JPS60232975A - Thick film type thermal recording head - Google Patents

Abstract

PURPOSE:To provide an edge-type thermal head and increase the degree of freedom in designing a paper-feeding mechanism or the like, by a method wherein a common wire and electrodes are provided in two-layer construction with an insulating layer therebetween, and heating elements are provided at an end part of a head substrate. CONSTITUTION:A common wire 2 is provided in parallel with and on the inside of the heating elements 4 on the insulating layer 14 formed on the head substrate 6. The electrodes 3 for driver ICs integral with lead wires 3a are so disposed as to intersect the common wires 2 through the insulating layer 14. The common wire 2 is provided with through-hole platings 2a for every other lead wires 3a so that they are connected to the every other lead wires 3a, whereby the common wire 2 is connected to the electrodes 3.

Description

[Detailed Description of the Invention] [Field of Application of the Invention] This invention relates to a thick-film thermosensitive recording head that uses a so-called alternate lead method, in which electrodes are drawn out alternately, among thermosensitive recording heads used in the recording section of facsimiles and printers. A thick-film thermal recording head with an electrode wiring pattern suitable for a so-called edge-type head, which is a type of recording head in which a heating resistor is placed at the end of a head substrate, which is particularly advantageous in terms of the overall mechanism of the device. Regarding.

Two types of thermal recording heads 1 (hereinafter referred to as "thermal heads") are in practical use.

The thermal head 1 shown in FIG. 1 has one common wire 2 and two areas 4a and 4b of a heating resistor 4 for thermal recording (hereinafter referred to as "heating element") sandwiched between electrodes 3. This is advantageous in terms of structure because it does not require two-layer wiring or diodes to prevent backflow. The disadvantage is that the definition of the image is reduced.

On the other hand, the thermal head 1 shown in FIG.
c, 4d, etc. are made to form one pixel each, and because the pixel density and electrode density are equal, the definition of characters and images is improved, but the second layer wiring and As shown in Figure 7, there is a drawback in that it prevents backflow.

Furthermore, for the thermal head 1 of the type shown in FIG. 1, the heating element 4 is placed in the center of the head substrate 6, and the common wire 2 is provided over almost the entire area on one side, as shown in FIG. There are two methods: the center type, and the edge type, in which the heating element 4 is placed near the end of the head board 6 and the width of the common line 2 is made as narrow as possible, as shown in FIG.
There are two methods.

By the way, when the thermal head 1 is used for facsimile, etc., the edge type thermal head 1 shown in FIG. 6 is better than the center type thermal head 1 shown in No. Since it can be used efficiently, the degree of freedom in designing the paper feeding mechanism 10 and the like disposed in the space 8 relative to the platen roller 9 is increased, which is advantageous.

However, even in a thermal head 1 with a single common wire 2 as shown in FIG. 1, it is necessary to have a certain width of the common wire 2. Since it is separated from the substrate 6, there is a limit to the edge type structure. Further, in the thermal head 1 of the type shown in FIG. 2, since there are two common lines 2 and the diode 5 must be placed, it is difficult to create an edge type structure.

[Purpose of the invention]

An object of the present invention is to make it possible to arrange a heating element at the end of a head substrate, and to provide a thick-film type thermal head having an electrode wiring pattern suitable for those having two common wires. to provide.

[Summary of the invention]

The thick film type thermal head of the present invention has a two-layer structure in which a common wire and an electrode are arranged with an insulating layer interposed therebetween, and a heating element is arranged at an end of a head substrate.

According to the above configuration, the thermal head can be an edge type, and the degree of freedom in designing the paper feeding mechanism etc. can be increased.

(Example of the invention) Hereinafter, one embodiment of the present invention will be described based on the drawings.

8 to 11 relate to the thermal head 11 according to the present invention, and in the one shown in FIGS. 8 and 9, the common wire 2 is
This is a sensitive head 11 in the case of a book, and the heating element 4 is arranged at the end of the head substrate 6, and the leads R3 are arranged at regular intervals.
a is connected and covered with a protective layer 12.

The common wire 2 is parallel to the heating element 4; it is arranged on an insulating layer 14 formed on the head substrate 6 inside the heating element 4. The lead wire 3a and the lead wire 3 for the driver IC are arranged to intersect with the common wire 2 through the insulating layer 14.

A through hole 2a is formed in the common wire 2 so as to connect every other lead IWI3a to the lead wire 3a,
The common line 2 and the electrode 3 are electrically connected through the through hole 2a.

10 and 11 is a thermal head 11 in which there are two common wires 2. In this case, the backflow prevention diode 5 shown in FIG. 7 is provided on the insulating layer 14. The common wire 2 is connected to the lead wire 3a via the diode 5. The other structures are almost the same as those shown in FIGS. 8 and 9.

Next, the operation of one embodiment of the present invention will be explained.

In the thermal head 11 with one common wire 2 shown in FIGS. 8 and 9, the heating element 4 is arranged at the end of the head substrate 6, and the common wire 2 is placed on the head substrate 6 inside the heating element 4. The common wire 2 is disposed opposite to the lead wire 3a through the insulating layer 14, and the common wire 2 is electrically connected to the electrode 3 through the lead wire 3a through the through hole 2a of the common wire 2, so it is sufficient as an edge type thermal head 11. can perform various functions.

Also, the common wire 2 shown in FIGS. 10 and 11.

In the case of two thermal heads 11, the diode 5 can be placed on the insulating layer 14, so that the common@2 is 1
It has a two-layer structure in which poles similar to the heat-sensitive heat radiator 11 in the case of a book are arranged with an insulating layer in between, and the heating element is arranged at the end of the head substrate, so the edge-type heat-sensitive head As a result, the space near the end of the thermal head can be used efficiently, and the degree of freedom in designing the paper feeding mechanism etc. disposed in the space is increased.

In particular, a thermal head with two common wires can be applied as an edge-type thermal head in the same way as the case with one common wire by arranging a diode on an insulating layer.

[Brief explanation of the drawing]

Figures 1 to 7 relate to the conventional example, and Figure 1 shows the common line 1.
A schematic plan view of a book-type thermal head, Fig. 2 is a schematic plan view of a two-common wire type thermal head, Fig. 3 is a schematic plan view of a center-type thermal head, and Fig. 4 is an edge-type thermal head. FIG. 5 is a schematic side view showing the positional relationship between the center type thermal head and the platen roller, FIG. 6 is a schematic side view showing the positional relationship between the edge type thermal head and the platen roller, and FIG. The figure shows a circuit diagram on the head board of a two-common wire type thermal head, FIGS. 8 and 9 relate to the present invention, and FIG. The figure is I in Figure 8.
X- is a vertical cross-sectional view taken in the direction of arrows, FIG. 10 is a schematic plan view of a two-common wire type thermal head, and FIG. 11 is a cross-sectional view of η-℃ in FIG.
FIG.

Claims (1)

[Claims] A heating resistor for thermal recording is provided at the end of the head substrate, and lead wires connected to the heating resistor at regular intervals are directly or indirectly connected to a common wire arranged parallel to the heating resistor. In addition, a thick film type thermal recording head characterized in that an electrode for a driver IC integrated with the lead line is arranged to intersect with the common line via an insulating layer.