JPS60227433A - Ultrasonic wire bonding head - Google Patents

Ultrasonic wire bonding head

Info

Publication number
JPS60227433A
JPS60227433A JP59084444A JP8444484A JPS60227433A JP S60227433 A JPS60227433 A JP S60227433A JP 59084444 A JP59084444 A JP 59084444A JP 8444484 A JP8444484 A JP 8444484A JP S60227433 A JPS60227433 A JP S60227433A
Authority
JP
Japan
Prior art keywords
wire
wedge
roller
bonding
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59084444A
Other languages
Japanese (ja)
Inventor
Akira Haga
羽賀 彰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP59084444A priority Critical patent/JPS60227433A/en
Publication of JPS60227433A publication Critical patent/JPS60227433A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313Wedge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852Applying energy for connecting
    • H01L2224/85201Compression bonding
    • H01L2224/85205Ultrasonic bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To obtain a wire bonding head with high reliability by clamping wire with a combination of a driving roller and a pressing roller and by driving the driving roller through a pulse motor for supplying wire. CONSTITUTION:When ultrasonic waves are applied to a wedge 8 for bonding a wire 9, a piezoelectric element 10 is shurnk by applying a voltage thereto, whereby an arm 14b is turned around the axis 15 and rollers 12, 13 are separated from each other. The wedge 8 is shifted to draw out the wire 9. The voltage applied to the element 10 is turned OFF when the wedge descends to be bonded. The element 10 is thereby returned to the original state and the arm 14b is turned reversely so that the wire 9 is clamped between the rollers 12 and 13. The wedge 8 is lifted up in this condition. The roller 12 is driven by a pulse motor 11 upon cutting the wire so that further wire 9 is delivered in accordance with the angle of rotation of the roller. The tip of the wire is presented to the tip of the wedge to prepare for the next bonding operation. Usage of the piezoelectric element enables the wire bonder to operate rapidly, and a bonding head with a simple construction and high reliability can be obtained.

Description

【発明の詳細な説明】 〔発明の属する技術分野の説明〕 本発明は、超音波ワイヤボンダーのヘッド部の構造に関
するものである。
DETAILED DESCRIPTION OF THE INVENTION [Description of the technical field to which the invention pertains] The present invention relates to a structure of a head portion of an ultrasonic wire bonder.

〔従来技術の説明〕[Description of prior art]

従来の超音波ワイヤボンダーによるボンディング動作は
以下のとおりである。すなわち、第6図、第7図におい
て、まず第一ボンドを行なった段階で、ソレノイド2が
変位してクランプ本体1が開き、ワイヤ9をフリーにす
る。その後、ボンディングウェッジ8は第二ボンド点へ
移動するが、クランプ1が開のためワイヤ9はウェッジ
8の移動分だけ引き出される。このクランプ開の状態で
、クランプ本体1はモーター5に駆動されるカム4の回
転によって制御され、ボンディングウェッジ8の後方へ
せり上がる。その上限でソレノイド2に印加されていた
電圧がオフとなり、バネ3の張力によってクランプ本体
1が閉じ、再びワイヤ9をホールドする。そして第二ボ
ンドが行なわれてボンデインダウエツジ8が上昇し、ワ
イヤ9切断が行なわれ、同時にモーター5の回転によっ
てカム4が回転し、クランプ本体1がワイヤ9をホール
ドしたままもとの位置へもどる。これによりウェッジ8
の下へワイヤ9が100μm程度送られて、次のボンデ
ィング動作に備える。ところで、以上のべた従来のワイ
ヤボンダーによるときには以下にのべるような欠点があ
る。
The bonding operation using a conventional ultrasonic wire bonder is as follows. That is, in FIGS. 6 and 7, when the first bonding is performed, the solenoid 2 is displaced, the clamp body 1 is opened, and the wire 9 is freed. Thereafter, the bonding wedge 8 moves to the second bonding point, but since the clamp 1 is opened, the wire 9 is pulled out by the amount that the wedge 8 has moved. In this clamp open state, the clamp body 1 is controlled by the rotation of the cam 4 driven by the motor 5, and is raised to the rear of the bonding wedge 8. At the upper limit, the voltage applied to the solenoid 2 is turned off, and the clamp body 1 is closed by the tension of the spring 3, holding the wire 9 again. Then, the second bond is performed, the bonding wedge 8 is raised, the wire 9 is cut, and at the same time, the cam 4 is rotated by the rotation of the motor 5, and the clamp body 1 returns to the original position while holding the wire 9. Return to This results in wedge 8
The wire 9 is fed about 100 μm below the wire 9 in preparation for the next bonding operation. However, the conventional wire bonder described above has the following drawbacks.

