JPS60233896A - Shielding structure of package module - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a shielding structure for a package module that generates radiated noise, such as a power supply package, among packages mounted in an electronic computer or the like.

Conventionally, the power supply for electronic computers has been configured as a power supply unit in a separate space. However, in recent years, when high-density packaging is required,
Providing a dedicated power supply space is counterproductive, and this further reduces packaging density, especially in displays and the like. Therefore, in recent years, power supplies have become increasingly packaged and are often mounted together with logic packages and the like.

However, with this method, the noise emitted from the power supply package may have an adverse effect on other packages or may be emitted to the outside of the device, affecting other things as well. For this reason, the power supply package is moved to another location or a shield box is installed, which causes a decrease in commonality with other packages and a decrease in maintainability. Further, even if a shield cover is required later, it is difficult to change it and it becomes very expensive.

A conventional example is shown in FIG. 1 and FIG. 2. In FIG. 1, a shield cover 5 is directly fixed to a shield base 4, and a power supply package 1 is mounted therein. With this method, the size of the power supply package 1 does not correspond to the package guide 3 due to the installation space of the shield cover 5, and the other packages 7 lack commonality. Furthermore, the shield cover 5 must be fixed with screws, which reduces work efficiency. Also, in the conventional example shown in FIG. 2, the shield cover 5 is directly fixed to the power supply package 1, which reduces the packaging density within the power supply package.
As shown in FIG. 1, the result is also contrary to high-density packaging. Furthermore, when the shield base is attached, it protrudes into the adjacent package space, which has a negative impact on mounting. As mentioned above, there are various problems as seen in the conventional example.

The purpose of this invention is to eliminate the conventional problems as described above, and to make it possible to easily attach the shield cover or remove it when unnecessary, without affecting the device side. It is.

In order to achieve this purpose, the present invention fixes a package to a shield base having a shape corresponding to the package, and allows the package to be mounted by sliding it on a package guide, and also utilizes the sliding part of the package itself. A shield cover having a structure that can be fitted onto the package is provided, and the shield cover can be inserted into the package to form a shield structure.

The present invention will be explained in detail below. Figure 4.

FIG. 5 shows an embodiment according to the present invention. A power supply package 1 to be shielded is fixed to a shield base 4 with screws 10. At this time, the size of the shield base 4 is equal to the size of the power supply package 1, and the shield base 4 is
Similar to the power supply package 1, it is possible to slide through the groove 11 provided in the package guide 3.

Further, the shield cover 5 can be inserted into the slide area 7 of the power supply package 1 through a slide groove 6 provided in the shield cover 5 itself. Thereby, the back and front sides of the power supply package 1 can be shielded and closed by the shield base 4 and the shield cover 5, respectively. or,
Even when mounted on the nozzle cage guide 3, it can be mounted in units of backges without coming into contact with the adjacent logical nozzle cage 2.

Further, as shown in FIG. 5, a shield cover 5 is made of aluminum or the like with good heat transfer and dissipation on a heat sink 8 that cools a heat generating element 9 provided on the power source cage.
By connecting the diagonal surfaces of the heat sink 8 and fixing them with screws 12, the cover itself can be used as a cooling heat sink.

With the configuration described above, in the present invention, since the package can be slid on the package guide in the same way as a package, there is no deterioration in maintainability during attachment and detachment. The shield case is easy to install and remove, and there is no impact on the surrounding area even when a shield is required or unnecessary. Furthermore, since the shield cover is inserted in a sliding manner using the sliding area of the package, it can be effectively shielded without damaging the internal mounting of the package. Further, by using the shield cover as a heat transfer body, it has an effect such that it can also serve as a cooling heat sink.

[Brief explanation of drawings]

1 and 2 are perspective views showing a conventional shield structure,
Figure 3 is a perspective view without a shield structure;
This figure is a perspective view of one embodiment of the shield structure of the gun cage module of the present invention, and FIG. 5 is an exploded perspective view of the shield structure of the package module shown in FIG. 4. 1...Power pack-ji, 2...Logic nozatsu cage,
3...Package guide, 4...Shield base,
5...Shield cover, 6...Slide groove, 7.
...Slide area, 8...Heat sink, 9...
Heating element, 10...Screw, 11...Package guide groove.

Claims (1)

[Claims] 1. When a package is mounted by sliding on a prepared package guide, if a cover is provided on the package for some purpose, a shield base that serves both to secure the package and slide on the package guide, and a sliding part of the package are used. A shield structure for a package module characterized by comprising a shield cover that utilizes and has a structure for attaching the module.