JPS59185667A - Thermal head - Google Patents

Thermal head

Info

Publication number
JPS59185667A
JPS59185667A JP58060671A JP6067183A JPS59185667A JP S59185667 A JPS59185667 A JP S59185667A JP 58060671 A JP58060671 A JP 58060671A JP 6067183 A JP6067183 A JP 6067183A JP S59185667 A JPS59185667 A JP S59185667A
Authority
JP
Japan
Prior art keywords
head substrate
heating element
end part
head
common electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58060671A
Other languages
Japanese (ja)
Inventor
Minoru Yamazaki
実 山崎
Masayoshi Nakamura
正義 中村
Tetsuo Kidai
哲男 来代
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Electric Works Ltd
Original Assignee
Tamura Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Electric Works Ltd filed Critical Tamura Electric Works Ltd
Priority to JP58060671A priority Critical patent/JPS59185667A/en
Publication of JPS59185667A publication Critical patent/JPS59185667A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors

Landscapes

  • Electronic Switches (AREA)
  • Facsimile Heads (AREA)

Abstract

PURPOSE:To enable to confirm a printed image immediately after printing with a simple construction and enable to prevent a printing performance from being lowered, by a method wherein one electrode for a heating resistor element is provided by utilizing a side end face of one end part of a head substrate, and the heating resistor element is provided in proximity to the end part. CONSTITUTION:A common electrode 5 which is one lead extended from the heating resistor elements 2 is extended on the side end face 1a of one end part A of the head substrate 1. By this, the elements 2 can be provided in the condition of being locally aligned in proximity to the end part A. The common electrode 5 does not need to be formed into a minute pattern, and can be easily formed by vapor deposition or the like. In this construction, the distance from the elements 2 to the end part A can be substantially eliminated, namely, it can be reduced to, for example, about 2mm.. Accordingly, a printed image can be confirmed immediately after printing, a molten material generated from a thermal recording paper is prevented from being accumulated on the substrate 1, and reliability on operation can be enhanced.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は、感熱記録紙に対して熱的な記録を行なうサー
マルヘッドの改良に関する０ 〔従来技術〕 サーマルヘッドは、たとえばセラミック材などのような
絶縁性および耐熱性を有する材料にて形成されたヘッド
基板上に、発熱体抵抗素子を一列に並設し、これらを電
気信号に応じて選択的に発熱させることによシ感熱記録
紙上に所要の文字、図形等を熱的に印刷するもので、フ
ァクシミリ装置を始めとして各種のプリンタ装置などに
用いられ、またその構成としても従来から種々のものが
知られている。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to an improvement in a thermal head that performs thermal recording on heat-sensitive recording paper. Heat-generating resistor elements are arranged in a row on a head substrate made of an insulating and heat-resistant material, and these elements are selectively heated in response to electric signals to generate the desired amount of heat on the thermal recording paper. It thermally prints characters, figures, etc., and is used in various printer devices including facsimile machines, and various configurations have been known.

ところで、上述したサーマルヘッドにおいて、問題とさ
れることは、ヘッド基板上の発熱体抵抗素子に対する電
気信号印加用リードをどのように形成するかということ
である。By the way, in the above-mentioned thermal head, the problem is how to form the leads for applying electric signals to the heating element resistance elements on the head substrate.

すなわち、従来量も一般的な構成としては、第１図＜＆
）（ｂ）に示されるように、ヘッド基板１の表面上でそ
の一方の端部（図中Ａで示す）寄シの部分に、発熱体抵
抗素子２を一列に並べて形成し、かつこれら各発熱体抵
抗素子２に対する個別電極３をヘッド基板１の表面上で
その他方の端部（図中Ｂで示す）側にマトリックス回路
（図示せず）を介して延設し、この他方端部Ｂにて個別
電極引出し用リード４に接続するように構成されている
。In other words, as for the conventional quantity and general configuration, Fig. 1<&
) As shown in (b), heating element resistance elements 2 are formed in a line on one end (indicated by A in the figure) of the surface of the head substrate 1, and each of these The individual electrodes 3 for the heating element resistance elements 2 are extended on the surface of the head substrate 1 to the other end (indicated by B in the figure) via a matrix circuit (not shown), and the other end B It is configured to be connected to the individual electrode lead 4 at.

