JPH03192513A - Head assembly for recording and reproduction - Google Patents
Head assembly for recording and reproductionInfo
- Publication number
- JPH03192513A JPH03192513A JP33170589A JP33170589A JPH03192513A JP H03192513 A JPH03192513 A JP H03192513A JP 33170589 A JP33170589 A JP 33170589A JP 33170589 A JP33170589 A JP 33170589A JP H03192513 A JPH03192513 A JP H03192513A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- chip
- recording
- head
- support arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 abstract description 7
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 7
- 239000004020 conductor Substances 0.000 abstract description 5
- 229920005989 resin Polymers 0.000 abstract description 4
- 239000011347 resin Substances 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 101100027969 Caenorhabditis elegans old-1 gene Proteins 0.000 description 1
- 241001474791 Proboscis Species 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
Landscapes
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
磁気ディスク装置等において記録再生用ヘッドを支持し
、かつ該ヘッドに対する記録・再生信号の処理用集積回
路を実装した小型化に有利な記録再生用ヘッドアセンブ
リに関し、
ヘッド支持アームにフレキシブル印刷配線板を介して実
装する集積回路としてチップ状の集積回路を用い、しか
も該チップ状集積回路に対する外部ノイズのシールド及
び放熱を可能とした小型な記録再生用ヘッドアセンブリ
を容易に得ることを目的とし、
記録再生用ヘッドを支持するアームに、該ヘッドへの記
録信号の制御及び該ヘッドからの再生信号を増幅する集
積回路を実装したフレキシブル印刷配線板を配置したヘ
ッドアセンブリであって、上記集積回路はチップ状から
なり、上記ヘッド支持アームは上面に該チップ状の集積
回路を収容する凹部を有し、該ヘッド支持アームの上面
に、裏返してチップ状集積回路を下向きにしたフレキシ
ブル印刷配線板を前記凹部内にチップ状集積回路が収容
されるようにして貼設した構成とする。[Detailed Description of the Invention] [Summary] A recording/reproducing head assembly that supports a recording/reproducing head in a magnetic disk device or the like and is advantageous for miniaturization, and is equipped with an integrated circuit for processing recording/reproducing signals for the head. Regarding this, a small recording/reproducing head assembly that uses a chip-shaped integrated circuit as an integrated circuit mounted on a head support arm via a flexible printed wiring board, and further enables shielding of external noise and heat dissipation from the chip-shaped integrated circuit. This head has a flexible printed circuit board mounted with an integrated circuit that controls recording signals to the head and amplifies reproduction signals from the head, on an arm that supports the recording/reproducing head. In the assembly, the integrated circuit is in the form of a chip, the head support arm has a recess on the upper surface for accommodating the integrated circuit in the form of a chip, and the integrated circuit in the form of a chip is placed upside down on the upper surface of the head support arm. A flexible printed wiring board facing downward is attached so that a chip-shaped integrated circuit is accommodated in the recess.
本発明は磁気ディスク装置等において記録再生用ヘッド
を支持し、かつ該ヘッドに対する記録・再生信号の処理
用集積回路を実装した小型化に有利な記録再生用ヘッド
アセンブリに関するものである。The present invention relates to a recording/reproducing head assembly that supports a recording/reproducing head in a magnetic disk device or the like and is advantageous for miniaturization, and is equipped with an integrated circuit for processing recording/reproducing signals for the head.
近来、磁気ディスク装置においては高密度化、高速化と
共に、スペース効率の面からも装置の小型化が急速に進
められ、高密度記録等の性能の向上と共に、構成部品の
小型化、部品点数の減少及び電子部品の実装技術が重要
となる。In recent years, in addition to increasing density and speed in magnetic disk drives, devices have also been rapidly miniaturized from the perspective of space efficiency. Reduction and mounting technology of electronic components will be important.
