JPS60213044A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To prevent an adhesion to a pellet of Si ships generated on wafer dicing by melting wax on the pellet stuck surface of a substrate by spraying a solvent against wax and separating and washing the pellet. CONSTITUTION:When a heated solvent 14 is sprayed against the lower surface of a glass plate 1 set to the upper section of a squirrel cage 11 from nozzles 12, wax on which pellets 5 are stuck is melted, and the pellets 5 fall and are received on the bottom of the squirrel cage 11 while the heated solvent 14 containing Si chips 10 is stored on the bottom of a washing tank 13. When the heated solvent 14 is sprayed continuously, the dropping heated solvent 14 collides with the pellets 5 falling on the bottom of the squirrel cage 11, and washes the pellets 5. Accordingly, Si chips generated on wafer dicing do not adhere, and the pellets can be separated.

Description

[Detailed description of the invention] B. Industrial application field The present invention involves cutting and peeling semiconductor wafers.

The present invention relates to a method for manufacturing a semiconductor device in which the semiconductor device is separated into two parts.

There are several methods for cutting a semiconductor wafer (hereinafter simply referred to as a wafer) into pellets, one of which is to attach the wafer to a substrate such as a glass plate with wax. There is a method of completely canting (through-cutting) separating wafers using a separating tool.

This method will be explained based on FIGS. 1 and 2. First, in FIG. 1, (1) is a substrate, such as a glass plate, (2)
is a wafer, the wafer (2) is attached to the glass plate (1) with wax (3), and the surface of this wafer (2) is coated with wax (4) using a guising tool (4).
3) Pellet (
5) Separate into (5)-・. At this time, each bellet (5)
remain attached to the glass plate (1), then melt the wax (3) and attach each pellet (5) to the glass plate (1).
1) A step of separating from ' and washing is required.

This process will be explained based on Fig. 2. In the figure (6
) is a storage tank for organic solvent (7), (8) is a mesh basket immersed in organic solvent (7) in storage tank (6), and a glass plate (1) with pellets (5) pasted thereon. ) is placed in the organic solvent (7) by soaking it in the S-containing solvent (7).
) is stirred and further heated by the heater (9) attached to the storage tank (6). When solvent A (7) is heated, the wax (3) melts in the reservoir (6) and the pellet (5) separates from the glass plate (1).

When the pellets (5) are received in a mesh basket (8) and washed in another tank, pelletization of the wafer (2) is completed.

The above-mentioned pelletizing process is suitable for producing relatively large pellets such as diode pellets because it uses a guissing tool.

Problems that the invention aims to solve.

First, when the wafer (2) is completely canted with the dicing saw (4), chips of St are generated, and as shown in Fig. Chips (10) accumulate. Therefore, the glass plate (1) with the pellets (5) pasted thereon is treated with an organic solvent (
7) When immersed in the tank (6), the above Sl (10)
Precipitates within. (See Figure 2) However, when the organic solvent (7) is stirred to melt the wax (3) and separate the pellets (5) from the glass plate (1), the Si < (6), floating on the surface of the separated pellet (5)
) adheres to the bump electrode (5a) and cannot be completely removed even after cleaning. For example, as shown in FIG.
1o) causes poor welding.

Furthermore, if the separated pellets (5) rub against each other during stirring of the organic solvent (7), the pellet surface may be damaged, and the 5io2 layer (5b) in particular may become brittle. When St < zu (1o) adheres there, since St is hard, the other debris (1o) gets into the brittle 5102 layer (5b) as shown in Figure 3, which deteriorates the insulation of the pellet (5). Its characteristics may deteriorate.

23. Structure of the Invention The present invention provides that after a semiconductor wafer pasted to a substrate with wax is completely cut and separated into pellets, the pellets of the substrate are pasted by spraying a wax solvent onto the surface to melt the wax. By dropping the pellets from the substrate, separating and cleaning them, it is possible to prevent Sl scraps generated during wafer dicing from adhering to the pellets.