一方、前記ヘッド基板１の一方端部Ａ側においては、各
発熱体抵抗素子２の共通電極５を複数個ごとに形成し、
これらの共通電極５に対する外部引出し用リード６をこ
のヘッド基板１の一方端部Ａ側から引出すように構成さ
れている。なお、図中１は発熱体抵抗素子２の形成する
部分を被覆する保護膜、８はヘッド基板１の裏面に付設
された放熱板である。On the other hand, on the one end A side of the head substrate 1, a plurality of common electrodes 5 for each heating element resistance element 2 are formed,
External leads 6 for these common electrodes 5 are drawn out from one end A side of the head substrate 1. In the figure, numeral 1 denotes a protective film that covers the portion where the heating element resistance element 2 is formed, and numeral 8 denotes a heat sink attached to the back surface of the head substrate 1.

しかしながら、このような従来構造では、発熱体抵抗素
子２の両側でヘッド基板１の両端部Ａ。However, in such a conventional structure, both ends A of the head substrate 1 on both sides of the heating element resistance element 2.

Ｂから外部引出し用リード４，６を引出すように構成さ
れているため、これら各リード４，６に対する外部接続
用のフレキシブルプリント配線板およびコネクタなどを
別個に準備しかつそれぞれを連結する必要があシ、構成
等が複雑で、組立性の面でも面倒でコスト高となるとい
つだ欠点があった。また、ヘッド基板１の一方端部Ａ側
に形成される発熱体抵抗素子２の共通電極５としては、
複数の素子に対し共通に使用するため、その電流容量が
大きいことが必要である程度の幅をもって形成しなけれ
ばならないものであった。そして、このような共通電極
５を発熱体抵抗素子２の一方側でヘッド基板１の端部Ａ
との間に形成することは、この端部Ａから発熱体抵抗素
子２までの距離が大きく必要となるもので、このためこ
のサーマルヘッドを装置に組込んだ場合このサーマルヘ
ッドとロータ（図示せず）との間に給送される感熱記録
紙（図示せず）への印字像がヘッド基板１が邪魔になっ
て印字直後に見ることができず、またヘッド基板１上で
発熱体抵抗素子２に近接する部分に感熱記録紙からの溶
融物がたまｐｌこれが嵩しると印刷性能が劣化するとい
った問題を生じるものであった。Since the external lead leads 4 and 6 are drawn out from B, it is necessary to separately prepare flexible printed wiring boards and connectors for external connection to these leads 4 and 6, and to connect them. However, it has always been disadvantageous in that it has a complicated structure, is difficult to assemble, and is expensive. Further, as the common electrode 5 of the heating element resistance element 2 formed on the one end A side of the head substrate 1,
Since it is commonly used for a plurality of elements, it is necessary to have a large current capacity, and it must be formed with a certain width. Then, such a common electrode 5 is connected to the end A of the head substrate 1 on one side of the heating element resistance element 2.
This requires a large distance from this end A to the heating element resistance element 2. Therefore, when this thermal head is incorporated into a device, there is a distance between this thermal head and the rotor (not shown). The print image on the thermal recording paper (not shown) that is fed between the head board 1 and If the melted material from the heat-sensitive recording paper accumulates in the area adjacent to the heat-sensitive recording paper 2, the problem arises that printing performance deteriorates.

このため、第２図（ａ）（ｂ）に示すように、発熱体抵
抗素子２をヘッド基板１上でその一方端部Ａ側に可能な
限シ接近させて形成し、かつ各素子２に対する個別電極
３および共通電極５をヘッド基板１上で他方端部Ｂ側に
それぞれ延設させ、引出し用リード４，６をヘッド基板
１の他方端部Ｂ側から引出すようにした構造のものが実
公昭５７−５７９８３号公報力どによって提案されてい
るが、このような構造では、ヘッド基板１上での各電極
３゜４の形成にあたってそのパターンが複雑となシ、そ
の生産性および動作上の信頼性に欠けるという欠点があ
った。For this reason, as shown in FIGS. 2(a) and 2(b), the heating element resistance elements 2 are formed on the head substrate 1 as close as possible to one end A side thereof, and each element 2 is A structure in which the individual electrodes 3 and the common electrode 5 are respectively extended to the other end B side on the head substrate 1, and the lead-out leads 4 and 6 are drawn out from the other end B side of the head substrate 1 is actually constructed. Publication No. 57-57983 proposed by Riki et al. However, in such a structure, the pattern is complicated when forming each electrode 3.4 on the head substrate 1, and the productivity and operation are affected. The drawback was that it lacked reliability.

