JPH0216195B2 - - Google Patents
Info
- Publication number
- JPH0216195B2 JPH0216195B2 JP59080732A JP8073284A JPH0216195B2 JP H0216195 B2 JPH0216195 B2 JP H0216195B2 JP 59080732 A JP59080732 A JP 59080732A JP 8073284 A JP8073284 A JP 8073284A JP H0216195 B2 JPH0216195 B2 JP H0216195B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- machining
- cut
- processing
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003754 machining Methods 0.000 claims description 18
- 238000005520 cutting process Methods 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims 2
- 238000003672 processing method Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
Description
【発明の詳細な説明】
本発明はレーザ、マイクロウエーブ、電子ビー
ム、イオンビーム、プラズマ等の高エネルギビー
ムを用いて板材等を所要形状にカツト加工する方
法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of cutting a plate or the like into a desired shape using a high-energy beam such as a laser, microwave, electron beam, ion beam, or plasma.
従来の高エネルギビームを用いた加工は被加工
体の材質、板厚等に対して充分にカツト加工がで
きるビーム出力を用いて一度にカツトするのが通
常であつた。この場合、ビーム出力が大きくなる
にしたがつてビームスポツトを充分絞ることが容
易ではなく、また高出力で粗加工するため加工形
状精度が低下することは避けられなかつた。 Conventional machining using a high-energy beam typically involves cutting at once using a beam output that is sufficient for cutting the material, plate thickness, etc. of the workpiece. In this case, as the beam output increases, it is not easy to narrow down the beam spot sufficiently, and since rough machining is performed at high output, it is inevitable that the accuracy of the machined shape will deteriorate.
本発明はこの欠点を除去するために提案された
もので、ビーム出力を高精度加工ができるよう充
分低減させた出力とし、被加工体との間に与える
加工形状の相対移動を複数回繰返して加工するし
かも繰返加工の少なくとも最終回の移動軌跡を縮
小又は拡大する方向にシヤフトさせて加工するこ
とを特徴とする。 The present invention was proposed in order to eliminate this drawback, and the beam output is sufficiently reduced to enable high-precision machining, and the relative movement of the machining shape to the workpiece is repeated multiple times. It is characterized in that the machining is performed by shifting the locus of movement in at least the final round of repeated machining in a direction that reduces or enlarges it.
以下一実施例により本発明を説明する。1は被
加工体、2は被加工体1を固定支持すると共に加
工形状送りを与えるテーブル、3,4はテーブル
駆動するX軸、Y軸モータ、5はモータにNC制
御信号を加える数値制御装置、6はレーザ発振
器、7は反射鏡、8はレーザビームを集光するレ
ンズである。 The present invention will be explained below with reference to one example. 1 is a workpiece, 2 is a table that fixedly supports the workpiece 1 and feeds the processed shape, 3 and 4 are X-axis and Y-axis motors that drive the table, and 5 is a numerical control device that applies NC control signals to the motors. , 6 is a laser oscillator, 7 is a reflecting mirror, and 8 is a lens for condensing the laser beam.
レンズ8によつて被加工体1上に集束したレー
ザビームを照射し、被加工体1に所要のカツト加
工形状の相対移動送りをNC制御装置5によりモ
ータ3,4を駆動制御して与える。これにより被
加工体1のレーザビーム照射点が急速に溶解気化
し溶断し照射点を移動しながら加工を続けること
により被加工体1に与える相対移動形状に切抜き
切断加工を行なうことができる。 A focused laser beam is irradiated onto the workpiece 1 by the lens 8, and the motors 3 and 4 are driven and controlled by the NC control device 5 to provide the workpiece 1 with relative movement and feed in a required cut shape. As a result, the laser beam irradiation point on the workpiece 1 rapidly melts and vaporizes and melts, and by continuing processing while moving the irradiation point, the workpiece 1 can be cut into a relative moving shape.
