JPS60241279A - Optoelectronic coupling element and method of producing same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention has a light-emitting and light-receiving semiconductor element, and these pixel elements are separated from each other, mounted on a support, and covered with a light-transmitting plastic. This invention relates to an oxidation electronic coupling device having a structure.

Prior art oscido-electronic coupling elements transmit electrical signals via optical signals from a transmitter circuit to a receiver circuit that is completely separate and electrically isolated from this circuit. used for. Oside electronic coupling-X elements are used for voltage isolation and increased interference safety, for example in telephone connections and data processing in private branch exchanges. The coupling elements are also used for voltage isolation of control and load circuits in input/output electronics when driving triacs and thyristors.

In the known method for producing oscido-electronic coupling elements, the transmitting and receiving pixel semiconductor elements are fixed in one plane on adjacent portions at a limited distance of a continuous structured contact strip. Ru. A plastic reflective object is then placed over the two said elements, and the gap between the pixel elements and the reflective object is filled with a light-transmissive glasstic that also surrounds the contact terminals. The reflective object and the light transmissive plastic are then embedded within the light transmissive plastic which together form the outer container. Finally, the web connecting the contact strips is separated.

The case-side semiconductor elements of the aforementioned type of coupling element are composed of, for example, a light-emitting diode and a phototransistor. It is also possible to use photo field effect transistors, photodiodes or other photosensitive semiconductor elements or photosensitive integrated circuits instead of phototransistors.

The known oscidoelectronic coupling elements have reasonably high dielectric voltages, but are not suitable for miniaturization in hybrid-rad technology, especially for film circuits, since the package dimensions are relatively small due to their construction. It's because it's big.

Problem to be Solved by the Invention The invention is therefore based on the problem of providing an oscido-electronic coupling element having smaller dimensions and suitable for use in hybrid P-connection circuits, and a method for its production. .

The above-mentioned problem is an oscilloscope electronic device having a structure in which a light-emitting and light-receiving semiconductor element is provided, and these pixel elements are separated from each other on a support and are covered with a light-transmitting glass. In the case of a coupling element, the solution according to the invention is that a light-transparent glass forms the container of the oscidoelectronic coupling element and is coated with a thin layer of a light-impermeable reflective material.

The essence of the invention is therefore that the container is actually made only of light-transparent plastic and that the same plastic provides the necessary mechanical stability for the container, while the reflective layer must be as thin as possible and practically It is of no use for the mechanical stability of the container. The reflective layer has a thickness of f such that the thickness of the layer can sufficiently satisfy the reflective function of the layer.
The bill is as thin as possible.

According to another advantageous embodiment of the invention, it is provided that, in order to obtain a high coupling efficiency, the miniaturized plastic container is coated by a dipping method with a light-reflecting plastic layer consisting of a soft epoxy resin. ing.

The bidirectional conductor elements are preferably located in one plane.

According to a further advantageous embodiment, the entire surface of the plastic container is coated with a reflective layer, which light-impermeable reflective layer is made of an infrared-reflecting epoxy resin or an epoxy molding compound, and is made of an infrared-reflecting epoxy resin or an epoxy molding compound, and is made of an infrared-reflecting epoxy resin or an epoxy molding compound. It has a layer thickness of 3 times and can perform total internal reflection.

The light-transparent silastic preferably consists of a transparent epoxy resin, the size of the encapsulating plastic corresponding to a standardized cubic miniature container of the type 5OT143 or TO143 or S06.

The optoelectronic coupling element according to the invention is produced by coating a light-transparent plastic container with a light-impermeable layer by dipping or molding.

A significant advantage of the coupling element is that the optically transparent plastic (
(together with a very thin reflective coating of about 0.3+ nm) to form the container, so that a separate outer container of light-transparent plastic is omitted. This allows the dimensions of the container to be significantly reduced.

