JPS60219523A - Photosensor - Google Patents

Abstract

PURPOSE:To prevent the protective sealant of wire bonding from leaking and creeping to the back side of a substrate, by linearily infiltrating an adhesive into the gaps between first and second substrates and a third substrate in the vicinity of wire bonding in a wire like form. CONSTITUTION:Four stripes of an adhesive 2 are linearily applied to a substrate 1 in the longitudinal direction and first and second substrates 3, 4 are adhered by this adhesive 2. Therefore, an adhesive area is wider than a conventional one and the stable adhesion of the substrates 3, 4 is obtained as a whole. Because the adhesive 2 is linearily and continuously infiltrated into gaps between the substrates 3, 4 and the substrate 1 in the vicinity of wire bonding 5, the sealant 6 of a wire bonding 5 is prevented from leaking to the back sides of the substrates 3, 4. Therefore, the upper end part of the wire bonding 5 is not exposed even if the sealant 6 is cured and, because no sealant 6 is leaked, there is no deformation possibility of the substrates 3, 4.

Description

[Detailed Description of the Invention] [Technical Field] The present invention relates to a photosensor, and in particular, a first substrate on which a photoelectric conversion element using a thin film semiconductor is formed, and a second substrate having a drive section for the photoelectric conversion element. The present invention relates to a photosensor in which the first and second substrates are each fixed to a third substrate with an adhesive, and the first and second substrates are connected to each other by wire bonding.

[Prior art]

A conventional example of this type of photosensor is shown in FIG.

In the figure, 1 is a third substrate, 2 is an adhesive, 3 is a first substrate, 4 is a second substrate, 5 is wire bonding, and 6 is a wire bonding protective sealant. The first and second substrates 3, 4 and the third substrate 1 are bonded together by applying adhesive 2 to about six locations on each of the first and second substrates 3.4.

Therefore, when the wire bonding 5 is coated with the sealant 6, the sealant 6 gradually leaks from the gap between the adhesives 2 to the back sides of the substrates 3 and 4, and the sealant When the wire binding 6 was hardened, the upper end of the wire binding 5 was sometimes exposed. Further, the sealing agent 6 is applied to the substrate 3,
In addition to flowing into the back side of the substrates 3 and 4, there were also problems such as the substrates 3 and 4 being warped.

[Purpose of the invention]

The present invention was developed in view of the above circumstances, and its purpose is to provide a photosensor in which a protective sealant for wire endings does not leak to the back side of the substrate.

[Summary of the invention]

The gist of the present invention is that a first substrate on which a photoelectric conversion element is formed using a thin film semiconductor, and a second substrate having a drive section for the photoelectric conversion element are each fixed to a third substrate with an adhesive. , and a photosensor in which the first substrate and the second substrate are connected to each other by wire bonding,
A photosensor characterized in that a gap between the first and second substrates and the third substrate in the vicinity of the wire ending is filled with the adhesive in a continuous line. 6ru.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to FIGS. 2 to 4. Note that the same parts as in FIG. 5 are given the same reference numerals.

In the photosensor according to the present invention, as shown in FIG. 1, the adhesive 2 is applied in four linear stripes in the longitudinal direction of the third substrate 1, and
The first square and the second substrates 3 and 4 are bonded with these four lines of adhesive 2. Therefore, the adhesion area is wider than in the past, and stable adhesion of the entire substrate 3.4 can be obtained. Further, since the adhesive 2 is continuously filled in a linear manner in the gap between the substrates 3 and 4 and the substrate 1 in the vicinity 1c of the wire bonding 5, the sealing agent 6 of the wire bonding 5 is applied to the substrate 1. , No leakage to the back side of 4. Therefore, even when the sealant 6 hardens, the upper end of the wire yI bonding 5 will not be exposed. Furthermore, since there is no leakage of the sealant 6, there is no fear that the substrates 3 and 4 will be deformed.

Next, the steps for assembling the photosensor will be explained in detail. First, as shown in FIG. 2, four stripes of adhesive 2 are applied onto the third substrate 1 by screen printing. At this time, the two inner lines of adhesive are applied so as to be located near the wire endings of the first and second substrates 3 and 4 to be bonded later.

Next, a first substrate 3 on which a photoelectric conversion element using a thin film semiconductor is formed, and a second substrate 3 having a drive section for the photoelectric conversion element.
As shown in FIG. 3, each of the substrates 4 is pasted onto the adhesive 2, and pressure is applied to the substrates 3 and 4 so that the adhesive 2 spreads uniformly. After that, the boards 3 and 4 are connected by wire ending.

Next, 5 portions of the wire binding are coated with a protective sealant 6 using a dispenser as shown in FIG. This completes the assembly process of the 7 otosensors.

Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment and can be modified in various ways.

〔Effect of the invention〕

As described above, in the present invention, since the adhesive for bonding the first and second substrates is continuously filled in a linear manner in the vicinity of the wire bonding, the sealant for the wire bonding is applied to the first and second substrates. There is no leakage to the back side of the second board. Therefore, when the sealant hardens, the upper end of the book or wire will not be exposed. Since there is no leakage of the sealant, there is no risk of deformation of the substrate 3.4.

Furthermore, since the bonding area is wider than conventionally, stable bonding of the first and second substrates can be achieved overall.

[Brief explanation of the drawing]

1 to 4 show an embodiment of the present invention, in which FIG. 1(a) is a plan view of an auto sensor, and FIG.
) is a sectional view taken along the line B-B as above, and FIGS. 2 to 4 are assembly process diagrams of the photosensor. Further, FIG. 5 shows a conventional photosensor, and FIG. 5(a) is a plan view of the photosensor, and FIG. 5(b) is a sectional view taken along line A--A of the same. l...Third substrate, 2...Adhesive, 3...First substrate, 4...Second substrate, 5...Wire bonding, 6...Wire bonding protective sealing agent. Chest 1 Figure 81 (0) Fifth fork (0) --1 Mount A (b) 2 Figure 2 Figure 3 Figure 4

Claims (1)

[Claims] (1) A first substrate on which a photoelectric conversion element using a thin film semiconductor is formed and a second substrate having a drive section for the photoelectric conversion element are each fixed to a third substrate with an adhesive, and the In a photosensor in which a first substrate and a second substrate are connected to each other by a wire binding, a gap between the first and second substrates and the third substrate in a portion near the wire binding; A photosensor characterized in that the above adhesive is filled in a continuous line.