ところで、磁気ディスク装置における磁気ディスクの記
録情報を磁気ヘッドにより再生する信号は非常に微弱で
あることから、かかる再生信号を増幅するための集積回
路はでき得る限り磁気ヘッドの近傍に設けるようにして
外乱ノイズの影響を受けないようにすることが要求され
、一般に磁気ヘッドを支持するヘッド支持アーム上に実
装しているが、このような記録再生用の磁気ヘッドアセ
ンブリを磁気ディスク装置の小型化に伴って同様に小型
にすると該ヘッド支持アームへの前記集積回路の実装構
造も小型化することが必要とされる。By the way, since the signal used to reproduce information recorded on a magnetic disk in a magnetic disk device by a magnetic head is extremely weak, an integrated circuit for amplifying such a reproduced signal should be installed as close to the magnetic head as possible. The magnetic head is generally mounted on a head support arm that supports the magnetic head, as it is required to be unaffected by disturbance noise. Accordingly, if the head support arm is made smaller, the structure for mounting the integrated circuit on the head support arm must also be made smaller.
従来の集積回路を実装した磁気ヘッドアセンブリは第４
図の斜視図及び第５図の要部断面図に示すように、磁気
ヘッド１がジンバルアーム２を介して支持されたフレー
ムタイプのヘッド支持アーム３上に、該磁気ヘッド１へ
の記録信号の制御及び該ヘッド１で再生した信号を増幅
するための、例えばフラットパッケージ形集積回路（以
下、ＦＰ形集積回路と略称する）５を半田付は等により
実装されたフレキシブル印刷配線板４をひっくり返して
、そのＦＰ形集積回路５がヘッド支持アーム３のフレー
ム内に挿入した状態で貼設して、前記磁気ヘッド１の近
傍に該ＦＰ形集積回路５を配置し、該磁気ヘッド１のコ
イルとＦＰ形集積回路５とを配線６により接続した構成
とすることにより、この実装による配線回路上の電気的
容量Ｃの増加を極力減少し、しかも外部からのノイズの
影響を低減するようにしている。The magnetic head assembly that implements the conventional integrated circuit is the fourth
As shown in the perspective view in the figure and the cross-sectional view of the main part in FIG. For example, a flat package integrated circuit (hereinafter abbreviated as FP integrated circuit) 5 for controlling and amplifying signals reproduced by the head 1 is mounted on a flexible printed wiring board 4 by soldering, etc., and the flexible printed wiring board 4 is turned over. Then, the FP type integrated circuit 5 is inserted and pasted into the frame of the head support arm 3, and the FP type integrated circuit 5 is placed near the magnetic head 1, and the coil of the magnetic head 1 and the FP type integrated circuit 5 are attached. By connecting the FP integrated circuit 5 with the wiring 6, the increase in electrical capacitance C on the wiring circuit due to this mounting is minimized, and the influence of external noise is also reduced. .
ところで磁気ディスク装置の小型化及び高速化に伴って
上記したような構成の磁気ヘッドアセンブリも当然のこ
とながら小型化する必要がある。By the way, as magnetic disk drives become smaller and faster, it is natural that magnetic head assemblies having the above-mentioned configuration also need to be made smaller.
しかし、該磁気ヘッド支持アーム３に実装する前記ＦＰ
形集積回路５の形状が規格化され、かかる集積回路５の
小型化にも限度があるため、そのような実装容積（実装
面積）の小型にならないＦＰ形集積回路５を適用する磁
気ヘッドアセンブリの小型化は極めて困難であった。However, the FP mounted on the magnetic head support arm 3
The shape of the integrated circuit 5 has been standardized, and there is a limit to the miniaturization of the integrated circuit 5. Therefore, it is difficult to reduce the size of the magnetic head assembly using the FP integrated circuit 5, which does not have a small mounting volume (mounting area). Miniaturization was extremely difficult.
