JPH10255457A - Optical disk device and information processor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To unify the thickness of heat transmitting spacers against plural ICs having different package heights, and to prevent an erroneous mounting during device assembly, by providing contractions, which are equal to the difference in the package heights between ICs, above ICs having lower package height, so that the distance between IC packages and a cover becomes constant regardless of the IC's heights. SOLUTION: The ICs, which become heat sources, are arranged in an external as much as possible in order to reduce the heat generated inside the device and the heat generated by the ICs placed outside a circuit substrate 2 is necessary to be radiated to the outside. In this case, the heat generated is guided to a top cover 1 through heat transfer spacers 3a, 3b and 3c and radiated into external air. Generally speaking, the package heights of ICs 2a, 2b and 2c on the substrate 2 are different and squeeze amounts 1h and 2h of the squeezes 1a and 1b of the top cover 1 are made as the difference between 2a and 2c of the IC and the difference between 2b and 2c. Thus, the distance to the cover 1 is made constant regardless of the IC package heights.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an IC on a circuit board.
The present invention relates to a configuration for preventing a rise in temperature in an information processing apparatus due to heat generation of the information processing apparatus.

[0002]

2. Description of the Related Art An optical disk device is an example of an information processing device. As a conventional example, Japanese Utility Model Application Laid-open No. Sho 61-45762.
As described in Japanese Patent Application Laid-Open No. H10-260, there is known a configuration in which a double door is provided at a disk entrance of a device in order to prevent dust from entering. In other words, the door closes the disk slot when the disk is mounted and when the disk is not mounted, thereby preventing dust from entering.

[0003]

However, in the above conventional example, since the inside of the apparatus is shielded from the outside and is sealed, the ingress of dust can be prevented. . In recent years, the heat generated by the optical disk of the device has been increased with the high-speed rotation (high-speed data transfer technology) of the device.

As a means for releasing heat to the outside of the device, there is a method in which a heat transfer spacer (a heat-radiating rubber sheet such as a silicone elastomer) is inserted between a cover and an IC package, and the cover emits heat from the IC instead of a heat-radiating fin. However, generally, there are a plurality of ICs that need to dissipate heat, and the package height of the ICs is often different.
Therefore, the thickness of the heat transfer spacer between the cover and the IC must be adjusted to the height of the IC package for each IC, and a large number of heat transfer spacers having different thicknesses must be used. In addition, there are problems such as a wrong thickness of the material and a wrong part during assembly.

An object of the present invention is to make it possible to unify the thickness of a heat transfer spacer sandwiched irrespective of the package height, even if there are a plurality of ICs having different package heights,
The object is to provide a structure that allows the use of materials of the same thickness.

[0006]

In order to achieve the above object, the present invention provides a method in which a cover is provided with an IC having an amount equal to the difference in package height between the ICs, on the upper part of the IC having a low package height, The distance between the IC package and the cover is the same regardless of the height of the IC.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings taking an optical disk as an example.

FIG. 3 is a perspective view of the optical disk device. FIG. 2 is a sectional view of the optical disk device perspective view of FIG. FIG. 1 is a detailed view of a portion B in FIG. 2 and shows a heat dissipation structure of the present invention.

In FIG. 1, 1 is a top cover, 2 is a circuit board, and 3 is a heat transfer spacer. The top cover 1 is provided with apertures 1a and 1b on an IC described later.
The circuit board 2 controls a mechanism (not shown) and devices, and has ICs 2a, 2b, 2c, etc. on the board. In the present embodiment, for ease of explanation, ICs on a substrate are shown in a line. The heat transfer spacer 3 is a member having heat transfer performance, such as a heat radiation rubber sheet (silicone elastomer). The heat transfer spacers 3a, 3b, 3c are sandwiched between the top cover 1 and the ICs 2a, 2b, 2c,
The thickness is the same. If the material of the heat transfer spacer 3 is, for example, a heat radiating rubber sheet having elasticity, an appropriate amount of compression may be performed by the top cover 1 and the IC so as not to come off.

In FIG. 2, the apparatus of this embodiment has a dustproof structure, and has an optical pickup mechanism 7 including a circuit board 2, a tray shield 4, a rear shield 5, a headphone / headphone volume shield 6, and the like. Dust is prevented from entering the inside of the device. The optical pickup mechanism 7 has a laser device 8 (not shown),
It reads information from the optical disk 9 and writes information to the optical disk 9. The life of the laser device 8 is determined by the ambient temperature, and the higher the ambient temperature, the shorter the life. Therefore, it is important to lower the temperature inside, especially around the laser device 8 as much as possible.

