JPS60232876A - Saw-tooth for cutting concrete - Google Patents
Saw-tooth for cutting concreteInfo
- Publication number
- JPS60232876A JPS60232876A JP8932484A JP8932484A JPS60232876A JP S60232876 A JPS60232876 A JP S60232876A JP 8932484 A JP8932484 A JP 8932484A JP 8932484 A JP8932484 A JP 8932484A JP S60232876 A JPS60232876 A JP S60232876A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- substrate
- baseboard
- saw blade
- saw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、コンクリートやアスファルト道路などの表面
要分切断するための鋸刃に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a saw blade for cutting surface portions of concrete, asphalt roads, etc.
一般にコンクリートやアスファルト道路の表面層に切り
込み全入れるのに使用される鋸刃に、第3図に示すよう
な構造となっている。第3図において(、)は平面図、
1句はそのA−A断面図である。The saw blade, which is generally used to completely cut into the surface layer of concrete or asphalt roads, has a structure as shown in Figure 3. In Figure 3, (,) is a plan view,
The first phrase is its AA cross-sectional view.
(1)は基板、(2)はチップとよばれており、切断さ
れる対象物の種類によって、その成分が調整される。(1) is called a substrate and (2) is called a chip, and their components are adjusted depending on the type of object to be cut.
チップ(2)の主成分はWC(タングステンカーバイド
)であり、その微粒子がCo、 Su、 Cuなどのバ
インダーと呼ばれる金属で焼結されたもので、その硬度
は非常に高く、耐摩耗性にすぐれている。The main component of the chip (2) is WC (tungsten carbide), whose fine particles are sintered with a metal called a binder such as Co, Su, or Cu, which has extremely high hardness and excellent wear resistance. ing.
次にこの鋸刃の製造方法について説明する。上記のよう
な鋸刃では、基板(1)とチップ(2)が接合で一体化
されているが、接合方法としては、一般に銀ろう付けな
どが使用されている。この方法では、チップ(2)と基
板(1)の接合部を高周波加熱又はバーナー加熱などの
手段により所定温度に加熱した埃ろう材(図示せず)を
添加し、ろう付を行うものであるが、加熱範囲が広いと
加熱法IWが遅くなり、時間がかへるため、これにより
基板(1)の硬度が丁がるなどの問題が多かった。この
ようなことから、最近電子ビーム溶接やレーザ溶接によ
り接合する方式が採用さね、はじめているが、チップ(
2)の材質に問題があり、良好な接合品質を得ることは
困難でアラた。即チ、このチップ(2)の成分は、前述
めようにタングステンカーバイド、などの冒硬1建の金
属で、溶接性が悪いものであるため、溶接時に割れや気
泡などの@接欠陥を生じやすい欠点があった。Next, a method of manufacturing this saw blade will be explained. In the above saw blade, the substrate (1) and the chip (2) are integrated by bonding, and silver brazing or the like is generally used as the bonding method. In this method, a dust brazing material (not shown) heated to a predetermined temperature by means such as high frequency heating or burner heating is added to the joint between the chip (2) and the substrate (1), and brazing is performed. However, if the heating range is wide, the heating method IW becomes slow and takes time, which causes many problems such as the hardness of the substrate (1) decreasing. For these reasons, bonding methods such as electron beam welding and laser welding have recently been adopted and have begun, but chips (
2) There was a problem with the material, and it was difficult to obtain good bonding quality. As mentioned above, the component of this chip (2) is a hard metal such as tungsten carbide, which has poor weldability, so it may cause contact defects such as cracks and bubbles during welding. There were some easy drawbacks.
本発明は、上記の欠点?除< frめなされたもので、
チップの基板との接合側に、基板材質と馴じみがよく、
溶融混仕されても冶金的に一悪影響のない金属?溶射や
肉盛溶接によって付着させるか、又は焼結成形の際に鋳
込むことにより、あらかじめ接合のための境界層會形成
させておき、これt^エイ・ルギ否度ビ〜ム?用いて接
合したことを特徴とするコンクリート切断用鋸刃である
。Does the present invention have the above drawbacks? Exclusion<fr has been made,
The side of the chip that is connected to the substrate has a material that is compatible with the substrate material.
Is there a metal that does not have any negative effects metallurgically even if it is melted and mixed? A boundary layer for joining is formed in advance by adhering by thermal spraying or overlay welding, or by casting during sintering and forming. This is a saw blade for cutting concrete, which is characterized in that it is joined using.
〔発明の実施例〕
第1図(a)は本発明の一実施例?示すチップの外観図
で、第1図(6)はそのA−A断面図である。チップ(
2)の内周9八すなわち基板(1)との接合側に基板材
質c高炭素鋼)となじみがよく、溶接性?よくする金属
全溶着或は鋳込むことによって境界層(20を形成させ
る。しかる後に第2図に示す製造装置により基板(1)
と接合させるものである。[Embodiment of the invention] Is Fig. 1(a) an embodiment of the invention? FIG. 1 (6) is an external view of the chip shown in FIG. Chip (
2) The inner circumference 98, that is, the side to be joined with the substrate (1), is compatible with the substrate material c (high carbon steel) and has good weldability. A boundary layer (20) is formed by welding or casting the entire metal.Then, the substrate (1) is formed using the manufacturing apparatus shown in FIG.
It is to be joined with.