そこでそのような問題を解決するために磁気ヘッド支持
アームにフレキシブル印刷配線板を介して実装する集積
回路として、例えば前記ＦＰ形集積回路５内に配設され
ている該パッケージの十数骨の一程度の小さいＩＣ，Ｌ
ＳＩ等からなるチップを、前記フレキシブル印刷配線板
上の所定位置に直接に貼設し、該フレキシブル印刷配線
板の配線導体へワイヤボンディングにより接続した実装
構造とすることにより、前記磁気ヘッドアセンブリの小
型、軽量化が可能になると考えられるが、一方、実装さ
れたチップ状集積回路に対する外部ノイズのシールドが
不十分となる問題があった。Therefore, in order to solve this problem, as an integrated circuit to be mounted on the magnetic head support arm via a flexible printed wiring board, for example, one of the more than ten bones of the package arranged in the FP type integrated circuit 5 is used. IC, L with a small degree
By adopting a mounting structure in which a chip made of SI or the like is directly attached to a predetermined position on the flexible printed wiring board and connected to the wiring conductor of the flexible printed wiring board by wire bonding, the magnetic head assembly can be made smaller. However, on the other hand, there is a problem in that the mounted chip-shaped integrated circuit is insufficiently shielded from external noise.
因に、前記ＦＰ形集積回路ではＩＣ，ＬＳＩ等からなる
チップが配設されたチップ配設基板の上下部に絶縁物を
介してシールド材が挟設され、樹脂材等によりモールド
成形した構成により外部ノイズに対するシールド効果を
持たせている。Incidentally, in the above-mentioned FP type integrated circuit, a shielding material is sandwiched between the upper and lower parts of a chip mounting board on which chips made of IC, LSI, etc. are mounted, with an insulator interposed between them, and the shielding material is molded with a resin material or the like. It has a shielding effect against external noise.
本発明は上記した従来の問題点に鑑み、ヘッド支持アー
ムにフレキシブル印刷配線板を介して実装する集積回路
としてチップ状の集積回路を用い、しかも該チップ状集
積回路に対する外部ノイズのシールド及び放熱を可能と
した小型化の容易な記録再生用ヘッドアセンブリを提供
することを目的とするものである。In view of the above-mentioned conventional problems, the present invention uses a chip-shaped integrated circuit as an integrated circuit mounted on a head support arm via a flexible printed wiring board, and further provides shielding of external noise and heat dissipation for the chip-shaped integrated circuit. The object of the present invention is to provide a recording/reproducing head assembly that can be easily miniaturized.
本発明は上記した目的を達成するため、記録再生用ヘッ
ドを支持するアームに、該ヘッドへの記録信号の制御及
び該ヘッドからの再生信号を増幅する集積回路を実装し
たフレキシブル印刷配線板を配置したヘッドアセンブリ
であって、上記集積回路はチップ状からなり、上記ヘッ
ド支持アームは上面に該チップ状の集積回路を収容する
凹部を有し、該ヘッド支持アームの上面に、裏返してチ
ップ状集積回路を下向きにしたフレキシブル印刷配線板
を前記凹部内にチップ状集積回路が収容されるようにし
て貼設した構成とする。In order to achieve the above-mentioned object, the present invention arranges, on an arm supporting a recording/reproducing head, a flexible printed wiring board mounted with an integrated circuit for controlling recording signals to the head and amplifying reproduction signals from the head. In the head assembly, the integrated circuit is in the form of a chip, the head support arm has a recess on the upper surface for accommodating the integrated circuit in the form of a chip, and the integrated circuit in the form of a chip is placed upside down on the upper surface of the head support arm. A flexible printed wiring board with the circuit facing downward is attached so that the chip-shaped integrated circuit is accommodated in the recess.
フレキシブル印刷配線板を裏返しにして前記チップ状集
積回路を前記ヘッド支持アームの凹部に挿入した状態で
貼設した構成とすることにより、記録再生用ヘッドアセ
ンブリの小型化が可能となる。By affixing the flexible printed wiring board upside down and inserting the chip-shaped integrated circuit into the recess of the head support arm, it is possible to downsize the recording/reproducing head assembly.
また前記チップ状集積回路は、金属製のヘッド支持アー
ムとシールド付きフレキシブル印刷配線板のシールド材
により被包されているので、外部からのノイズを容易に
シールドすることができる。Further, since the chip-shaped integrated circuit is covered by the metal head support arm and the shielding material of the shielded flexible printed wiring board, external noise can be easily shielded.
