JP4116184B2 - Electronic board member recovery apparatus and electronic board member recovery method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for recovering a member of an electronic substrate that makes it possible to reuse or facilitate the use of a member such as solder from a discarded electronic substrate, and more particularly, excessive heating of a mounted component of the electronic substrate during melting of the solder The present invention relates to an electronic board member recovery method and an electronic board member recovery apparatus in which oxidation of solder is suppressed.
[0002]
[Prior art]
Conventionally, disposal of electrical products (household appliances) mounted with electronic substrates was by landfill, but in recent years, harmful lead components eluted from the solder of electronic substrates in discarded products due to the effects of acid rain, and groundwater It has become a problem as it can cause contamination.
[0003]
As measures to prevent such environmental pollution, the amount of waste is reduced by collecting and reusing various discarded home appliances, and the release of harmful substances into the ground and the atmosphere due to the processing of valuable materials recovery. This includes reducing the amount, and also reducing the amount of new products to control the depletion of resources related to manufacturing and reduce the amount of energy used for manufacturing.
[0004]
Among these, electronic substrates used in various home appliances are formed by etching copper foil having a thickness of several microns to several tens of microns held by an epoxy resin impregnated into a glass fiber mat into an arbitrary pattern. Using a molten solder containing lead in the form of wiring, elements such as semiconductors, ICs and capacitors are arranged and fixed.
[0005]
For this reason, there is a possibility that lead will be eluted together with the solder by acid water such as rain water and soil water when the various household appliances are disposed of after being put into use and disposed of by means such as being left unattended or buried in the soil. is there.
[0006]
In order to deal with such problems and to make effective use of resources (solder), it has been proposed to collect and reuse the solder provided in the electronic board.
For example, Japanese Patent Application Laid-Open No. 9-316549 describes a method of removing a solder that is scraped off and collected by rubbing with a roll-shaped wire brush or cup brush of an electronic board. In this solder removal method, the electronic substrate is melted by heating with an infrared heater and then scraped off with a wire brush or the like.
[0007]
FIG. 5 is a view showing a solder removal apparatus described in the above-mentioned JP-A-9-316549. According to this solder removal method, a plurality of wire brushes 6 are arranged in parallel at right angles to the transport direction of the electronic substrate 2 transported by the conveyor 1, and laterally (perpendicular to the transport direction) in the gap. A soldering device used for connecting and fixing various elements of the mounting component 4 when the electronic substrate 2 passes over them. The solder can be heated and melted and then scraped off, so that the solder can be easily recovered.
[0008]
[Problems to be solved by the invention]
However, in the conventional solder removal apparatus, when the entire electronic substrate is preheated to a temperature higher than the melting point of the solder, the mounted components (various elements) are not subjected to any measures against heating to melt the solder. However, since it is exposed to high temperatures, it suffers from thermal stress, and the collected electronic components fail, making it impossible or difficult to reuse.
[0009]
In addition, since preheating and melting of the electronic substrate are performed in the air, the tin and lead components of the molten solder combine with oxygen in the air to promote the formation of oxides, and the ratio of the collected solder oxides is large. Become. This means that when the collected solder is remelted and recycled, the ratio of non-recyclable tin and lead oxide increases, and the solder recovery efficiency, which is the ratio of the reclaimed solder amount to the recovered solder amount, decreases. It becomes. Lowering of the solder recovery efficiency increases the regeneration cost, and solder oxides that cannot be regenerated must be detoxified at the time of disposal, resulting in increased costs.
[0010]
In addition, according to the means for scraping and scraping the solder included in the electronic substrate using a roll-shaped wire brush or the like, it is impossible to remove the solder in the through hole, and at the time of scraping The solder held in the gaps between the wires constituting the wire brush without falling would not be sufficiently removed and collected, such as causing re-adhesion.
[0011]
In addition, in the portion where the lead wire of the element mounted in the through hole is fixed by penetrating, not only excessive vibration is given to the element but also the lead wire is deformed and is difficult to come off, making it difficult to collect the element. There was also the problem of doing.
