wire 3 is cut by pulling the clamper 6 backward. Release state, (f)
1 shows the wedge 4 and clamper 6 in a raised state. The state shown in (f) shifts to the state shown in (a), and these series of operations are repeated.

By the way, conventionally, the wire 3 shown in FIG. 1(a)
During the feeding operation, the tip of the wire 3 hits the corner of the heel 50 of the wedge 4 or the corner a of the wire feed hole, as shown in FIG. 2, and the wire may not be fed correctly. This often occurs when a bend C is formed at the tip of the wire 3, resulting in failure of not bonding or crimping failure.

Originally, it is desirable to feed the wire at a more horizontal angle by utilizing the play within the wire feed hole. That is,
When the wedge descends to hold down the wire supplied by the clamp 6, a phenomenon occurs in which the wire in the wire supply hole slightly rises (returns) (at this time, since the clamp is open, the tip of the wire 3 is electrode 2
), the area pressed by the heel 5 of the wedge 4 may be insufficient, but the more horizontal the wire is, the less this tendency will occur. This is because the length of the tail is shorter as the wire is oriented more horizontally.

However, the more the wire is fed in a horizontal (laying down) direction, the more likely the tip of the wire will get caught at corner a or b. Therefore, there was a trade-off between eliminating snags and making the wire return.

Therefore, it is an object of the present invention to prevent such wires from getting caught.
In the bonding device, mechanical vibration or ultrasonic vibration is applied to the wire when the wire pressing tool (1) moves from the first bonding point to the second bonding point. If vibration is applied to the wedge when feeding the wire through the feed hole with a clamp, the tip of the wire may temporarily move to the corner a.
, b, it will come off immediately due to vibration, and the clamp will feed the wire correctly.

Conventionally, ultrasonic vibrations were applied to the wedge twice in one wire bonding process.
(applied during the crimping process) can be increased by one and also by adding ultrasonic vibration when feeding the wire [during the operation shown in Fig. 1 (a) K]. However, this can be applied by It may be just mechanical vibration.

As a result, accidents such as non-bonding or defective crimped shapes due to insufficient wire supply have been extremely reduced. Additionally, the wire can be fed in a more horizontal direction by maximizing the play in the wire feed hole, and as a result, the length of the wire tail is 20 μm shorter than before. , fewer wiring short-circuit accidents.

[Brief explanation of the drawing]

FIGS. 1(a) to (fl are cross-sectional views showing each operation in one wire bonding operation at 71j11, and FIG. 2 is a cross-sectional view showing conventional problems. l...Chip% 2...・Electrode, 3...Wire, 4
... Wedge, 5... Heel, 6... Clamper, 7... Lead, a + k)... Corner, C...
Bent lead. Figure 1 Figure 1/11 Figure 1 (e) Figure 2

Claims (1)

[Claims] 1. In a wire bonding device that supplies a wire through a wire supply hole provided in a wire pressing tool, the wire is subjected to mechanical vibration or vibration when the wire pressing tool moves from a first bonding point to a second bonding point. A wire characterized by supplying sonic vibrations.
bonding equipment.