JPS5839055U - electronic components - Google Patents

electronic components

Info

Publication number
JPS5839055U
JPS5839055U JP13259481U JP13259481U JPS5839055U JP S5839055 U JPS5839055 U JP S5839055U JP 13259481 U JP13259481 U JP 13259481U JP 13259481 U JP13259481 U JP 13259481U JP S5839055 U JPS5839055 U JP S5839055U
Authority
JP
Japan
Prior art keywords
heat
casing
electronic components
generating component
heat generating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13259481U
Other languages
Japanese (ja)
Inventor
村瀬 直昭
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP13259481U priority Critical patent/JPS5839055U/en
Publication of JPS5839055U publication Critical patent/JPS5839055U/en
Pending legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図ないし第5図は電子部品におけるICやLSIの
実装状態の従来例にかかり、第1図、第2図、第3図、
および第5図はいずれも夫々が従来の実施例を示す断面
図、第4図は第3図のAA′線に沿う断面図、第6図は
この考案の1実施例を示す断面図、第7図はこの考案の
経緯を説明するために発熱部品の放熱面と筐体内面との
間隔(Gap)と放熱面温度と時間とを示す線図、第8
図および第9図はいずれも夫々がこの考案の別の実施例
を示す断面図である。 1・・・発熱部品(IC,LSI等)、1a・・・発熱
部品の放熱面、2・・・筐体、3・・・回路基板、d・
・・放熱面と筐体内面との間隔(Gap)。
Figures 1 to 5 show conventional examples of mounting states of ICs and LSIs in electronic components, and Figures 1, 2, 3,
5 and 5 are sectional views showing conventional embodiments, FIG. 4 is a sectional view taken along line AA' in FIG. 3, and FIG. 6 is a sectional view showing one embodiment of this invention. Figure 7 is a diagram showing the gap between the heat-radiating surface of the heat-generating component and the inner surface of the housing, the temperature of the heat-radiating surface, and time, in order to explain the background of this invention.
Both FIG. 9 and FIG. 9 are sectional views showing other embodiments of this invention. DESCRIPTION OF SYMBOLS 1... Heat-generating component (IC, LSI, etc.), 1a... Heat dissipation surface of heat-generating component, 2... Housing, 3... Circuit board, d.
...Gap between the heat dissipation surface and the inner surface of the casing.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 回路基板に発熱部品を配設しこれを筐体に実装し前記発
熱部品の発熱を筐体によって放散させる電子部品におい
て、発熱部品の放熱面とこれに対向する筐体の内面とを
非接触にて0.7mm以下の間隔に設けたことを特徴と
する電子部品。
In an electronic component in which a heat generating component is arranged on a circuit board and mounted on a casing, and the heat generated by the heat generating component is dissipated by the casing, the heat dissipating surface of the heat generating component and the inner surface of the casing facing the heat dissipating surface are made non-contact. An electronic component characterized in that the parts are arranged at intervals of 0.7 mm or less.
JP13259481U 1981-09-08 1981-09-08 electronic components Pending JPS5839055U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13259481U JPS5839055U (en) 1981-09-08 1981-09-08 electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13259481U JPS5839055U (en) 1981-09-08 1981-09-08 electronic components

Publications (1)

Publication Number Publication Date
JPS5839055U true JPS5839055U (en) 1983-03-14

Family

ID=29926121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13259481U Pending JPS5839055U (en) 1981-09-08 1981-09-08 electronic components

Country Status (1)

Country Link
JP (1) JPS5839055U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH067010A (en) * 1993-02-04 1994-01-18 Iseki & Co Ltd Seedling planter
JPH07155029A (en) * 1994-06-03 1995-06-20 Yanmar Agricult Equip Co Ltd Planting unit of rice transplanter

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH067010A (en) * 1993-02-04 1994-01-18 Iseki & Co Ltd Seedling planter
JPH07155029A (en) * 1994-06-03 1995-06-20 Yanmar Agricult Equip Co Ltd Planting unit of rice transplanter

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