〔発明の概要〕[Summary of the invention]

本発明はこのような事情に鑑みてなされたものであシ、
発熱体抵抗素子をヘッド基板の表面上で一方の端部側に
偏らせて一列に並設するとともに、その一方の電極をこ
のヘッド基板の一方の端部側の側端面に延設し、さらに
これをヘッド基板の裏面を利用してヘッド基板の他方の
端部側に引出すようにすることによって、簡単な構成で
、生産性および動作上の信頼性、さらにはコスト面に優
れ、従来の問題点を一掃することが可能となるサーマル
ヘッドを提案するものである。The present invention has been made in view of these circumstances.
The heating element resistance elements are arranged side by side in a row on the surface of the head substrate so as to be biased toward one end side, and one electrode thereof is extended to the side end surface of the one end side of the head substrate, and By using the back side of the head board to pull it out to the other end of the head board, it has a simple configuration and is superior in terms of productivity and operational reliability, as well as cost. This paper proposes a thermal head that can wipe out spots.

〔実施例〕〔Example〕

以下、本発明を図面に示した実施例を用いて詳細に説明
する０ 第３図（、）（ｂ）（Ｃ）は本発明に係るサーマルヘッ
ドの一実施例を示すものであシ、これらの図において第
１図（ａ）（ｂ）および第２図（、）（ｂ）と同一部分
または相当する部分には同一番号を付してその説明は省
略する。Hereinafter, the present invention will be explained in detail using an embodiment shown in the drawings. Figures 3(a), (b), and (c) show an embodiment of the thermal head according to the present invention. In the figures, the same or corresponding parts as in FIGS. 1(a) and 2(b) and 2(a) and 2(b) are designated by the same reference numerals, and their explanations will be omitted.

さて、本発明によれば、発熱体抵抗素子２からの一方の
リードである共通電極５を、ヘッド基板１の一方の端部
Ａ側の側端面１ａに延設して形成することによって、ヘ
ッド基板１上の発熱体抵抗素子２を一方の端部Ａ付近に
偏らせて並設することができるように構成したところに
特徴を有している。Now, according to the present invention, the common electrode 5, which is one lead from the heating element resistance element 2, is extended and formed on the side end surface 1a on the one end A side of the head substrate 1. It is characterized in that the heating element resistance elements 2 on the substrate 1 are configured so that they can be arranged side by side in a biased manner near one end A.

そして、このような構成によれば、感熱記録紙に対する
印字像を印字直後に確認し得るとともに、この感熱記録
紙からの溶融物がヘッド基板１上にたまるといったこと
もなくなシ、印字性能の面で優れ、さらにヘッド基板１
上での個別電極３等の形成パターンも簡単で、′その生
産性および動作上の信頼性を向上させ得るといった利点
がある０ことで、ヘッド基板１の側端面１ａに形成され
る電極は共通電極５であり１微細パターン化する必要は
なく、蒸着等で膜形成時の取付治具を工夫することによ
って簡単に形成し得るものである。According to such a configuration, the printed image on the thermal recording paper can be confirmed immediately after printing, and the melt from the thermal recording paper does not accumulate on the head substrate 1, and the printing performance is improved. Excellent in surface area, and head substrate 1
The formation pattern of the individual electrodes 3, etc. on the top is simple, and has the advantage of improving productivity and operational reliability.The electrodes formed on the side end surface 1a of the head substrate 1 are common. Since it is the electrode 5, there is no need to form it into a fine pattern, and it can be easily formed by devising a mounting jig when forming a film by vapor deposition or the like.

また、このような構成を採用すれば、発熱体抵抗素子２
から基板端部Ａｔでの距離をほとんどなくし、たとえば
２ｔａ程度に縮小することが可能で、その有用性は大き
い。Moreover, if such a configuration is adopted, the heating element resistance element 2
It is possible to almost eliminate the distance from the substrate end At to, for example, reduce it to about 2ta, which is very useful.