The heat generated inside (for example, the heat generated from the motor driver IC 10 (not shown) of the optical pickup mechanism 7) is hardly released to the outside because the device has a closed structure. Therefore, the ICs and the like as heat sources are disposed as much as possible on the outside, and at the same time, the ICs (ICs 2a, 2b,
It is necessary to release the heat of 2c, etc.) to the outside so that the internal temperature does not rise. The heat is guided to the top cover 1 via the heat transfer spacer 3 and the heat is released from the top cover 1 to the outside air. . Therefore, the material of the top cover 1 is preferably a metal having a high heat radiation effect, for example, aluminum or iron.

In FIG. 3, 2 of the IC on the circuit board 2 is shown.
Generally, a, 2b and 2c have different package heights. Here, the aperture amounts h1 and h2 of the apertures 1a and 1b of the top cover 1 are IC 2a, 2c and 2b, respectively.
And 2c.

Thus, the distance between the IC and the top cover 1 is constant irrespective of the height of the IC package, so that the thickness h0 of the heat transfer spacers 3a, 3b, 3c can be the same. Therefore, the heat transfer spacers 3a, 3b, and 3c can be made of a material having at least the same thickness, and if the outer shape can be made the same, a plurality of the same parts can be used.
If the ICs 2a, 2b, and 2c are close to each other, the heat transfer spacers 3a, 3b, and 3c can be integrated (integrated) to reduce the number of components. Therefore, it is easy to control the material and thickness of the material when manufacturing the heat transfer spacer 3, and there is an effect that erroneous mounting of parts and the like does not occur even when assembling the apparatus.

If the top cover 1 is not provided with the apertures 1a, 1b, the heat transfer spacers 3a, 3b, 3c
Must be changed in accordance with the ICs 2a and 2b, respectively, and it is necessary to prepare three types of materials having different thicknesses in this embodiment. Management becomes difficult. Also, when assembling the apparatus, there is a danger of erroneous mounting of parts.

In this embodiment, if the heat transfer spacer 3 is made of an elastic material such as a heat radiation rubber sheet, it is possible to absorb dimensional differences such as variations in the height of the IC package and variations in the amount of drawing of the top cover. There are advantages.

In this embodiment, the optical disk apparatus has been described. However, if the information processing apparatus has a plurality of ICs having different package heights on a circuit board and has a cover for covering the circuit board, an optical disk apparatus may be used. The present invention is not limited to the device, and it goes without saying that the same effect can be obtained by providing the cover with an aperture of an amount corresponding to the difference in package height between the plurality of ICs.

[0017]

According to the present invention, since the distance between the IC and the top cover becomes constant regardless of the height of the IC package, the thickness of each heat transfer spacer can be made the same. Therefore, the individual heat transfer spacers can be made of a material having at least the same thickness, and if the outer shape can be made the same, a plurality of the same parts can be used. If a plurality of ICs are arranged at a short distance, the individual heat transfer spacers can be integrated (integrated) to reduce the number of components. Therefore, it is easy to control the material and thickness of the material when manufacturing the heat transfer spacer, and it is possible to eliminate erroneous mounting of parts even when assembling the apparatus.

[Brief description of the drawings]

FIG. 1 is a detailed view of a portion B in FIG. 2, showing a heat dissipation structure of an optical disk device according to the present invention.

FIG. 2 is a sectional view taken along the line AA of FIG. 3, showing a section of the optical disk device according to the present invention;

FIG. 3 is a perspective view of an optical disk device according to the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Top cover 2 ... Circuit board 2a, 2b, 2c ...
IC 3: Heat transfer spacer 3a, 3b: Heat transfer spacer 4: Tray shield 5
… Rear part shield 6… Headphone / Headphone volume part shield 7
... Optical pickup mechanism 8 ... Laser device 9 ... Optical disk 10 ... Motor driver IC

Claims (3)

[Claims] 1. An optical disc device comprising at least an optical pickup mechanism having a laser device, a circuit board having at least two ICs having different package heights, and a cover for covering the IC, wherein an IC on the circuit board is provided. An optical disk, comprising: a heat transfer spacer between the cover and the cover; and an aperture of an amount corresponding to a difference in package height between the ICs, provided on the cover above the IC having a low package height. apparatus. 2. An information processing apparatus having a plurality of ICs having different package heights on a circuit board and a cover for covering the circuit board, wherein the cover has a difference in package height between the plurality of ICs. An information processing apparatus characterized in that an aperture of an amount corresponding to the distance is provided. 3. An information processing apparatus having a plurality of ICs having different package heights on a circuit board and a cover for covering the circuit board, wherein the cover has a difference in package height between the plurality of ICs. An information processing apparatus characterized in that an aperture is provided in an amount corresponding to the distance between the plurality of ICs and the cover.