すなわち、■ソレノイドによるワイヤクランプ部の変位
幅やバネの張力状態が、調整時から変化した場合に、ク
ランプの開閉応答が悪くなる。■ワイヤフィード時に、
モータによシカムを回転させてクランプ部に往復運動を
与えるため、モーターの負荷が大きく、かつ機械的構造
が複雑になり、ヘッド部を支えるステージへの荷重が大
きく信頼性の低下をまねく、などの欠点である。
That is, (1) If the displacement width of the wire clamp portion by the solenoid or the tension state of the spring changes from the time of adjustment, the opening/closing response of the clamp deteriorates. ■When wire feeding,
Since the motor rotates the cam and gives the clamp part reciprocating motion, the load on the motor is large and the mechanical structure is complicated, which places a large load on the stage that supports the head part, leading to a decrease in reliability, etc. This is a drawback.

〔発明の詳細な説明〕[Detailed description of the invention]

本発明はクランプの開閉動作の応答性、並びにワイヤフ
ィード動作機構を改善し、ボンディング動作の高速化を
図9、しかも信頼性の高い超音波ワイヤボンダー用ヘッ
ドを提供するものである。
The present invention improves the responsiveness of the opening/closing operation of the clamp and the wire feed operation mechanism, thereby increasing the speed of the bonding operation as shown in FIG. 9, and providing a highly reliable head for an ultrasonic wire bonder.

〔発明の構成〕[Structure of the invention]

本発明は開閉可能に連結された一対のアームの各先端に
ワイヤのクランプとなる駆動ローラと加圧ローラとを互
いに向き合せに装着すると共に、両アームの基部間に圧
電変位素子を設置し、前記駆動ローラの回転軸をパルス
モータに連動させたことを特徴とする超音波ワイヤボン
ダー用ヘッドである。
In the present invention, a drive roller and a pressure roller, which serve as wire clamps, are mounted facing each other at the ends of a pair of arms connected to be openable and closable, and a piezoelectric displacement element is installed between the bases of both arms, The head for an ultrasonic wire bonder is characterized in that the rotation axis of the drive roller is linked to a pulse motor.

〔発明の原理と作用の説明〕[Explanation of the principle and operation of the invention]

本発明はワイヤのクランプに、加圧ローラとの組合せを
用い、その開閉制御に圧電素子の変位を利用し、さらに
ワイヤのフィードを加圧ローラと駆動ローラとの間でク
ランプした状態で駆動ローラをパルスモータで駆動する
ことによって行うもの゛である。
The present invention uses a combination of a pressure roller to clamp the wire, uses the displacement of a piezoelectric element to control the opening and closing of the wire, and furthermore, the wire is clamped between the pressure roller and the drive roller while the drive roller This is done by driving the motor with a pulse motor.

〔発明の詳細な説明〕[Detailed description of the invention]

以下に本発明の一実施例について図面を参照して説明す
る。
An embodiment of the present invention will be described below with reference to the drawings.

第1図〜第3図は本発明による超音波ワイヤボンダのヘ
ッド部の構造である。
1 to 3 show the structure of the head portion of the ultrasonic wire bonder according to the present invention.