次に第2図によりその接合方法全説明する。第2図(4
)は一部の平面図、C句はそのA−A断面図である。基
板(1)は押え板(3)により支持台(4)に固定ボル
ト(5)によって固定される。チップ(2)はチップ押
え(6)により位置が固定されると共に、加圧バネ(力
により基板(1)に押しつげられる。この加圧バネ(7
)の〃a正圧力、加圧調整ボルト(8)で調整され、チ
ップ加圧移、動量はセットネジ(9)で予め調整される
ようになっている。このようにセットされたのち電子ビ
ームやレーザビームのような冒エネルギ密度ビーム(1
01)の照射により接置一体化される。なお、ピード形
成のため、照射側の裏側には支持台(4)の上に溝←η
が設けられている。Next, the entire joining method will be explained with reference to FIG. Figure 2 (4
) is a partial plan view, and section C is its AA cross-sectional view. The substrate (1) is fixed to the support base (4) by the holding plate (3) with fixing bolts (5). The chip (2) is fixed in position by the chip holder (6) and is pressed against the substrate (1) by the force of the pressure spring (7).
) The positive pressure (a) is adjusted with a pressure adjustment bolt (8), and the tip pressure movement and amount of movement are adjusted in advance with a set screw (9). After being set in this way, a high-energy density beam (1
By irradiation of 01), they are attached and integrated. In addition, in order to form a peak, there is a groove ←η on the support base (4) on the back side of the irradiation side.
is provided.
このような接合方法によれば照射ビームの径が非常に小
さく、幅も狭い加熱で接合がoTi@である。According to such a bonding method, the diameter of the irradiation beam is very small and the width is narrow, and the bonding can be performed using oTi@.
−例として境界層シυは0.5〜10++II++程度
でよいことが確認されている。I又、境界シυの材質は
ニッケルあるいはニッケル合金が多い j
上i己は基板(1)とチップ(2)全基本的には溶融接
合するという考え方であるが、境界層CDのみも一溶融
させ、基板(1)側へ押しつげて圧着させる接合方法も
口J能であり、このような場合には境界Cυの材質は銅
などの低融点金属が適している。- For example, it has been confirmed that the boundary layer υ may be approximately 0.5 to 10++II++. Also, the material of the boundary layer CD is often nickel or nickel alloy.J The idea is that the substrate (1) and the chip (2) are basically fused together, but only the boundary layer CD is also fused together. It is also possible to use a bonding method in which the material is pressed against the substrate (1) side, and in such a case, a low melting point metal such as copper is suitable as the material for the boundary Cυ.
この発明は、従来困難とされていた基板とチップの溶接
品質會同上させたもので、これにより製造された鋸刃は
接合品質も勝れると共に製造コストの低減に役立ってい
る。This invention improves the quality of welding between a substrate and a chip, which has been considered difficult in the past, and the saw blade manufactured thereby has superior bonding quality and is useful for reducing manufacturing costs.
第1図は本発明によるチップ外観図、第2図はチップと
基板との接合装置の概略図、第3凶はコンクリート切断
用鋸刃の外観および断面図である。
1:基板、2:チップ、ろ:押え板、A:支持台、5:
固定ボルト、6:チップ押え、7:加圧バネ、21:境
界層、101:高エネルギ密度ビーム。
なお各図中同一符号は同−捷たけ相当部分を示すものと
する。
代理人 弁理士 木 村 三 明
第1図
(0)
1
(b)
と1 を
第2図
(0)
(b)
第3図
(Q)
ハ
手続補正書(自発)
昭和59年 7月 3[1
特許庁長官殿
1、事件の表示 特願昭 59−89524号2、発明
の名称
コンクリート切断用鋸刃
3、補正をする者
4、代理人FIG. 1 is an external view of a chip according to the present invention, FIG. 2 is a schematic diagram of a device for joining the chip and a substrate, and FIG. 3 is an external view and sectional view of a saw blade for cutting concrete. 1: Substrate, 2: Chip, Filter: Holding plate, A: Support stand, 5:
Fixing bolt, 6: Chip holder, 7: Pressure spring, 21: Boundary layer, 101: High energy density beam. Note that the same reference numerals in each figure indicate the same parts. Agent Patent Attorney Miaki Kimura Figure 1 (0) 1 (b) and 1 to Figure 2 (0) (b) Figure 3 (Q) Written amendment to procedure (voluntary) July 1980 3 [ 1 Mr. Commissioner of the Japan Patent Office 1. Indication of the case: Japanese Patent Application No. 59-89524 2. Title of the invention: Concrete cutting saw blade 3. Person making the amendment 4. Agent
Claims (2)
’7するチップと基板とを高エネルギ密度ビーム?用
いて接合したことを特徴とするコンクリート切断用鋸刃
。(1) Boundary layer k with good weldability at the joint with the inner board
'7 High energy density beam between chip and substrate? A saw blade for cutting concrete, characterized in that it is joined using a saw blade.
境界層として、銅、又はニッケルおよびそれ等の合金を
主成分とする金属でできていることを特徴とする特許請
求の範囲第1項記載のコンクリート切断用鋸刃。(2) A boundary layer with good weldability at the joint part with the substrate on the inner peripheral side of the chip is made of a metal whose main component is copper, nickel, or an alloy thereof. A saw blade for cutting concrete as described in Scope 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8932484A JPS60232876A (en) | 1984-05-07 | 1984-05-07 | Saw-tooth for cutting concrete |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8932484A JPS60232876A (en) | 1984-05-07 | 1984-05-07 | Saw-tooth for cutting concrete |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60232876A true JPS60232876A (en) | 1985-11-19 |
Family
ID=13967484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8932484A Pending JPS60232876A (en) | 1984-05-07 | 1984-05-07 | Saw-tooth for cutting concrete |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60232876A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6322274A (en) * | 1986-07-10 | 1988-01-29 | Noritake Dia Kk | Manufacture of diamond tool |
-
1984
- 1984-05-07 JP JP8932484A patent/JPS60232876A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6322274A (en) * | 1986-07-10 | 1988-01-29 | Noritake Dia Kk | Manufacture of diamond tool |
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