JPS60223687A - Cutting method by high energy beam - Google Patents

Cutting method by high energy beam

Info

Publication number
JPS60223687A
JPS60223687A JP59080732A JP8073284A JPS60223687A JP S60223687 A JPS60223687 A JP S60223687A JP 59080732 A JP59080732 A JP 59080732A JP 8073284 A JP8073284 A JP 8073284A JP S60223687 A JPS60223687 A JP S60223687A
Authority
JP
Japan
Prior art keywords
shape
relative movement
energy beam
working
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59080732A
Other languages
Japanese (ja)
Other versions
JPH0216195B2 (en
Inventor
Kiyoshi Inoue
潔 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inoue Japax Research Inc
Original Assignee
Inoue Japax Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inoue Japax Research Inc filed Critical Inoue Japax Research Inc
Priority to JP59080732A priority Critical patent/JPS60223687A/en
Publication of JPS60223687A publication Critical patent/JPS60223687A/en
Publication of JPH0216195B2 publication Critical patent/JPH0216195B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)

Abstract

PURPOSE:To cut a plate material, etc. to a required shape with high accuracy by adjusting a beam to substantially decreased output and repeating plural times the relative movement of the working shape to be applied to a material to be worked thereby working the material. CONSTITUTION:The laser beam focused by a lens 8 is irradiated onto the material 1 to be worked and the relative movement and feed for the required cutting shape is applied to the material 1 by an NC control device 5 which drives motors 3, 4. The beam output of a laser oscillator 6 is decreased substantially to make the beam diameter smaller so that working with high accuracy is made possible. The working is progressed by repeating plural times the relative movement of the working shape at the same locus by the NC control device 5.

Description

【発明の詳細な説明】 本発明はレーザ、マイクロウェーブ、電子ビーム、イオ
ンビーム、プラズマ等の高エネルギビームを用いて板材
等を所要形状にカット加工する方法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of cutting a plate or the like into a desired shape using a high-energy beam such as a laser, microwave, electron beam, ion beam, or plasma.

従来の高エネルギビームを用いた加工は被加工体の材質
、板厚等に対して充分にカット加工ができるビーム出力
を用いて一度にカットするのが通常であった。この場合
、ビーム出力が大きくなるにしたがってビ:ムスポット
を充分絞ることが容易ではなく、また高出力ぞ粗加工す
るため加工形状精度が低下することは避けられなかった
In conventional machining using a high-energy beam, it has been usual to cut the workpiece at once using a beam output that is sufficient for cutting the material, plate thickness, etc. of the workpiece. In this case, as the beam output increases, it is not easy to narrow down the beam spot sufficiently, and since high output requires rough machining, it is inevitable that the accuracy of the machined shape will decrease.

本発明はこの欠点を除去するために提案されたもので、
ビーム出力を高精度加工ができるよう充分低減させた出
力とし、被加工体との間に与える加工形状の相対移動を
複数回繰返して加工することを特徴とする。
The present invention has been proposed to eliminate this drawback.
The beam output is sufficiently reduced to enable high-precision machining, and the machining is performed by repeating the relative movement of the machining shape with the workpiece multiple times.

以下一実施例により本発明を説明する。1は被加工体、
2は被加工体1を固定支持すると共に加工形状送りを与
えるテーブル、3,4はテーブル駆動するX軸、Y軸モ
ータ、5はモータにNC制御信号を加える数値制御装置
、6はレーザ発振器、7は反射鏡、8はレーザビームを
集光するレンズである。
The present invention will be explained below with reference to one example. 1 is the workpiece,
2 is a table that fixedly supports the workpiece 1 and feeds the processed shape; 3 and 4 are X-axis and Y-axis motors that drive the table; 5 is a numerical controller that applies NC control signals to the motor; 6 is a laser oscillator; 7 is a reflecting mirror, and 8 is a lens that focuses the laser beam.

レンズ8によって被加工体1上に集束したレーザビーム
を照射し、被加工体1に所要のカット加工形状の相対移
動送りをNC制御装@5によりモータ3,4を駆動制御
して与える。これにより被加工体1のレーザビーム照射
点が急速に溶解気化し溶断し照射点を移動しながら加工
を続けることにより被加工体1に与える相対移動形状に
切抜き切断加工を行なうことができる。
A focused laser beam is irradiated onto the workpiece 1 by the lens 8, and the motors 3 and 4 are driven and controlled by the NC controller @5 to give the workpiece 1 relative movement and feed in a required cut shape. As a result, the laser beam irradiation point on the workpiece 1 rapidly melts and vaporizes and melts, and by continuing processing while moving the irradiation point, the workpiece 1 can be cut into a relative moving shape.