第4図にヘッドとステージとの関係を示す。図において
、支軸15で連結された一対のアーム14a、+14b
の先端にそれぞれ駆動ローラ12と加圧ローラ13とを
互いに向き合せに装着し、支軸15をはさんで両アーム
14α、14bの後端間に圧電変位素子lOを設置する
。但し、実施例は一方のアーム14αが機体(図示路)
に固定され、他方のアーム14bを可動アームとして固
定側アーム14(Lに、支軸15を中心に回動可能に支
持させた例を示している。16はヘッド取付用孔である
。前記駆動ローラ12は、具体的にはアーム14αの先
端のブラケット17に支持された回転軸18に装着され
ているもので、この回転軸18にはパルスモータ11を
連結する。加圧ローラ13は駆動ローラ12に対する関
係位置を規制して可動側アーム14bの先端に回転可能
に枢支させたものである。
FIG. 4 shows the relationship between the head and the stage. In the figure, a pair of arms 14a and +14b are connected by a support shaft 15.
A drive roller 12 and a pressure roller 13 are mounted facing each other at the tips of the arms 14a and 14b, respectively, and a piezoelectric displacement element 1O is installed between the rear ends of both arms 14a and 14b with the support shaft 15 in between. However, in the embodiment, one arm 14α is attached to the fuselage (as shown)
The figure shows an example in which the fixed arm 14 (L) is supported rotatably around a support shaft 15 with the other arm 14b as a movable arm. 16 is a head mounting hole. Specifically, the roller 12 is mounted on a rotating shaft 18 supported by a bracket 17 at the tip of the arm 14α, and a pulse motor 11 is connected to this rotating shaft 18.The pressure roller 13 is a drive roller. 12, and is rotatably supported at the tip of the movable arm 14b.

圧電変位素子lOは、いわゆる逆圧電効果による歪を駆
動力に利用して両アーム14α、14bを開閉制御する
ものである。圧電変位素子lOに直流電圧が印加された
ときに生ずる縮み変位により支軸15を中心に可動側ア
ーム14bが回動し、加圧ローラ13が駆動ローラ12
より離脱し、逆に直流電圧オフのときに原状に戻り、加
圧ローラ13が駆動ローラ12の周面に圧接され、両者
間でワイヤのクランプが行われる。
The piezoelectric displacement element IO controls the opening and closing of both arms 14α and 14b by using strain caused by the so-called inverse piezoelectric effect as a driving force. The movable arm 14b rotates around the support shaft 15 due to the contraction displacement that occurs when a DC voltage is applied to the piezoelectric displacement element IO, and the pressure roller 13 moves toward the drive roller 12.
When the DC voltage is turned off, the pressure roller 13 is brought into pressure contact with the circumferential surface of the drive roller 12, and the wire is clamped between them.

パルスモータ11はワイヤをクランプした状態で駆動ロ
ーラ12を回転し、ワイヤに一定の送シを与えるもので
ある。
The pulse motor 11 rotates the drive roller 12 while clamping the wire, thereby giving a constant feed to the wire.

第4図において、7はステージ(図示路)に固定されて
いるホーンである。ホーン7はその基部に図示を略すラ
ンジュバン形振動子を備えており、先端にボンディング
ウェッジ8が取付けられている。9はアルミワイヤであ
る。アルミワイヤ9は、ホーン7の孔を通してボンディ
ングウェッジ8に導びかれる。前記駆動ローラ12およ
び加圧ローラ13はワイヤ9をはさんでその両側に配置
されるように関係作置を設定する。19はヘッドカバー
である。前記圧電変位素子loはこのヘッドカバー19
内に収めて外部から隔離する。
In FIG. 4, 7 is a horn fixed to the stage (path shown). The horn 7 has a Langevin type vibrator (not shown) at its base, and a bonding wedge 8 is attached to its tip. 9 is an aluminum wire. Aluminum wire 9 is guided to bonding wedge 8 through a hole in horn 7. The driving roller 12 and the pressure roller 13 are arranged in relation to each other so that they are placed on both sides of the wire 9. 19 is a head cover. The piezoelectric displacement element lo is attached to this head cover 19.
Keep it inside and isolate it from the outside.