[0012]
Furthermore, since the conventional solder removal device is configured to supply hot air by heating after the heat source circuit takes in the outside air, the energy consumed by the heat source for generating the hot air is excessively large. There was a problem of reducing the contribution to environmental protection.
[0013]
The present invention has been made to solve such a problem, and efficiently collects the solder included in the discarded electronic board without causing deterioration due to oxidation, and damages various mounted elements. It is an object of the present invention to provide an electronic board member recovery method and an electronic board member recovery apparatus that can be recovered without any problem and have improved energy efficiency required to execute them.
[0014]
[Means for Solving the Problems]
An electronic board member recovery apparatus according to the present invention includes a conveyor for transporting an electronic board in which mounted components are connected by solder, an apparatus for supplying nitrogen gas or an inert gas, and a nitrogen gas or inert gas supplied from the apparatus. A circulation circuit having a heating means for heating the gas, and an air supply fan for blowing the nitrogen gas or inert gas heated by the heating means to the electronic substrate, and the molten solder provided in the circulation circuit are removed. The apparatus includes a solder removing unit and an outside air intrusion suppressing unit that suppresses the outside air from entering when nitrogen gas or an inert gas is blown onto the electronic substrate.
[0015]
Further, the solder removal means is constituted by a rotating wire brush.
[0016]
Moreover, it is set as the structure which sprays the nitrogen gas or inert gas heated with the heating means from the downward direction of an electronic substrate.
[0017]
The wire brush is driven by heated nitrogen gas or inert gas in the circulation circuit.
[0018]
Moreover, a wire brush is rotated with the rotation speed of 500 rpm or more.
[0019]
Further, a suction pump for sucking nitrogen gas or inert gas blown to the electronic substrate is provided in the circulation circuit.
[0020]
Further, the gas pressure in the circulation circuit is controlled so as to satisfy the relationship of air pressure> suction pump pressure> air atmosphere.
[0021]
Further, the apparatus is provided with a solder suction collecting means for sucking and collecting the solder removed by the solder removing means.
[0022]
Further, the solder suction recovery means is constituted by a suction pump provided in the circulation circuit.
[0023]
Further, the outside air entry suppression means is constituted by a plastic curtain.
[0024]
In addition, when the electronic board is transported into the outside air entry suppression means by a conveyor, it is preliminarily heated with heated nitrogen gas or inert gas.
[0025]
The heating means is configured to heat nitrogen gas or inert gas to 250 ° C. or higher.
[0026]
Further, the solder removing means is configured to remove the solder by the wind pressure of nitrogen gas or inert gas.
[0027]
In addition, a conveyor that holds and conveys an electronic board in which mounted components are connected by solder while being inclined or overturned so that the mounted components can be dropped by its own weight, a device for supplying nitrogen gas or inert gas, A circulation circuit having heating means for heating the nitrogen gas or inert gas supplied from the apparatus, and an air supply fan for blowing the nitrogen gas or inert gas heated by the heating means to the electronic board; and solder And a member removing means for detaching and removing the mounted parts by the wind pressure of nitrogen gas or an inert gas, and an outside air entry suppressing means for suppressing the entry of outside air when the nitrogen gas or the inert gas is blown onto the electronic substrate. It is provided.
[0028]
In addition, a net shelf for receiving mounted components is provided at the lower part of the electronic substrate, and nitrogen gas or inert gas is sprayed from the soldering surface of the electronic substrate in the through hole penetration direction.
[0029]
The method for recovering an electronic substrate according to the present invention is a method for recovering a member of an electronic substrate having a mounting component such as an electronic component, in a state in which the step of cleaning the electronic substrate and the entry of outside air into the electronic substrate are suppressed, The step of melting the solder by blowing heated nitrogen gas or inert gas onto the electronic substrate, the step of removing the molten solder, and the electronic substrate from which the solder has been removed are cooled by nitrogen gas or inert gas. A process and a process of recovering the mounted component from the electronic substrate from which the solder has been removed.
