JPS60239254A - Manufacture of thick-film type thermosensitive recording head - Google Patents

Abstract

PURPOSE:To achieve a better heat transmission efficiency by removing a gas component in a heating resistor layer selectively therefrom in the area corresponding to a part having an electrode conductor layer existing on the ground after the formation of the heating resistor layer. CONSTITUTION:A conductive paste is used to form an electrode 32 about 4mum in the film thickness on an alumina substrate 31 by screen printing and baking. Then, a resistance paste is used to form a heating resistor layer 33 about 12mum in the film thickness crossing over the electrode 32 by screen printing and baking and then, a resist pattern 36 which has such a window as exposing the heating resistor layer 33 alone in the area making an protruded part 34 with the electrode 32 existing on the lower layer is formed by photolithography. Then, the work is emmersed into a fluoric acid solution for about 20sec to etch away the glass component alone from the heating resistor layer 33 exposed into a window 35 and baked at 900 deg.C again.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a thick film type heat-sensitive recording spatula P used in heat-sensitive recording devices such as printers and facsimiles.

[Prior art]

The heat-sensitive recording method, in which a heat-sensitive recording spatula P, which is made up of heat-generating elements arranged side by side, is brought into contact with a heat-sensitive recording medium, records are made in recent years.
This is a recording method that is rapidly attracting attention.

There are three types of thermal recording heads used in this thermal recording method: thick film type, thin film type, and semiconductor type. this house,
The thick-film type has a heating element formed by a thick-film pattern formed by screen printing and firing, and is superior in that it is easy to manufacture and can be mass-produced, and it is easy to manufacture large heads. The two types are also far superior and widely used. In particular, it is said that a thick film type thermal recording head is more advantageous than a thin film type in a transfer type thermal recording system using an ink donor sheet. As shown in Figure 1, a thick-film type thermal recording head has a structure in which an electrode 2 is disposed on a substrate 1 and a heat-generating resistor 3 is placed on top of the electrode 2. As shown in FIG. 2, the recording head has a structure of a heating resistor 12 on a substrate 11 and an electrode 13 on top of it, so the thick film type has a convex heating part, whereas the thin film type has a concave heating part. This is because compared to molds, it is easier to apply pressure and has better thermal efficiency.

However, in the thick film type, the A-A cross section in Figure 1 is
As shown in the figure, a heating resistor 3 is provided on the electrode 2 in a shape that crosses the electrode 2, and the thickness of the electrode itself is 4.
Since the heating resistor itself has a convex shape,
Since most of the heat generating area is recessed, there is a disadvantage that heat transfer is not efficient.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide a thick film type thermal recording head with good heat transfer efficiency.

[Structure of the invention]

In order to achieve the above object, the present invention involves forming an electrode conductor layer and a heating resistor layer in sequence on a substrate, and then forming an electrode conductor layer on the base when producing a thermal recording head by a thick film method. By selectively removing only the glass component from the heating resistor layer in a region corresponding to a certain part, the height of the heating resistor layer in the region can be lowered and unevenness on the surface of the heating resistor layer can be eliminated. This is what I did.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for moving a thick film type thermal recording head according to an embodiment of the present invention will be described in detail with reference to the drawings.

First, as shown in FIG. 4, an electrode 32 having a thickness of about 4 μm is formed on an alumina substrate 31 by screen printing and baking using a conductive paste using a conventional method.

Next, screen printing and baking (900°C) were carried out using a resistance paste manufactured by Tanaka Yatsusei Co., Ltd., labeled as RZ-GZ, as shown in Fig. 5, to give a film thickness of approximately 12μ.
m heating resistor layers 33 are formed across the electrode 32.

Thereafter, as shown in FIG. 6, a resist pattern 36 having a window 35 is formed by photolithography so that only the region of the heating resistor layer 33 where the electrode 32 exists in the lower layer and becomes the raised part 34 is exposed. formed by

Then, it is immersed in a fluoronitric acid solution for about 20 seconds to remove only the glass component from the heating resistor layer 33 exposed in the window 35 by using the resist/mother turn 36 as a mask, and then re-baked at 900°C. Alternatively, the heat generating resistor layer 33 in this portion is made to have a thickness of about 9 μm.

Finally, as shown in FIG. 8, an overglass 37 is formed.

In the thick-film type heat-sensitive recording layer formed in this way, there are almost no irregularities on the surface of the heating resistor layer 33.
By efficiently pressing the recording paper overlaid on the ink donor film and applying heat, it is possible to perform correct recording according to the image information.

Note that when forming a resist pattern by photolithography, it is desirable to form a window of a slightly modest size in the width direction of the heating resistor. This is due to the fact that the surrounding glass components are slightly etched due to the coating process and the coating of the molding liquid, and that sagging occurs at the edges during firing. This is because the etching area (area where the film thickness is reduced) becomes larger.Furthermore, in order to avoid etching and damage to the underlying layer, it is desirable that the window be smaller.

By the way, it is necessary to remove the glass component by etching. That is, before etching, as shown in the ^th scratch, the glass component G is interposed between the chains R of ruthenium oxide (Ru02), which is the main component, and they are in a stable state in close contact with each other, and the insulating component The sheet resistance decreases due to the disappearance of certain glass components. Therefore, since this low resistance portion plays the role of an auxiliary electrode, the current path also becomes more uniform.

[Effects of the Invention] As described above, according to the method for manufacturing a thick film type thermal recording head of the present invention, after forming an electrode conductor layer and a heat generating resistor layer on a substrate in sequence, an electrode is formed on the base layer. By selectively removing only the glass component from the heating resistor layer in the region corresponding to the portion where the conductor layer is present, the protrusions of the heating resistor layer in the region are removed, and the surface of the heating resistor layer is removed. Since it is coated to eliminate unevenness, it is possible to form dents in thick film type thermal recording with good thermal efficiency.

[Brief explanation of drawings]

Fig. 1 is a structural explanatory diagram of a thick film type thermal recording head, Fig. 2 is a structural explanatory diagram of a thin film type thermal recording head, Fig. 3 is a sectional view taken along line AA in Fig. 1, and Figs. 4 to 8. FIG. 3 is an explanatory diagram showing compositional changes of a heating resistor layer. 1...base! , 2... Electrode, 3... Heating resistor, 1
DESCRIPTION OF SYMBOLS 1... Substrate, 12... Heat generation, resistor, 13... Electrode, 31... Alumina substrate, 32... Electrode, 33...
...Heating resistor layer, 34... Protuberance, 35... Window,
36...Resist yarn, 37...Over glass, R...Ruthenium oxide chain, G...Glass component chain.

Claims (1)

[Claims] A method for manufacturing a thick-film thermal recording head in which an electrode conductor layer and a heat-generating resistor layer are formed on a substrate by a thick-film method, comprising: after forming a heat-generating resistor layer, forming an underlying electrode conductor layer; By selectively removing only the glass component in the heating resistor layer in the region corresponding to the portion where the heating resistor is present, the height of the heating resistor layer in the region is reduced, and the height of the heating resistor layer in the region is reduced. A method for manufacturing a thick film type thermal recording head, comprising a step of eliminating unevenness on the surface of the body layer.