第5図(α)〜(ぬに実際のボンディング動作の要領を
示す。第5図(a)は、第一ボンド時の状態である。
FIGS. 5(a) to (n) show the outline of the actual bonding operation. FIG. 5(a) shows the state at the time of first bonding.

ウェッジ8に超音波を印加してワイヤ9をボンドする際
に、圧電変位素子10に電圧を印加すると、圧電変位素
子1oが縮み、その変位を受けてアーム14bが支軸1
5を支点として外側へ回動し、駆動ローラ12と加圧ロ
ーラ13とが離れ、クランプ開の状態となり、ワイヤ9
がフリーとなる。
When bonding the wire 9 by applying ultrasonic waves to the wedge 8, when a voltage is applied to the piezoelectric displacement element 10, the piezoelectric displacement element 1o contracts, and in response to the displacement, the arm 14b moves toward the support shaft 1.
5 as a fulcrum, the drive roller 12 and pressure roller 13 are separated, the clamp is opened, and the wire 9
becomes free.

第5図(b)は第一ボンドが終了し、ウェッジ8が第二
ボンド点に向かう状態を示す。クランプは開状態である
ため、ワイヤ9はフリーに保たれてつエツジ8の移動に
供って引き出される。
FIG. 5(b) shows a state in which the first bond is completed and the wedge 8 moves toward the second bond point. Since the clamp is open, the wire 9 is kept free and drawn out as the thread 8 moves.

第5図(C)は第二ボンド時の状態である。ウェッジ8
が下がシワイヤ9をボンディングする際、圧電変位素子
IOにかかつていた電圧をオフとする。
FIG. 5(C) shows the state at the time of second bonding. wedge 8
When bonding the lower shear wire 9, the voltage previously applied to the piezoelectric displacement element IO is turned off.

これにより圧電変位素子10は元の寸法にもどる。This causes the piezoelectric displacement element 10 to return to its original dimensions.

すると、アーム14bの先端は支軸15を中心として内
側に移動し、駆動ローラ12に加圧ローラ13が圧接す
れ、両ローラ12 、13間でワイヤ9がホールドされ
、クランプ閉状態となる。
Then, the tip of the arm 14b moves inward about the support shaft 15, the pressure roller 13 comes into pressure contact with the drive roller 12, the wire 9 is held between the rollers 12 and 13, and the clamp is closed.

第5図(カに第二ボンド終了時の状態を示す。クランプ
閉の状態でウェッジ8が上方に動くと、ワイヤ9が切断
される。ワイヤ9の切断が行なわれた直後に、パルスモ
ータ−11を駆動して駆動ローラ12を回転させると、
駆動ローラ12と加圧ローラ13とにはさまれているワ
イヤ9はその回転角に応じて送り出される。このワイヤ
9の先端をウェッジ8の先端部に供給し、次のボンディ
ングに備える。
Figure 5 (F) shows the state at the end of the second bond. When the wedge 8 moves upward with the clamp closed, the wire 9 is cut. Immediately after the wire 9 is cut, the pulse motor 11 to rotate the drive roller 12,
The wire 9 sandwiched between the drive roller 12 and the pressure roller 13 is sent out according to its rotation angle. The tip of this wire 9 is supplied to the tip of the wedge 8 in preparation for the next bonding.