[0030]
Further, before the solder is melted, the electronic substrate is preheated with heated nitrogen gas or inert gas.
[0031]
Moreover, in the process of removing the molten solder, the wire brush is rotated to remove the solder.
[0032]
Also, heated nitrogen gas or inert gas is blown from below the electronic substrate.
[0033]
Moreover, the drive source of a wire brush is rotated by the heated nitrogen gas or inert gas.
[0034]
Moreover, a wire brush is rotated with the rotation speed of 500 rpm or more.
[0035]
Also, an apparatus for supplying nitrogen gas or inert gas, a heating means for heating the nitrogen gas or inert gas supplied from the apparatus, and the nitrogen gas or inert gas heated by the heating means to the electronic substrate Nitrogen gas or inert gas blown to the electronic substrate is sucked by a suction pump provided in a circulation circuit having an air supply fan to be blown.
[0036]
Further, the gas pressure in the circulation circuit is controlled so as to satisfy the relationship of air pressure> suction pump pressure> air atmosphere.
[0037]
Also, an apparatus for supplying nitrogen gas or inert gas, a heating means for heating the nitrogen gas or inert gas supplied from the apparatus, and the nitrogen gas or inert gas heated by the heating means to the electronic substrate The solder removed by the solder removing means is sucked and collected by the solder suction collecting means having an air supply fan to be blown.
[0038]
The solder removed by the solder removing means is sucked and collected by a suction pump provided in the circulation circuit.
[0039]
In addition, the entrance of outside air from the electronic substrate entrance is suppressed by a plastic curtain.
[0040]
In the second step, nitrogen gas or inert gas is heated to 250 ° C. or higher with a heat exchanger.
[0041]
Further, the solder is removed by the wind pressure of nitrogen gas or inert gas.
[0042]
Also, there is a method for recovering a member of an electronic substrate having a mounting component such as an electronic component, a step of cleaning the electronic substrate, and a conveyor that holds the electronic substrate in an inclined or overturned state so that the mounting component can be dropped by its own weight. The solder is melted by blowing the heated nitrogen gas or inert gas onto the electronic substrate while suppressing the ingress of outside air into the electronic substrate, and the molten solder and mounted components are nitrogen gas or inert. The method includes a step of separating and removing by the wind pressure of the gas, and a step of separating and recovering the mounted component dropped from the electronic substrate with a net shelf.
[0043]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
Embodiment 1 FIG.
1 and 2 are views showing Embodiment 1, FIG. 1 is a cross-sectional view of a solder recovery apparatus, and FIG. 2 is an electronic board member recovery process diagram. As shown in FIG. 1, the solder recovery apparatus includes a conveyor 1, a nitrogen gas circulation circuit 2 that is an example of a circulation circuit, and a solder recovery unit 3. Among them, the nitrogen gas circulation circuit 2 heats the nitrogen gas supplied from the nitrogen cylinder 4 which is an example of an apparatus for supplying nitrogen gas or an inert gas by a heat exchanger 5 which is an example of a heating means, and supplies air. After the hot air nitrogen gas is blown to the lower part of the electronic substrate 11 having the mounted component 12 by the fan 6, an operation is performed in which the air is supplied again as a heated gas circulating in the circuit through the filter 8 by the suction pump 9.
[0044]
In addition, the solder recovery unit 3 performs an operation of rotating the wire brush 7, which is an example of a solder removing unit for scraping off the solder 13 attached to the electronic substrate 11, with a nitrogen gas supply / exhaust flow. It is.
[0045]
Reference numeral 14 denotes a plastic curtain, which is an example of an outside air ingress suppression means, which causes oxidation due to intrusion of outside air (air) into the blowing of nitrogen gas, which also causes a reduction in recovery efficiency. The entrance is closed with a plastic curtain 14 to reduce the gap with the electronic substrate 11.