しかし被加工体1に結ぶビームスポツトは高エ
ネルギになるにしたがつて一般的にスポツト径を
小さく絞ることが難しくなる。例えばCO2ガスレ
ーザを用いたとき、発振器6から出力するビーム
径は出力100Wで、約12mmφ、300Wで16mmφ、
600Wで20mmφとなり、1KWでは38mmφ程度にな
る。従つてビーム出力が大きくすることはビーム
カツトの溝幅が大きくなり加工精度が低下する。
また高エネルギによつて加工面が粗くなり、この
点からも精度は悪くなる。 However, as the energy of the beam spot connected to the workpiece 1 increases, it generally becomes difficult to reduce the diameter of the beam spot. For example, when using a CO 2 gas laser, the beam diameter output from the oscillator 6 is approximately 12 mmφ at an output of 100W, 16mmφ at 300W,
At 600W, it becomes 20mmφ, and at 1KW, it becomes about 38mmφ. Therefore, increasing the beam output increases the groove width of the beam cut, resulting in a decrease in processing accuracy.
Furthermore, the high energy makes the machined surface rough, which also impairs accuracy.
そこで本発明は発振出力を充分低減した状態で
加工し、複数回のカツトを繰返して加工する。エ
ネルギの低下によつて最小値で波長近くまでビー
ムスポツトを絞ることができ、この微細ビームに
よつて加工完了するまで繰返しカツトすることに
より精密加工を行なうことができる。しかも加工
溝幅は繰返加工により上下に傾斜するテーパ状に
形成されることは避けられないから繰返加工中の
少なくとも最終回の移動軌跡を縮小又は拡大する
方向にテーパ誤着分をシフトさせて加工すること
によりシフト方向の加工溝壁面を垂直にカツトし
精密に加工することができる。 Therefore, in the present invention, processing is performed with the oscillation output sufficiently reduced, and cutting is repeated a plurality of times. By reducing the energy, the beam spot can be narrowed down to a minimum value close to the wavelength, and precision machining can be performed by repeatedly cutting with this fine beam until the machining is completed. Moreover, it is inevitable that the width of the machined groove is formed into a tapered shape that slopes upward and downward due to repeated machining, so it is necessary to shift the erroneous taper placement in the direction that reduces or expands the locus of movement at least in the final time during repeated machining. By performing machining using the same method, the wall surface of the machining groove in the shift direction can be cut vertically, allowing for precise machining.
実験例で説明すれば、YAGレーザで厚さ6mm
のルビーのカツトを行なうとき、平均出力50Wで
ビームをスポツト径を約8μφに集束して加工した
とき、同一軌跡を6回の繰返し加工でカツトし
た。比較のために250Wの出力で1回のカツトを
した場合とカツトした内径寸法精度を示せば次の
通りであつた。 To explain with an experimental example, a thickness of 6 mm is produced using a YAG laser.
When cutting a ruby, the beam was focused to a spot diameter of about 8μφ with an average power of 50W, and the same trajectory was cut by repeating the process six times. For comparison, the dimensional accuracy of the inner diameter when cutting was performed once with an output of 250 W was as follows.
出力 上側(mm) 下側(mm)
50W 42.21 42.23
250W 43.11 43.24
このように従来行なわれていたビーム出力を高
くして1回の加工送りでカツトする方法による
と、寸法精度が本発明より1mm以上大きくなつて
おり、これに比較して本発明による方法により精
度を高められることがわかる。また本発明
(50W)によれば、カツトされた被加工体の上側
と下側の寸法差が約0.02mmで、従来法(250W)
の約0.13に比較して垂直カツトによりに精度が高
いことがわかる。 Output Upper side (mm) Lower side (mm) 50W 42.21 42.23 250W 43.11 43.24 According to the conventional method of increasing the beam output and cutting with one machining feed, the dimensional accuracy is 1 mm or more higher than the present invention. It can be seen that compared to this, the method according to the present invention can improve accuracy. Furthermore, according to the present invention (50W), the dimensional difference between the upper and lower sides of the cut workpiece is approximately 0.02 mm, compared to the conventional method (250W).
It can be seen that the accuracy is higher for vertical cuts compared to about 0.13.
又本発明(50W)により2回目以降の加工軌跡
を4μmづつ内側にシフトさせて加工したときは、
6回の繰返加工によつて内側の加工溝壁面ほとん
ど垂直にカツトできた。 Also, when machining is performed by shifting the machining trajectory inward by 4 μm from the second time onward using the present invention (50W),
By repeating the process six times, the inner groove wall could be cut almost vertically.