更にこのように構成されたヘッド支持アームに設けた集
積回路を収容する凹部を、該ヘッド支持アームの左右両
側に貫通させることにより、記録再生時にディスク媒体
の回転によって発生する気流が前記貫通凹部内を流通し
、動作中に発生する前記チップ状の集積回路の熱を放熱
して空冷することができる。Furthermore, by penetrating the recesses for accommodating the integrated circuit provided in the head support arm configured in this manner on both the left and right sides of the head support arm, airflow generated by the rotation of the disk medium during recording and reproduction can be directed into the through-hole recesses. The heat generated during operation of the chip-shaped integrated circuit can be radiated and cooled by air.
本発明ではチップ状の集積回路を収容する凹部を設けた
金属製のヘッド支持アーム上に、該チップ状の集積回路
を実装した、例えばシールド付き〔実施例〕
以下図面を用いて本発明の実施例について詳細に説明す
る。In the present invention, a chip-shaped integrated circuit is mounted on a metal head support arm provided with a recess for accommodating the chip-shaped integrated circuit, for example, with a shield. An example will be explained in detail.
第１図は本発明に係る記録再生用へラドアセンブリの一
実施例を示す要部斜視図であり、第２図はその要部断面
図である。FIG. 1 is a perspective view of a main part showing an embodiment of a recording/reproducing head assembly according to the present invention, and FIG. 2 is a sectional view of the main part.
これら両図において、例えば１１は磁気ヘッド１をジン
バルアーム２を介して支持したアルミニウム（Ａｌ）等
からなる金属製のヘッド支持アームであり、該ヘッド支
持アーム１１上の所定領域にチップ状集積回路１３を収
容する凹部１２を設けている。In both of these figures, for example, 11 is a metal head support arm made of aluminum (Al) that supports the magnetic head 1 via a gimbal arm 2, and a chip-shaped integrated circuit is mounted on a predetermined area on the head support arm 11. 13 is provided.
そしてかかる凹部１２を有するヘッド支持アーム１１上
には、前記磁気ヘッド１への記録信号の制御及び該ヘッ
ド１からの再生信号を増幅するチップ状の集積回路１３
が表面に配設され、ボンディングワイヤ１４により電気
的接続がなされ、かつそれらはエポキシ樹脂、或いはシ
リコーン樹脂等からなる絶縁性樹脂材１５等によって被
覆した状態に実装されたシールド付きフレキシブル印刷
配線板１６を裏返しにして、該チップ状集積回路１３を
前記ヘッド支持アーム１１の凹部１２に挿入した状態で
接着剤等により貼設し、該磁気ヘッド１のコイルとチッ
プ状集積回路１３とを配線６により接続した構成として
いる。On the head support arm 11 having the concave portion 12, there is provided a chip-shaped integrated circuit 13 for controlling recording signals to the magnetic head 1 and amplifying reproduction signals from the head 1.
A shielded flexible printed wiring board 16 is mounted on the surface thereof, electrically connected by bonding wires 14, and covered with an insulating resin material 15 made of epoxy resin, silicone resin, etc. is turned over, and the chip-shaped integrated circuit 13 is inserted into the recess 12 of the head support arm 11 and pasted with adhesive, etc., and the coil of the magnetic head 1 and the chip-shaped integrated circuit 13 are connected by the wiring 6. The configuration is connected.
従って、本実施例の構成では前記ヘッド支持アーム１１
にチップ状集積回路１３をシールド付きフレキシブル印
刷配線板１６によって直接実装することによって、該ヘ
ッド支持アーム１１の小型化、ひいては記録再生ヘッド
アセンブリの小型化が可能となる。Therefore, in the configuration of this embodiment, the head support arm 11
By directly mounting the chip-shaped integrated circuit 13 on the shielded flexible printed wiring board 16, it becomes possible to downsize the head support arm 11 and, by extension, downsize the recording/reproducing head assembly.