[0046]
Next, the operation will be described with reference to FIGS.
First, in the first step, the electronic substrate 11 separated and collected from the discarded home appliances is subjected to simple cleaning to remove dust and oil. The dust adhering to the electronic board 11 interferes with detailed processing of the mounted component 12 and the circuit configuration when the solder 13 is recycled, and forms a bridge between the circuits or forms a hook-shaped protrusion at the component fixing point. It is preferable that the discharge in the circuit such as tracking is promoted sufficiently because it accelerates the discharge in the circuit such as tracking, lowers the conductive property due to the oil mixture and causes migration, and further causes a short circuit of the circuit.
[0047]
Thereafter, it is put into a solder recovery apparatus according to the present invention. The introduced electronic board 11 is conveyed by the conveyor 1, and in the nitrogen gas circulation circuit 2 which is a part of the solder recovery apparatus that achieves the second step, the supplied nitrogen gas is always 250 ° C. or higher in the heat exchanger 5. The solder 13 is melted by forcibly blowing it from the lower direction of the electronic substrate 11 by the air supply fan 6. Nitrogen gas is stable at high temperatures, has no toxicity, and can be supplied at low cost, so it is suitable for reducing the oxygen concentration in the circuit atmosphere of this apparatus.
[0048]
At this time, it is preferable that the electronic substrate 11 is preheated to about 100 ° C. before the nitrogen gas blowing step, and the entire electronic substrate 11 on which a member having a large heat capacity is mounted is heated by the preheating, so that the nitrogen gas blowing step is performed. The heating load is reduced, and the solder 13 is efficiently melted.
According to the solder recovery apparatus according to the present invention, this apparatus is filled with heated nitrogen gas, and the high temperature state is inevitably maintained, so that the electronic substrate 11 is heated separately for preheating. There is no need to do.
[0049]
Next, the third step is a solder scraping step, where the melted solder 13 is scraped off by the wire brush 7 and sucked into the nitrogen gas circulation circuit 2 together with hot air nitrogen gas. At this time, the sucked solder 13 is deposited in the solder recovery tank 10 by its own weight. Further, the nitrogen gas pressure in the nitrogen gas circulation circuit 2 is controlled so that the feed pressure> the suction pump pressure> the atmospheric atmosphere, thereby suppressing the mixing of air into the nitrogen gas circulation circuit 2 and increasing the nitrogen gas. It can be circulated at a concentration.
The suction pump pressure is not the pressure between the suction pump 9 and the filter 8 that is the suction part, but the pressure in the solder recovery tank 10.
[0050]
At this time, the rotation of the wire brush 7 is driven by wind power of the circulating nitrogen gas by attaching a blade to the center of the wire brush body. The solder recovery apparatus according to the present invention includes a windmill in the nitrogen gas circulation circuit 2, and the wire brush 7 rotates using the windmill as a driving source. Therefore, the adjustment of the rotation speed is determined by the flow rate (flow velocity). The number of rotations of the wire brush 7 at this time depends on the flocking density of the wires constituting the wire brush 7, but it is preferable to secure at least 500 rpm, and if it is less than that, the solder 13 remains without being scraped off. Or may remain attached to the wire and adhere to the electronic substrate 11 again.
[0051]
Further, the nitrogen gas used at this time reaches the heat exchanger 5 through the nitrogen gas circulation circuit 2 and is again used for melting the solder 13 in the second step by heating again. That is, the nitrogen gas circulates in the sealed circuit with a repetition of a process that is used again while maintaining a high temperature state without being released outside the system of the apparatus.
[0052]
Furthermore, since the nitrogen gas blowing in the solder recovery method of the present invention causes oxidation due to the intrusion of outside air (air), which may cause a decrease in recovery efficiency, the entrance of the electronic board 11 of the apparatus is a plastic curtain 14. It is preferable to reduce the gap with the electronic substrate 11 by means such as closing.