尚、各繰返し回毎にシフトしなくとも、少なく
とも最終回のみのシフトでも有効で、そのときは
シフト量をテーパが形成される寸法差に相当する
値に設定すれば垂直カツトができる。又カツトし
て外側を精密仕上げする場合はシフト制御を外方
に制御することによつて外側の溝壁を垂直に高精
度にカツトして仕上げることができる。このよう
な繰返し加工の送り制御は予めNC装置5にプロ
グラム入力しておくことによつて自動的に且つ高
精度に制御して加工することができる。加工形状
送りは被加工体を固定とし、レーザビームを照射
するヘツド側に送りを与えることもできる。 Incidentally, even if the shift is not carried out every time it is repeated, it is effective even if the shift is performed only at least in the last cycle, and in that case, if the shift amount is set to a value corresponding to the dimensional difference in which the taper is formed, a vertical cut can be made. In addition, when cutting and precision finishing the outside, by controlling the shift control outward, the outer groove wall can be vertically cut and finished with high precision. By inputting a program into the NC device 5 in advance, feed control for such repeated machining can be performed automatically and with high precision. The processing shape feed can also be performed by fixing the workpiece and applying the feed to the head side that irradiates the laser beam.
また本発明は加工用の高エネルギビームとして
マイクロ波を用いて用いることができ、真空雰囲
気として電子、イオンビームを用いることもでき
る。 Further, the present invention can be used using microwaves as a high-energy beam for processing, and electron or ion beams can also be used as a vacuum atmosphere.
図面は本説明の一実施例装置の構成図である。
1……被加工体、2……テーブル、3,4……
モータ、5……NC制御装置、6……レーザ発振
器、7……反射鏡、8……レンズ。
The drawing is a configuration diagram of an embodiment of the device in this description. 1... Workpiece, 2... Table, 3, 4...
Motor, 5... NC control device, 6... Laser oscillator, 7... Reflector, 8... Lens.
Claims (1)
ム照射装置を設け、前記被加工体とビーム照射装
置の照射ビームとの間に所望のカツト加工形状の
相対移動を行なわせる移動制御装置を設け、相対
移動形状に高エネルギビームを照射してカツトを
行なうものに於て、前記ビーム照射装置の制御に
よりビーム出力を高精度加工ができるよう充分低
減させた出力とし、前記移動制御装置の制御によ
り加工形状の相対移動を複数回繰返して加工する
ようにし、且つ繰返加工中の少なくとも最終回の
移動軌跡を縮小又は拡大する方向にシフトさせて
加工することを特徴とする高エネルギビームカツ
ト加工方法。1. A beam irradiation device for irradiating a high-energy beam onto a workpiece is provided, a movement control device is provided for relative movement of a desired cut shape between the workpiece and the irradiation beam of the beam irradiation device, When cutting is performed by irradiating a moving shape with a high-energy beam, the beam irradiation device is controlled to reduce the beam output sufficiently to enable high-precision machining, and the movement control device is controlled to cut the processed shape. A high-energy beam cut processing method, characterized in that processing is performed by repeating the relative movement of a plurality of times, and the processing is performed by shifting the locus of movement of at least the last time during the repeated processing in a direction of reducing or enlarging.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59080732A JPS60223687A (en) | 1984-04-20 | 1984-04-20 | Cutting method by high energy beam |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59080732A JPS60223687A (en) | 1984-04-20 | 1984-04-20 | Cutting method by high energy beam |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60223687A JPS60223687A (en) | 1985-11-08 |
JPH0216195B2 true JPH0216195B2 (en) | 1990-04-16 |
Family
ID=13726547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59080732A Granted JPS60223687A (en) | 1984-04-20 | 1984-04-20 | Cutting method by high energy beam |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60223687A (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4886466A (en) * | 1972-02-16 | 1973-11-15 | ||
JPS54860A (en) * | 1977-06-03 | 1979-01-06 | Nec Home Electronics Ltd | Scribing method for semiconductor wafer |
JPS57193289A (en) * | 1981-05-25 | 1982-11-27 | Toshiba Corp | Method and device for cutting of tubular body by laser beam |
-
1984
- 1984-04-20 JP JP59080732A patent/JPS60223687A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4886466A (en) * | 1972-02-16 | 1973-11-15 | ||
JPS54860A (en) * | 1977-06-03 | 1979-01-06 | Nec Home Electronics Ltd | Scribing method for semiconductor wafer |
JPS57193289A (en) * | 1981-05-25 | 1982-11-27 | Toshiba Corp | Method and device for cutting of tubular body by laser beam |
Also Published As
Publication number | Publication date |
---|---|
JPS60223687A (en) | 1985-11-08 |
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