しかし被加工体1に結ぶビームスポットは高エネルギに
なるにしたがって一般的にスポット径を小さく絞ること
が難しくなる。例えばCO2ガスレーザを用いたとき、
発振器6から出力するビーム径は出力100Wで、約1
21Ilφ、300Wで16+amφ、600Wで20
W1mφとなり、IKWrは381φ程度になる。従っ
てビーム出力を大きくすることはビームカットの溝幅が
大きくなり加工精度が低下する。また高エネルギによっ
て加工面が粗くなり、この点からも゛精度は悪くなる。
However, as the energy of the beam spot connected to the workpiece 1 increases, it generally becomes difficult to narrow down the spot diameter to a small size. For example, when using a CO2 gas laser,
The beam diameter output from the oscillator 6 is 100W and approximately 1
21Ilφ, 16+amφ at 300W, 20 at 600W
W1mφ, and IKWr becomes about 381φ. Therefore, increasing the beam output increases the groove width of the beam cut and reduces the machining accuracy. In addition, the high energy makes the machined surface rough, and from this point as well, the accuracy deteriorates.

そこで本発明は発振出力を充分低減した状態で加工し、
複数回のカットを繰返して加工する。エネルギの低下に
よって最小値で波長近くまでビームスポットを絞ること
ができ、この微細ビームによって加工完了するまで繰返
しカットすることにより精密加工を行なうことができる
Therefore, in the present invention, processing is performed with the oscillation output sufficiently reduced.
Process by repeating multiple cuts. By reducing the energy, the beam spot can be narrowed down to a minimum value close to the wavelength, and precision machining can be performed by repeatedly cutting with this fine beam until the machining is completed.

実験例で説明すれば、YAGレーザで厚さ6II1mの
ルビーのカットを行なうとき、平板出力50Wでビーム
をスポット径を約8μφに集束して加工したとき、同一
軌跡を6回jの繰返し加工でカットした。比較のために
250Wの出力で1回のカットをした場合とカットし内
径寸法精度を示せば次の通りであった。
To explain with an experimental example, when cutting a ruby with a thickness of 6II1 m using a YAG laser, when processing with a flat plate output of 50 W and focusing the beam to a spot diameter of about 8 μφ, the same trajectory can be repeated 6 times j. I cut it. For comparison, the inner diameter dimensional accuracy was shown as follows when cutting was performed once with an output of 250 W.

出力 上側(l1m) 下側(l111)50W 42
.23 42.21 250W 43.11 43.24 このように従来行なわれていたビーム出力を高くして1
回の加工送りでカットする方法によると、寸法精度が本
発明より11II11以上大きくなっており、これに比
較して本発明による方法により精度を高められることが
わかる。また本発明(50W)によれば、カットされた
被加工体の上側と下側の寸法差が約0.02+nn+で
、従来法(250W)の約0.13に比較して垂直カッ
トによりに精度が高いことがわかる。
Output Upper side (l1m) Lower side (l111) 50W 42
.. 23 42.21 250W 43.11 43.24 In this way, the conventional method of increasing the beam output to 1
According to the method of cutting with three processing feeds, the dimensional accuracy is 11II11 or more higher than that of the present invention, and it can be seen that the method according to the present invention can improve accuracy in comparison. In addition, according to the present invention (50W), the dimensional difference between the upper and lower sides of the cut workpiece is approximately 0.02+nn+, which is approximately 0.13 for the conventional method (250W), and the accuracy is improved by vertical cutting. It can be seen that the value is high.

なお本発明による複数回の繰返しカットに於て、加工送
り形状の軌跡を少しづつシフトさせながら、或いは最終
カット時に少し軌跡を拡大もしくは縮小の寸法軌跡で送
り仕上げることもできる。このような繰返し加工の送り
制御は予めNG装置5にプログラム入力しておくことに
よって自動的に且つ高精度に制御して加工することがで
きる。加工形状送りは被加工体を固定とし、レーザビー
ムを照射するヘッド側に送りを与えることもできる。
In the multiple repeated cuts according to the present invention, the locus of the machining feed shape may be shifted little by little, or the locus may be slightly enlarged or reduced in size during the final cut to finish the feed. By inputting a program into the NG device 5 in advance, feed control for such repeated machining can be automatically and accurately controlled. The processing shape feed can also be performed by fixing the workpiece and applying the feed to the head side that irradiates the laser beam.