[0053]
Next, in the fourth step, cooling is performed by nitrogen gas that flows from the top of the electronic substrate 11 in the direction of transport of the electronic substrate 11 from which the solder 13 has been removed in the previous step (flow). This facilitates the recovery of the mounted component 12 and also prevents excessive heating of various elements mounted on the electronic board 11 carried into the apparatus, which causes damage or breakage due to thermal stress. The effect that it can suppress is obtained.
[0054]
In the fifth step, the mounted component 12 is recovered by inverting the electronic substrate 11 from which the solder 13 has been removed and applying vibration to the electronic substrate 11 to drop the mounted component 12 from the electronic substrate 11.
[0055]
In the sixth step, the collected solder 13 is remelted and separated into a recycled material and a waste material such as an oxide, thereby collecting and recycling the solder 13. Since the solder 13 collected by this apparatus is hardly deteriorated by oxidation, desired characteristics may be ensured depending on its use, and thus the regeneration process can be omitted.
[0056]
According to the above-described embodiment, since the molten solder 13 is removed and recovered after the hot air nitrogen gas is blown onto the soldering surface of the electronic substrate 11 to heat the solder 13, the solder disposed in a convex manner In addition to being able to heat efficiently through the part, the electronic substrate 11 and the solder 13 can be easily recovered without getting wet.
[0057]
In addition, after removing the heated and melted solder 13 by blowing hot air on the soldering surface of the electronic substrate 11, the mounting component 12 that has been fixed by the solder 13 is recovered, so that the heat accompanying the heating is applied to the mounting component 12. Since it is difficult to be transmitted, damage can be suppressed, and the possibility of reuse of the collected mounted component 12 is increased.
[0058]
In addition, since the hot air blown to the soldering surface is nitrogen gas, the recovered solder 13 can be prevented from being oxidized, thereby improving the regeneration efficiency.
[0059]
Moreover, since the solder 13 is scraped off by the wire brush 7 and the solder 13 is removed, the solder 13 can be efficiently removed from the electronic substrate 11 and can be recovered in a short time with a high yield.
[0060]
Further, by reheating the nitrogen gas to an arbitrary temperature in the nitrogen gas circulation circuit 2 by the heat exchanger 5, the hot air nitrogen gas is blown onto the soldering surface of the electronic substrate 11 and melted, and the molten solder 13 Therefore, the heating efficiency of the hot air is good, and the solder 13 can be separated and separated from the electronic substrate 11 without excessively heating, so that the running cost can be reduced.
[0061]
Further, scraping of the melted solder 13 is performed by the rotating wire brush 7 driven by the supply / exhaust flow of hot air nitrogen gas in the nitrogen gas circulation circuit 2, so that the energy required for rotational driving of the wire brush 7 can be reduced, and running Cost is reduced.
[0062]
In the above-described embodiment, the solder 13 is melted using nitrogen gas. However, an inert gas such as argon gas or helium gas may be used.
As an apparatus for supplying nitrogen gas or inert gas, for example, the nitrogen cylinder 4 is shown. However, in addition to the cylinder, it may be directly supplied from the plant like a nitrogen gas or inert gas production apparatus.
Moreover, although what scraped off mechanically using a wire brush was shown as a solder removal means, it is good also as a structure which removes the solder 13 by the wind pressure of nitrogen gas or an inert gas.
In addition to the heat exchanger, for example, a heater may be used as the heating means.
[0063]
Embodiment 2. FIG.
3 and 4 are diagrams showing the second embodiment, FIG. 3 is a cross-sectional view of the solder recovery apparatus, and FIG. 4 is an electronic board member recovery process diagram. As shown in FIG. 3, the conveyor 1, the nitrogen gas circulation circuit 2, the solder recovery unit 3, and the member recovery unit 15 are configured. Among these, the nitrogen gas circulation circuit 2 heats the nitrogen gas supplied from the nitrogen cylinder 4 with the heat exchanger 5, and the hot air nitrogen gas is supplied downward from the soldering surface of the electronic board 11 by the air supply fan 6. After spraying, the operation of supplying the heated gas circulating through the circuit again through the filter 8 is performed.