〔発明の詳細な説明〕[Detailed description of the invention]

本発明は以上説明したように、まずクランプ開閉用に応
答の速い(μsecオーダー)、圧電素子を用いるため
、動作の高速化を図ることができ、しかも、一つの圧電
変位素子でクランプの開動作と閉動作を行なうことがで
きる。また、ワイヤフィードに一対のローラを用い、か
つローラをパルスモータ−の直接駆動により回転させて
ワイヤフィードを行うため、構造が簡単でクランプ自体
の動作工程が少なくなり、信頼性を向上させることがで
きる。
As explained above, the present invention uses a piezoelectric element with a fast response (on the order of μsec) for opening and closing the clamp, so it is possible to increase the speed of the operation. The closing operation can be performed with In addition, since a pair of rollers is used for wire feeding, and the rollers are rotated by direct drive of a pulse motor, the structure is simple and the operation steps of the clamp itself are reduced, improving reliability. can.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明によるヘッドの正面図、第2図は同側面
図、第3図は同底面図、第4図は本発明によるヘッドを
、ステージに実装した際の斜視図、第5図(a)〜(カ
は本発明によるヘッドを用いた場合のボンディング動作
を示す図、第6図は従来のヘッドの要部斜視図、第7図
は従来のヘッドをステージに組込んだ状態の説明図であ
る。 7・・・ホーン 9・・・Mワイヤ lO・・・圧電変位素子 11・・パルスモーター12
・・・駆動ローラ 13・・・加圧ローラ14α、14
b・・・アーム 15・・・支軸18・・・回転軸 特許出願人 日本電気株式会社 代理人 弁理士 菅 野 中14 第5図 (C)
FIG. 1 is a front view of the head according to the present invention, FIG. 2 is a side view thereof, FIG. 3 is a bottom view thereof, FIG. 4 is a perspective view of the head according to the present invention mounted on a stage, and FIG. 5 (a) to (f) are diagrams showing the bonding operation when the head according to the present invention is used, FIG. 6 is a perspective view of the main parts of the conventional head, and FIG. 7 is a diagram showing the conventional head assembled into the stage. It is an explanatory diagram. 7...Horn 9...M wire lO...Piezoelectric displacement element 11...Pulse motor 12
... Drive roller 13 ... Pressure roller 14α, 14
b...Arm 15...Spindle 18...Rotating shaft Patent applicant NEC Corporation Representative Patent attorney Naka Kanno 14 Figure 5 (C)

Claims (1)

【特許請求の範囲】[Claims] (1)開閉可能に連結された一対のアームの各先端にワ
イヤのクランプとなる駆動ローラと加圧ローラとを互い
に向き合せに装着すると共に、両アームの基部間に圧電
変位素子を設置し、前記駆動ローラの回転軸をパルスモ
ータに連動させたことを特徴とする超音波ワイヤボンダ
ー用ヘッド。
(1) A drive roller and a pressure roller, which serve as wire clamps, are mounted facing each other on the tips of a pair of arms connected so as to be openable and closable, and a piezoelectric displacement element is installed between the bases of both arms, A head for an ultrasonic wire bonder, characterized in that the rotation axis of the drive roller is linked to a pulse motor.
JP59084444A 1984-04-26 1984-04-26 Ultrasonic wire bonding head Pending JPS60227433A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59084444A JPS60227433A (en) 1984-04-26 1984-04-26 Ultrasonic wire bonding head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59084444A JPS60227433A (en) 1984-04-26 1984-04-26 Ultrasonic wire bonding head

Publications (1)

Publication Number Publication Date
JPS60227433A true JPS60227433A (en) 1985-11-12

Family

ID=13830767

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59084444A Pending JPS60227433A (en) 1984-04-26 1984-04-26 Ultrasonic wire bonding head

Country Status (1)

Country Link
JP (1) JPS60227433A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5323948A (en) * 1992-03-12 1994-06-28 Kabushiki Kaisha Shinkawa Wire clamper
WO2023164468A1 (en) * 2022-02-23 2023-08-31 Atieva, Inc. Wire bonding apparatus with active wire feeding for forming wire bonds

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5323948A (en) * 1992-03-12 1994-06-28 Kabushiki Kaisha Shinkawa Wire clamper
WO2023164468A1 (en) * 2022-02-23 2023-08-31 Atieva, Inc. Wire bonding apparatus with active wire feeding for forming wire bonds

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