E. Example Hereinafter, an example of the present invention will be described based on the schematic sectional view of FIG. 4. In the figure, (11) is a mesh basket in which a glass plate (1) with a beret (5) attached is set in a predetermined position. (11) is set at the top. (12)
is a nozzle that sprays heated organic solvent, and its opening (1
2a) penetrates the side of the mesh basket (11) and
) It is attached so as to face the bottom surface of the upper glass plate (1). (13) is a cleaning tank arranged to receive the mesh basket (11), and a nozzle (12) is installed on the side of the cleaning tank.
A heating organic solvent (14) (hereinafter referred to as heating solvent) injected from a nozzle (work 2) is stored therein.

The operation of the present invention will be explained below based on the above configuration. First, as shown in Fig. 4, a heated solvent (14) is sprayed from a nozzle (12) onto the lower surface (the surface where the bullet is attached) of the glass plate (1) set on the top of the mesh basket (11).
The heated solvent (14) enters the groove (2") and the pellet (5"
) melts and only the pellet (5) falls, and the pellet (5) is received at the bottom of the net (11), and the heated solvent (1
4) is stored at the bottom of the cleaning tank (13).

Then, when the heating solvent (14) is further sprayed,
The dripping heating solvent (14) hits the pellets (5) that have fallen to the bottom of the mesh basket (11) and washes the pellets (5). However, when the pellets (5) fall from the glass plate (1), they rub against each other to a certain extent, but unlike the prior art, they are not continuously stirred, so there are fewer scratches on the surface.

Further, in order to clean the beret 1-(5) at the bottom of the net basket (11), a nozzle may be provided with the opening facing the bottom of the net basket (11) as shown by the chain line in FIG. , cleaning tank (13
) in the heated solvent (14) stored at the bottom of the
) will precipitate, so if the supernatant of the heated solvent (14) is removed, the heated solvent (14) can be reused.

Next, as a modification of the above embodiment, as shown in FIG. 5, the pellets can be attached by placing the glass plate (1) with its surface facing sideways and spraying the heated solvent (14) from the nozzle (12). Alternatively, the falling pellets may be caught by a net plate instead of the net cage (IO).

According to the present invention, a semiconductor wafer pasted to a substrate with wax is completely cut by dicing and separated into pellets, and then a wax solvent is sprayed onto the surface of the semiconductor wafer to attach the pellets to the substrate. By melting the pellets and catching the pellets falling from the substrate with a net, etc., the pellets can be separated without adhering to the Si (dust) generated during wafer dicing, and various inconveniences caused by Si (dust) can be removed. In addition, when the heated solvent falls after spraying, the heated solvent hits the pellets held at the bottom of the screen corner, so the pellets can be separated and cleaned at the same time.Moreover, the pellets can be separated from the substrate easily. Since there is less friction between the pellets during processing, there are fewer scratches on the pellet surface and the processing yield is improved.

[Brief explanation of drawings]

Fig. 1 is a schematic diagram of a cross section of a semiconductor wafer pasted on a substrate and completely canted, and a schematic diagram of a separating tool; Fig. 2 is a schematic cross-sectional diagram of a device based on a conventional pellet separation method;
Fig. 13 is a cross-sectional view of a pellet with Si < Si attached in the apparatus of Fig. 2, Fig. j84 is a schematic cross-sectional view of an embodiment based on the method for manufacturing a semiconductor device according to the present invention, and Fig. 5 is a modification thereof. FIG. 3 is a schematic cross-sectional view of an example. (1)...Substrate, (2)...Semiconductor wafer, (3
)・−wax, (5)・・−pellet, (14)−・
・Wax solvent.

Claims (1)

[Claims] (1) After completely cutting the semiconductor wafer attached to the substrate with wax and separating it into pellets, attaching the pellets to the substrate involves spraying a wax solvent on the surface to melt the wax, and then dropping the pellet from the substrate. Separate and
A method for manufacturing a semiconductor device, which includes cleaning.