また本発明は加工用の高エネルギビームとしてマイクロ
波を用いて用いることができ、真空雰囲気として電子、
イオンビームを用いることもできる。
Furthermore, the present invention can be used using microwaves as a high-energy beam for processing, and electrons and
Ion beams can also be used.

【図面の簡単な説明】[Brief explanation of drawings]

図面は本説明の一実施例装置の構成図である。 1、被加工体 2、テーブル 3.4 モータ 5、NC制御装置 6、レーザ発振器 7、反射鏡 8、レンズ 特許出願人 The drawing is a configuration diagram of an embodiment of the device in this description. 1. Workpiece 2. table 3.4 Motor 5. NC control device 6. Laser oscillator 7. Reflector 8. Lens patent applicant

Claims (1)

【特許請求の範囲】 1、被加工体に高エネルギビームを照射するビーム照射
装置を設け、前記被加工体とビーム照射装置の照射ビー
ムとの間に所望のカット加工形状の相対移動を行なわせ
る移動制御装置を設け、相対移動形状に高エネルギビー
ムを照射してカットを行なうものに於て、前記ビーム照
射装置のビーム出力を高精度加工ができるよう充分低減
させた出力とし、前記移動制御装置によって加工形状の
相対移動を複数回繰返して加工することを特徴とする高
エネルギビームカット加工方法。 2、加工形状の相対移動を同一軌跡で複数回繰返・して
加工する特許請求の範囲第1項に記載の高エネルギビー
ムカット加工方法。 3、加工形状の相対移動を縮小若しくは拡大する方向に
シフトする軌跡で複数回繰返して加工する特許請求の範
囲第1項に記載の高エネルギビームカット加工方法。 4、少なくとも最終回の加工形状の相対移動時にビーム
照射装置のビーム出力を前より減少させて繰返し加工す
る特許請求の範囲第1項に記載の高エネルギビームカッ
ト加工方法。
[Claims] 1. A beam irradiation device for irradiating a high-energy beam onto a workpiece is provided, and a desired cut shape is moved relative to the workpiece and the irradiation beam of the beam irradiation device. In a device that is equipped with a movement control device and performs cutting by irradiating a relatively moving shape with a high-energy beam, the beam output of the beam irradiation device is set to be sufficiently reduced to enable high-precision machining, and the movement control device A high-energy beam cut processing method characterized by processing by repeating relative movement of the processed shape multiple times. 2. The high-energy beam cutting method according to claim 1, wherein the relative movement of the processed shape is repeated multiple times on the same locus. 3. The high-energy beam cutting method according to claim 1, in which the relative movement of the processed shape is repeated multiple times with a locus that shifts in the direction of reducing or enlarging. 4. The high-energy beam cutting method according to claim 1, in which the beam output of the beam irradiation device is reduced from the previous time during at least the final relative movement of the processed shape.
JP59080732A 1984-04-20 1984-04-20 Cutting method by high energy beam Granted JPS60223687A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59080732A JPS60223687A (en) 1984-04-20 1984-04-20 Cutting method by high energy beam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59080732A JPS60223687A (en) 1984-04-20 1984-04-20 Cutting method by high energy beam

Publications (2)

Publication Number Publication Date
JPS60223687A true JPS60223687A (en) 1985-11-08
JPH0216195B2 JPH0216195B2 (en) 1990-04-16

Family

ID=13726547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59080732A Granted JPS60223687A (en) 1984-04-20 1984-04-20 Cutting method by high energy beam

Country Status (1)

Country Link
JP (1) JPS60223687A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4886466A (en) * 1972-02-16 1973-11-15
JPS54860A (en) * 1977-06-03 1979-01-06 Nec Home Electronics Ltd Scribing method for semiconductor wafer
JPS57193289A (en) * 1981-05-25 1982-11-27 Toshiba Corp Method and device for cutting of tubular body by laser beam

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4886466A (en) * 1972-02-16 1973-11-15
JPS54860A (en) * 1977-06-03 1979-01-06 Nec Home Electronics Ltd Scribing method for semiconductor wafer
JPS57193289A (en) * 1981-05-25 1982-11-27 Toshiba Corp Method and device for cutting of tubular body by laser beam

Also Published As

Publication number Publication date
JPH0216195B2 (en) 1990-04-16

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