また実装されたチップ状集積回路１３は、金属製のヘッ
ド支持アーム１１とシールド付きフレキシブル印刷配線
板１６の図示しないシールド導体により被包されている
ので、外部からのノイズを完全にシールドすることがで
きる。Furthermore, since the mounted chip-shaped integrated circuit 13 is covered by the metal head support arm 11 and the shield conductor (not shown) of the shielded flexible printed wiring board 16, it is possible to completely shield noise from the outside. can.
なお、前記シールド付きフレキシブル印刷配線板１６の
代わりに、シールド無しのフレキシブル印刷配線板とチ
ップ状集積回路との間にシールド導体を介在するようよ
うにしても、該シールド導体と金属製のヘッド支持アー
ム１１とにより同様に外部からのノイズを完全にシール
ドすることができる。Note that even if a shield conductor is interposed between the unshielded flexible printed wiring board and the chip-shaped integrated circuit instead of the shielded flexible printed wiring board 16, the shield conductor and the metal head support Similarly, the arm 11 can completely shield noise from the outside.
更に第３図は本発明に係る記録再生用ヘッドアセンブリ
の他の実施例を示す要部斜視図であり、第１図と同等部
分には同一符号を付している。Furthermore, FIG. 3 is a perspective view of main parts showing another embodiment of the recording/reproducing head assembly according to the present invention, in which the same parts as in FIG. 1 are given the same reference numerals.
この図で示す実施例が第１図のそれと異なる点は、シー
ルド付きフレキシブル印刷配線板１６によってチップ状
集積回路１３を実装挿入したヘッド支持アーム１１の凹
部１２を、該ヘッド支持アーム１１の左右両側に貫通さ
せてその貫通部２１により該凹部１２内の風通しを良く
したことである。The embodiment shown in this figure is different from the embodiment shown in FIG. The recess 12 is made to penetrate through the recess 12, and the through portion 21 improves ventilation within the recess 12.
このようなヘッド支持アーム１１の構成によって、記録
再生時にディスク媒体の回転によって発生する気流が前
記貫通部２１を通して凹部１２内を流通し、記録・再生
動作中の前記チップ状集積回路１３で発生する熱の放熱
が効率よく行われ、効果的に空冷することが可能となる
。With such a configuration of the head support arm 11, the airflow generated by the rotation of the disk medium during recording and reproduction flows through the through-hole 21 and inside the recess 12, and is generated in the chip-shaped integrated circuit 13 during recording and reproduction operations. Heat is efficiently dissipated and air cooling can be performed effectively.
従って、本実施例の構成ではシールド付きフレキシブル
印刷配線板１６によってヘッド支持アーム１１に実装さ
れたチップ状集積回路１３に対する外部ノイズの完全な
シールドと空冷が可能な小型の記録再生ヘッドアセンブ
リを容易に得ることができる。Therefore, in the configuration of this embodiment, it is possible to easily create a compact recording/reproducing head assembly that can completely shield external noise and air-cool the chip-shaped integrated circuit 13 mounted on the head support arm 11 using the shielded flexible printed wiring board 16. Obtainable.
以上の説明から明らかなように、本発明に係る記録再生
用磁気ヘッドアセンブリによれば、チップ状集積回路を
直接シールド付きフレキシブル印刷配線板によって金属
製のヘッド支持アームの凹部に実装することによって記
録再生ヘッドアセンブリの小型化が可能となると共に、
該チップ状集積回路に対する外部ノイズを完全にシール
ドすることが可能となる。また該ヘッド支持アームの凹
部を、該ヘッド支持アームの左右両側に貫通させた構成
により発熱する前記チップ状集積回路の空冷が効果的に
行われ、更に熱障害も防止することができる等、実用上
価れた利点を有し、小型化する磁気ディスク装置、光磁
気ディスク装置、或いは光デイスク装置等の記録再生用
磁気ヘッドアセンブリに適用して極めて有利である。As is clear from the above description, according to the magnetic head assembly for recording and reproducing according to the present invention, a chip-shaped integrated circuit is directly mounted in the recess of a metal head support arm using a shielded flexible printed wiring board. It is possible to downsize the playback head assembly, and
It becomes possible to completely shield the chip-shaped integrated circuit from external noise. In addition, the structure in which the recessed portions of the head support arm are passed through on both the left and right sides of the head support arm effectively cools the chip-shaped integrated circuit that generates heat, and furthermore, prevents thermal damage. It has advantages in terms of cost, and is extremely advantageous when applied to magnetic head assemblies for recording and reproducing such as miniaturized magnetic disk devices, magneto-optical disk devices, and optical disk devices.
