JPS6021522A - レジストパタ−ン形成方法 - Google Patents
レジストパタ−ン形成方法Info
- Publication number
- JPS6021522A JPS6021522A JP58128912A JP12891283A JPS6021522A JP S6021522 A JPS6021522 A JP S6021522A JP 58128912 A JP58128912 A JP 58128912A JP 12891283 A JP12891283 A JP 12891283A JP S6021522 A JPS6021522 A JP S6021522A
- Authority
- JP
- Japan
- Prior art keywords
- resist
- cooling
- baking
- temperature
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000015572 biosynthetic process Effects 0.000 title description 3
- 238000001816 cooling Methods 0.000 claims abstract description 78
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 239000002245 particle Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 41
- 238000011161 development Methods 0.000 claims description 9
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 239000002904 solvent Substances 0.000 abstract description 6
- 239000006185 dispersion Substances 0.000 abstract 1
- 230000008016 vaporization Effects 0.000 abstract 1
- 238000009834 vaporization Methods 0.000 abstract 1
- 230000035945 sensitivity Effects 0.000 description 20
- 238000012545 processing Methods 0.000 description 13
- 230000018109 developmental process Effects 0.000 description 8
- 238000009826 distribution Methods 0.000 description 7
- 238000010894 electron beam technology Methods 0.000 description 7
- 239000012298 atmosphere Substances 0.000 description 6
- 238000011282 treatment Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 3
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 238000009529 body temperature measurement Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000000609 electron-beam lithography Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58128912A JPS6021522A (ja) | 1983-07-15 | 1983-07-15 | レジストパタ−ン形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58128912A JPS6021522A (ja) | 1983-07-15 | 1983-07-15 | レジストパタ−ン形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6021522A true JPS6021522A (ja) | 1985-02-02 |
| JPH0546091B2 JPH0546091B2 (enrdf_load_stackoverflow) | 1993-07-13 |
Family
ID=14996435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58128912A Granted JPS6021522A (ja) | 1983-07-15 | 1983-07-15 | レジストパタ−ン形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6021522A (enrdf_load_stackoverflow) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4717645A (en) * | 1983-01-19 | 1988-01-05 | Tokyo Shibaura Denki Kabushiki Kaisha | Method and apparatus for forming resist pattern |
| JPS63107116A (ja) * | 1986-10-24 | 1988-05-12 | Fujitsu Ltd | レジストベ−キング方法 |
| US4777116A (en) * | 1985-10-22 | 1988-10-11 | Kuraray Co., Ltd. | Method for manufacturing phase gratings of a combination pattern-refraction modification type |
| JPS63161803U (enrdf_load_stackoverflow) * | 1987-04-10 | 1988-10-21 | ||
| JPS63259559A (ja) * | 1987-04-16 | 1988-10-26 | Hitachi Condenser Co Ltd | 印刷配線板のパタ−ン形成方法 |
| JPH01133621U (enrdf_load_stackoverflow) * | 1988-02-29 | 1989-09-12 | ||
| KR100369571B1 (ko) * | 1994-12-28 | 2003-04-10 | 도레이 가부시끼가이샤 | 도포방법및도포장치 |
| US8053174B2 (en) | 2003-02-05 | 2011-11-08 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method for wiring |
| CN104204550A (zh) * | 2012-03-23 | 2014-12-10 | 萱场工业株式会社 | 流体压缸 |
-
1983
- 1983-07-15 JP JP58128912A patent/JPS6021522A/ja active Granted
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4717645A (en) * | 1983-01-19 | 1988-01-05 | Tokyo Shibaura Denki Kabushiki Kaisha | Method and apparatus for forming resist pattern |
| US4777116A (en) * | 1985-10-22 | 1988-10-11 | Kuraray Co., Ltd. | Method for manufacturing phase gratings of a combination pattern-refraction modification type |
| JPS63107116A (ja) * | 1986-10-24 | 1988-05-12 | Fujitsu Ltd | レジストベ−キング方法 |
| JPS63161803U (enrdf_load_stackoverflow) * | 1987-04-10 | 1988-10-21 | ||
| JPS63259559A (ja) * | 1987-04-16 | 1988-10-26 | Hitachi Condenser Co Ltd | 印刷配線板のパタ−ン形成方法 |
| JPH01133621U (enrdf_load_stackoverflow) * | 1988-02-29 | 1989-09-12 | ||
| KR100369571B1 (ko) * | 1994-12-28 | 2003-04-10 | 도레이 가부시끼가이샤 | 도포방법및도포장치 |
| US8053174B2 (en) | 2003-02-05 | 2011-11-08 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method for wiring |
| US8460857B2 (en) | 2003-02-05 | 2013-06-11 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method for wiring |
| CN104204550A (zh) * | 2012-03-23 | 2014-12-10 | 萱场工业株式会社 | 流体压缸 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0546091B2 (enrdf_load_stackoverflow) | 1993-07-13 |
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