また、本発明によれば、前記ヘッド基板１の側端面１ａ
に形成された共通電極５からの外部引出し用リード６を
、このヘッド基板４の裏面側に付設し、この基板１の他
方端部Ｂ側に引出すようにしたところに特徴を有してい
る。Further, according to the present invention, the side end surface 1a of the head substrate 1
A feature is that an external lead 6 from the common electrode 5 formed in the head board 4 is attached to the back side of the head substrate 4 and is led out to the other end B side of the board 1.

そして、このような構成によれば、この引出し用リード
６を、ヘッド基板１の表面側に形成された個別電極３か
らの引出し用リード４と同一方向に引出すことができる
もので、これによってこれら両リード４，６に対する配
線構造等が簡素化し、たとえば同一のコネクタにより同
時に結線することができるなど、作業性およびコスト面
での有用性は太きい。According to such a configuration, the lead 6 can be led out in the same direction as the lead 4 from the individual electrodes 3 formed on the front surface side of the head substrate 1. The wiring structure for both leads 4 and 6 is simplified, and the wires can be connected simultaneously using the same connector, which is highly useful in terms of workability and cost.

ここで、ヘッド基板１の裏面に付設される引出し用リー
ド６は、たとえばアルミニュウムや鉄等の熱伝導率のよ
い材料にて形成されてなる放熱板８に、第４図（ａ）（
ｂ）に示すようなリード引出し用溝８ａ　を形成するこ
とによって簡単に導びき出すことができるものである。Here, the lead-out leads 6 attached to the back surface of the head substrate 1 are attached to a heat sink 8 made of a material with good thermal conductivity, such as aluminum or iron, as shown in FIG. 4(a).
By forming a lead-out groove 8a as shown in b), it is possible to easily lead out the lead.

なお、本発明は上述した実施例構造に限定されず、各部
の形状、構造等を適宜変形、変更することは自由である
。たとえばヘッド基板１の側端面１ａに形成した共通電
極５から外側に直接引出し用リードを引出すようにして
もよいもので、またこのような共通電極５を用いずに、
各発熱体抵抗素子２からの引出し用リードを個々に付設
するようにしてもよいことは容易に理解されよう。Note that the present invention is not limited to the structure of the embodiment described above, and the shape, structure, etc. of each part may be modified or changed as appropriate. For example, the lead may be drawn out directly from the common electrode 5 formed on the side end surface 1a of the head substrate 1, or without using such a common electrode 5.
It will be easily understood that the leads for leading out from each heating element resistance element 2 may be provided individually.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明に係るサーマルヘッドによ
れば、発熱体抵抗素子の一方電極を、ヘッド基板の一方
の端部の側端面を利用して形成することによ）ヘッド基
板の端部に発熱体抵抗素子を近接して設けるようにした
ので、簡単な構成にもかかわらず、感熱記録紙への印字
像を印字直後に確認し得るとともに、この感熱記録紙か
らの溶融物による印字性能の低下も防止することができ
、しかもヘッド基板上での電極の形成バター／も簡素化
し、その生産性および動作上の信頼性を向上させること
ができ、コスト面でも有利であるといった種々優れた効
果がある。As explained above, according to the thermal head according to the present invention, one electrode of the heating element resistance element is formed using the side end surface of one end of the head substrate. Since the heating element resistance element is provided in close proximity to the thermal recording paper, the printed image on the thermal recording paper can be confirmed immediately after printing, despite the simple structure, and the printing performance due to the molten material from the thermal recording paper is improved. It has various advantages such as preventing the deterioration of the electrodes on the head substrate, simplifying the formation of the electrodes on the head substrate, improving productivity and operational reliability, and being advantageous in terms of cost. effective.

また、本発明によれば、発熱体抵抗素子からの一対のリ
ードを、ヘッド基板の表、裏面を利用して発熱体抵抗素
子とは反対側の他方端部から引出すようにしたので、こ
れら両リードに対する接続構造も簡単となり、装置全体
の構成の簡素化およびコスト低減化を図るうえでその効
果を発揮することができる。Further, according to the present invention, the pair of leads from the heating element resistance element are drawn out from the other end on the opposite side from the heating element resistance element using the front and back surfaces of the head substrate. The connection structure for the leads is also simplified, which is effective in simplifying the overall configuration of the device and reducing costs.

