JPS6022481B2 - Manufacturing method of semiconductor porcelain - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing corrugated semiconductor porcelain having a large number of through holes.

An object of the present invention is to provide a method for producing a base plate made of semiconductor porcelain that can be used during firing in the production of semiconductor porcelain.

Generally, in the production of semiconductor porcelain, the firing process of a molded body obtained from semiconductor porcelain powder is considered to be one of the important steps. Conventionally, when firing this molded body, a stabilized zirconia plate, magnesia plate, or alumina plate is used as a base plate, and the molded body is stacked on these base plates, or a part of the side surface of the molded body is A plurality of molded bodies were erected in contact with the stabilized ZrQ particles sown on the main surface of the bush board, and a plurality of molded bodies were arranged and fired in both directions of the main board so that the main surfaces of the molded bodies faced each other. Regarding the latter method, when competitively produced by such a method, the obtained semiconductor porcelain may partially react with several plates or parts that are in contact with the stabilized ZrQ particles, discolor or deform, and become homogeneous. There was a problem in that it lacked properties, which led to variations in the properties of the semiconductor porcelain.

In addition, in order to improve this, when firing the molded product, a metal plate made of the same or similar composition as the semiconductor porcelain to be manufactured is placed on the base plate, and the molded product is placed on top of it and fired. Ta. However, in this case, it was necessary to fix the molded body, and the workability was also poor. The present invention solves the above-mentioned conventional problems and provides a method for manufacturing semiconductor porcelain that can be widely used as several plates, in which a sheet is made from semiconductor porcelain powder and an organic binder, and the sheet is punched out to form a large number of sheets. After forming the through-holes, the sheet having the large number of through-holes is formed into a wave shape, dried, and fired.

Hereinafter, the present invention will be described with reference to examples.

First, commercially available industrial raw materials BaC03, Ti02, SiQ
, Nb2Q, Mn02 as starting materials, BaC031 mol, Ti. 21 moles, Si. 22.4 mol%, Nb20
A composition of 50.11 mol % and 20.07 mol % of Mn was wet mixed in a ball mill for 20 hours, dried, and temporarily held at 1100° C. for 2 hours.

The temporarily retained raw materials are further ground in a green type using a ball mill and dried. Next, 4 pieces of the dried powder were weighed, and polyvinyl butyral, dibutyl phthalate as a plasticizer,
Add an organic solvent and knead with a ball mill to make a slurry.
A sheet approximately 1 kite thick is made from this slurry using the doctor plate method. This sheet is cut into squares of about 1 square inch on each side, and then punched out using a puncher with a diameter of about 4 sides. After forming the thus obtained sheet having a large number of through holes into a corrugated shape and drying it,
Semiconductor porcelain was produced by firing at ℃ for 1 hour. The figure is a perspective view of barium titanate-based semiconductor porcelain manufactured according to this example.

In the figure, 1 is semiconductor porcelain, which has a waveform structure, and a molded body made of semiconductor porcelain powder is placed in the concave part of this waveform structure. If the molded bodies are erected so that a part of the side surface is in contact with the concave part of the corrugated structure and arranged in the direction of the concave surface of the concave part so that the main surfaces of each molded body face each other, a large number of molded bodies can be arranged and mass production is possible. rich in Further, the size of the curved portion of the above-mentioned wavy structure can be freely prepared from the sheet depending on the size of the molded product to be arranged. Furthermore, by using corrugated semiconductor porcelain having the same composition as the molded body, semiconductor porcelain having homogeneous and stable characteristics can be obtained.
In the figure, 2 is a through hole, and a large number of through holes are provided. By providing this, heat is easily transferred to the molded body during firing, allowing uniform firing, and good air circulation makes reoxidation possible, making it possible to produce semiconductor porcelain with extremely stable properties. Moreover, this corrugated semiconductor porcelain has the advantage that it can be used for multiple firings. Furthermore, such a structure can be used not only for manufacturing the above-mentioned barium titanate-based semiconductor ceramics, but also for manufacturing a wide range of semiconductor ceramics. As described above, the corrugated semiconductor porcelain having a large number of through holes produced by the manufacturing method of the present invention can be used as a base plate during firing over a wide range of areas by arbitrarily changing its composition, and is extremely valuable.

[Brief explanation of drawings]

The figure is a perspective view of semiconductor porcelain manufactured by the manufacturing method of the present invention. 1... Semiconductor porcelain, 2... Through hole.

Claims (1)

[Claims] 1. After producing a sheet from semiconductor porcelain powder and an organic binder and punching out the sheet to provide a large number of through holes,
A method for producing semiconductor porcelain, which comprises forming the sheet provided with a large number of through holes into a wave shape, drying it, and firing it.