The oztoelectronic device according to the invention is suitable for numerous uses in vibratory switch circuits for voltage isolation and interference-safe isolation. Furthermore, if the container dimensions are selected to match the dimensions of standardized miniature containers, for example of the type SOT l 43, the advantage arises that the components can be processed with commercially available built-in automatic equipment.

The present invention will now be explained by way of embodiments illustrated in the drawings.

Embodiments For the contact of the transmitting semiconductor element (1) and the receiving semiconductor element (2), a contact elongate preferably has a continuous ζ-nd shape and in the manufacturing process has a transverse web, an outer side piece and a central web. After casting the transmitting element (1) and receiving element (2) in the piece with light-transparent plastic (4), the transverse web,
The outer side pieces and the central web are processed by a cutting machine so that they are separated.

The light-transparent glass (4) consists of transparent epoxy resin in the embodiment according to FIG.

The plastic (4) containing the transmitting semiconductor element (1) and the receiving semiconductor element (2) is coated with a light-impervious reflective layer (5) by dipping or molding. The cubic miniature container thus produced has the dimensions of the standard type 5OT143, ie length x width x height -2.9 x 1.3 x l.

The light-opaque reflective layer (5) is made of, for example, a soft epoxy resin mixed with titanium oxide. A similar reflector can also be produced by a mixture of magnesium oxide and a transparent glass material, such as polycarbonate.

According to FIG. 1, the connecting legs 3a, 3b and aa, ab necessary for the electrical connection of the transmitting semiconductor component (1) and the receiving semiconductor component (2) are created by bending.

The reference numbers designated in FIG. 2 are the same as in FIG. According to FIG. 2, the light emitted from the transmitting semiconductor element (1) exits from the entire surface of the plastic (4).

As can be seen in Figure 3, by dipping the plastic (4) and coating it with a light reflective material (5), total internal reflection takes place inside the plastic (4), which typically results in 100% coupling. Gain efficiency. The reference numerals in FIG. 3 are also similar to those in FIGS. 1 and 2.

The transmitting element (1) and receiving element (
2) the insulation voltage between the two is at least 500V;

[Brief explanation of the drawing]

1 is a perspective view of an optoelectronic coupling element according to the invention, FIG. 2 is a sectional view of the coupling element without a reflective layer, and FIG. 5 is a sectional view of the coupling element with a reflective layer. DESCRIPTION OF SYMBOLS 1... Transmitting semiconductor element, 2... Receiving semiconductor element, C... Light-transmitting plastic, 5... Reflective layer.

Claims (1)

[Scope of Claims] 1. An optical system having a structure that has both a light-emitting and a light-receiving conductor element, these pixel elements are separated from each other, are mounted on a support, and are covered with a light-transmitting plastic. An oscido-electronic coupling element, characterized in that a light-transparent plastic forms the container of the coupling element and is coated with a thin layer of a light-impermeable reflective material. -2. The element according to claim 1, wherein the amphibodiconductive element exists on one plane. 3. The device according to claim 1 or 2, wherein the entire surface of the plastic container is covered with a reflective layer. The device according to any one of claims 1 to 3, wherein the size of the encasing plastic corresponds to a standardized cubic miniature container of type 5OT143, type TO143, or type SO6. 5. The device according to any one of claims 1 to 4, wherein the light-transmitting plastic is made of a transparent epoxy resin. 6. The device according to any one of claims 1 to 5, wherein the light-opaque thin layer is made of a transparent infrared reflective epoxy resin or epoxy molding material. 7. Claims 1 to 6 in which the light-opaque thin layer has a layer thickness of about 0.3+nm and causes total internal reflection.
The device according to any one of the preceding items. 8. An oscido-electronic coupling element having a structure in which the pixel elements are separated from each other, are mounted on a support, and are covered with a light-transmitting plastic. A method for producing an oscidoelectronic coupling element, characterized in that during production, a container made of a light-transparent plastic is coated with a light-impermeable layer by a dipping method or a molding method.