第１図は本発明に係る記録再生用ヘッドアセンブリの一
実施例を示す要部斜視図、
第２図は第１図に示す記録再生用ヘッドアセンブリの要
部断面図、
第３図は本発明に係る記録再生用ヘッドアセンブリの他
の実施例を示す要部斜視図、
第４図は従来の記録再生用ヘッドアセンブリを説明する
ための要部斜視図、
第５図は第４図に示す記録再生用ヘッドアセンブリの要
部断面図である。
１３九７’−１−ｔ１才１【回４
第１図〜第３図において、
■は磁気ヘッド、２はジンバルアーム、６は配線、１１
はヘッド支持アーム、１２は凹部、１３はチップ状集積
回路、１４はポンディングワイヤ、１５は絶縁性樹脂材
、１６はシールド付きフレキシブル印刷配線板、２１は
貫通部をそれぞれ示す。
第１図
Ｔ３−ｆ−ｉ＞衣゛秦曖コ坏
第２図
く２１」ｒ、乃ｔｉ’４ｆ４４’ｋＦｆ４ ’ｙｗ ト
；７１！＞７”９ｅｒｆＱＴ） １ツコｆつ５１４Ｐｉ
！ ｍ第４図
７４ミ屓琴ロル智で釡ψ、再、牙Ｊ引へう片ア１ごソブ
ンｎイこ吻乍シ鋏←判を１ｔｔＦ音ｐ悸戸）−’ｆｆ５
ゴ第３図
味４図１−Ｊｆ−を記１１酊を甲へ４゛ア乞’７−’／
ｆｌ斡姥牟面団第５図
６５−FIG. 1 is a perspective view of essential parts showing an embodiment of the recording/reproducing head assembly according to the present invention, FIG. 2 is a sectional view of essential parts of the recording/reproducing head assembly shown in FIG. 1, and FIG. 3 is the present invention. FIG. 4 is a perspective view of a main part showing another embodiment of a recording/reproducing head assembly according to the related art; FIG. 4 is a perspective view of an essential part for explaining a conventional recording/reproducing head assembly; FIG. FIG. 3 is a cross-sectional view of the main parts of the reproduction head assembly. 1397'-1-t1 year old 1 [Time 4 In Figures 1 to 3, ■ is the magnetic head, 2 is the gimbal arm, 6 is the wiring, 11
12 is a head support arm, 12 is a recessed portion, 13 is a chip-shaped integrated circuit, 14 is a bonding wire, 15 is an insulating resin material, 16 is a shielded flexible printed wiring board, and 21 is a through portion. Figure 1 T3-f-i > Clothes ゛Qin Yuko 2nd Figure 21''r, 乃ti'4f44'kFf4'yw ト;71! >7”9erfQT) 1 piece 514Pi
! m fig. 4 74 Mi 屓琵 lol ちで釡ψ、Re、Fang J pull one A 1 Go Sobun n Iko proboscis 乍し ← size 1ttF sound p悸DO)-'ff5
Go 3rd figure 4 Figure 1-Jf- is written 11 Drunkenness to the instep 4゛A beg '7-'/
fl Uba Mu Myeondan Figure 5 65-
Claims (2)
）に、該ヘッド（１）への記録信号の制御及び該ヘッド
（１）からの再生信号を増幅する集積回路（１３）を実
装したフレキシブル印刷配線板（１６）を配置したヘッ
ドアセンブリであって、 上記集積回路（１３）はチップ状からなり、上記ヘッド
支持アーム（１１）は上面に該チップ状の集積回路（１
３）を収容する凹部（１２）を有し、該ヘッド支持アー
ム（１１）の上面に、裏返してチップ状集積回路（１３
）を下向きにしたフレキシブル印刷配線板（１６）を前
記凹部（１２）内にチップ状集積回路（１３）が収容さ
れるようにして貼設したことを特徴とする記録再生用ヘ
ッドアセンブリ。(1) An arm (11) supporting the recording/reproducing head (1)
), in which a flexible printed wiring board (16) mounted with an integrated circuit (13) for controlling recording signals to the head (1) and amplifying reproduction signals from the head (1) is arranged. , The integrated circuit (13) is chip-shaped, and the head support arm (11) has the chip-shaped integrated circuit (13) on the upper surface.