【図面の簡単な説明】[Brief explanation of the drawing]

第１−（ｍ）（ｂ）および第２図（ａ）（ｂ）はそれぞ
れ従来例を示すサーマルヘッドの平面図および側断面図
、第３図（、）（ｂ）（Ｃ）は本発明に係るサーマルヘ
ッドの一実施例を示す平面図、側断面図および背面図、
第４図（、Ｘｂ）は本発明に用いる放熱板の一例を示す
平面図および横断面図である。 １・・−・ヘッド基板、２畳−・・発熱体抵抗素子、３
・・・・個別電極、４・・・・引出し用リード、５・・
・・共通電極、６・・・・引出し用リード、８・・・・
放熱板、８ａ・・・・リード引出し用溝、Ａ・・・・基
板の一方の端部、Ｂ・・・・基板の他方の端部０ 特許出願人　　株式会社田村電機製作所代理人　山川政
綱（０９１１名） 第１図 （ａ） 第２図 （ａ） ｂ　　　　　　　４ （ｂ） （ｂ） Δ1-(m)(b) and 2(a)(b) are a plan view and a side sectional view of a conventional thermal head, respectively, and FIG. 3(,)(b)(C) is an inventive one. A plan view, a side sectional view, and a rear view showing an example of a thermal head according to
FIG. 4 (Xb) is a plan view and a cross-sectional view showing an example of a heat sink used in the present invention. 1...Head board, 2 tatami mats...Heating element resistance element, 3
...Individual electrode, 4...Lead for extraction, 5...
・・Common electrode, 6・・Lead for extraction, 8・・・・
Heat dissipation plate, 8a... lead extraction groove, A... one end of the board, B... the other end of the board 0 Patent applicant Masatsuna Yamakawa, agent of Tamura Electric Manufacturing Co., Ltd. 0911 people) Figure 1 (a) Figure 2 (a) b 4 (b) (b) Δ

Claims (2)

【特許請求の範囲】[Claims] （１）発熱体抵抗素子をヘッド基板の表面上で一方の端
部側に偏らせて一列に並設するとともに、これら発熱体
抵抗素子の共通電極を前記ヘッド基板の表面上で一方の
端部との間に設け、かつこの共通電極を前記ヘッド基板
の一方の端部側の側端面に延設したことを特徴とするサ
ーマルヘッド。(1) The heating element resistance elements are arranged side by side in a row on the surface of the head substrate, biased toward one end, and the common electrode of these heating element resistance elements is arranged on the surface of the head substrate at one end. A thermal head, characterized in that the common electrode is provided between the head substrate and the common electrode is extended to a side end surface on one end side of the head substrate. （２）発熱体抵抗素子をヘッド基板の表面上で一方の端
部側に偏らせて一列に並設するとともに、各発熱体抵抗
素子の一対の外部引出し用リードのうち、勅を前記ヘッ
ド基板の表面上で他方の端部側に引出し、かつ他方のリ
ードを前記ヘッド基板の一方の端部から基板裏面を介し
て同じくヘッド基板の他方の端部側に引出したことを特
徴とするサーマルヘッド。(2) The heating element resistance elements are arranged side by side in a row on the surface of the head substrate so as to be biased toward one end side, and one of the pair of external lead-out leads of each heating element resistance element is connected to the head substrate. and the other lead is led out from one end of the head substrate to the other end of the head substrate via the back surface of the substrate. .
JP58060671A 1983-04-08 1983-04-08 Thermal head Pending JPS59185667A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58060671A JPS59185667A (en) 1983-04-08 1983-04-08 Thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58060671A JPS59185667A (en) 1983-04-08 1983-04-08 Thermal head

Publications (1)

Publication Number Publication Date
JPS59185667A true JPS59185667A (en) 1984-10-22

Family

ID=13149015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58060671A Pending JPS59185667A (en) 1983-04-08 1983-04-08 Thermal head

Country Status (1)

Country Link
JP (1) JPS59185667A (en)

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