3), and has a recess (12) for accommodating a chip-shaped integrated circuit (13) on the upper surface of the head support arm (11).
1. A recording/reproducing head assembly characterized in that a flexible printed wiring board (16) with a side facing downward is attached such that a chip-shaped integrated circuit (13) is accommodated in the recess (12).
（１３）を収容する凹部（１２）は、左右両側に貫通し
てなることを特徴とする請求項（１）記載の記録再生用
ヘッドアセンブリ。(2) The recording/reproducing head according to claim (1), wherein the recess (12) provided in the head support arm (11) and accommodating the integrated circuit (13) extends through both left and right sides. assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33170589A JPH03192513A (en) | 1989-12-20 | 1989-12-20 | Head assembly for recording and reproduction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33170589A JPH03192513A (en) | 1989-12-20 | 1989-12-20 | Head assembly for recording and reproduction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03192513A true JPH03192513A (en) | 1991-08-22 |
Family
ID=18246669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33170589A Pending JPH03192513A (en) | 1989-12-20 | 1989-12-20 | Head assembly for recording and reproduction |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03192513A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5712747A (en) * | 1996-01-24 | 1998-01-27 | International Business Machines Corporation | Thin film slider with on-board multi-layer integrated circuit |
| EP0911812A1 (en) * | 1997-10-20 | 1999-04-28 | Fujitsu Limited | Head slider supporting device, disk device and suspension |
| US6266213B1 (en) | 1998-03-20 | 2001-07-24 | Fujitsu Limited | Suspension having an IC chip and a head slider on opposite surfaces |
| US6313970B1 (en) * | 1994-02-18 | 2001-11-06 | Maxtor Corporation | Disk drive with low profile suspension assemblies |
| US6437944B2 (en) | 1997-10-20 | 2002-08-20 | Fujitsu Limited | Head slider supporting device, disk device and suspension |
-
1989
- 1989-12-20 JP JP33170589A patent/JPH03192513A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6313970B1 (en) * | 1994-02-18 | 2001-11-06 | Maxtor Corporation | Disk drive with low profile suspension assemblies |
| US6493187B2 (en) | 1994-02-18 | 2002-12-10 | Maxtor Corporation | Disk drive with low profile head suspension assemblies |
| US5712747A (en) * | 1996-01-24 | 1998-01-27 | International Business Machines Corporation | Thin film slider with on-board multi-layer integrated circuit |
| US5771571A (en) * | 1996-01-24 | 1998-06-30 | International Business Machines Corporation | Method for manufacturing thin film slider with on-board multi-layer integrated circuit |
| EP0911812A1 (en) * | 1997-10-20 | 1999-04-28 | Fujitsu Limited | Head slider supporting device, disk device and suspension |
| US6437944B2 (en) | 1997-10-20 | 2002-08-20 | Fujitsu Limited | Head slider supporting device, disk device and suspension |
| US6583962B2 (en) | 1997-10-20 | 2003-06-24 | Fujitsu Limited | Head slider supporting device, disk device and suspension having thermal protection for head IC chip |
| US6266213B1 (en) | 1998-03-20 | 2001-07-24 | Fujitsu Limited | Suspension having an IC chip and a head slider on opposite surfaces |
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