[0064]
In addition, the solder recovery unit 3 which is an example of a member removing unit melts and removes the solder 13 attached to the electronic substrate 11 with hot air nitrogen gas, and then removes the solder 13 and the mounted component from the electronic substrate 11 by the net shelf 16. It is characterized in that the operation of separating and collecting 12 is performed.
The mounted component 12 is deposited on the member collection unit 15.
[0065]
Next, the operation will be described with reference to FIGS.
First, in the first step, the electronic substrate 11 separated and collected from the discarded home appliances is subjected to simple cleaning to remove dust and oil. By this step, it is possible to prevent the dust or oil adhering to the electronic substrate 11 from interfering with the circuit of the electronic substrate 11 and reducing or damaging its function.
[0066]
Thereafter, it is put into a solder recovery apparatus according to the present invention. The loaded electronic board 11 is conveyed while being held in a state of being inclined or overturned by the conveyor 1. At this time, since the electronic substrate 11 is preheated to about 100 ° C., the temperature of the entire electronic substrate 11 on which a member having a large heat capacity is mounted is reduced, and the load of the heating process in the nitrogen gas blowing process is reduced. Melting is performed efficiently. Nitrogen gas is stable at high temperatures, has no toxicity, and can be supplied at low cost, so it is suitable for reducing the oxygen concentration in the circuit atmosphere of this apparatus.
[0067]
Furthermore, in the second step, heated nitrogen gas is blown onto the soldering surface from above the soldering surface in the through hole penetration direction. Nitrogen gas to be used for spraying is constantly heated to 250 ° C. or higher in the heat exchanger 5, and is forcibly blown in a state of being pressurized by the air supply fan 6 from the soldering surface direction of the electronic substrate 11. In addition to melting the solder 13, the wind pressure also eliminates the solder 13 in the through hole.
[0068]
In addition, since the net shelf 16 serving as the net-like drop receiving surface of the mounting component 12 is provided below the electronic substrate 11, the heated nitrogen gas is blown from the top to the bottom of the soldering surface in the through hole penetration direction. Thus, the mounting component 12, together with the solder 13, in particular, the component in which the terminal wire penetrates and is fixed in the through hole is also recovered and removed by wind pressure.
[0069]
At this time, the detached mounting component 12 falls onto the net shelf 16 together with the molten solder 13, and then only the molten solder 13 is separated and further falls to the bottom of the apparatus to become solder scraps. Both the solder 13 removed directly from the surface of the electronic substrate 11 and the solder 13 separated after dropping onto the net shelf 16 are sucked into the nitrogen gas circulation circuit 2 together with the hot air nitrogen gas. At this time, the sucked solder 13 is deposited in the collection tank of the solder collection unit 3 by its own weight.
[0070]
Further, the nitrogen gas used at this time reaches the heat exchanger 5 through the nitrogen gas circulation circuit 2 and is again used for melting the solder 13 in the second step by heating again. That is, the nitrogen gas circulates in the sealed circuit with a repetition of the process that is used again while maintaining a high temperature state without being released outside the system of the apparatus.
[0071]
Further, if the outside air (air) enters when nitrogen gas is blown, the solder 13 is oxidized, which may cause a reduction in recovery efficiency. Therefore, the electronic substrate 11 entrance of the solder recovery device is blocked by a plastic curtain 14 or the like. It is preferable to reduce the gap with the electronic substrate 11.
[0072]
In the third step, the mounted component 12 is recovered by separating the mounted component 12 dropped from the electronic substrate 11 by the net shelf 16.
[0073]
In the fourth step, the collected solder 13 is remelted and separated into a recycled material and a waste material such as an oxide, thereby collecting and reclaiming the solder 13. Since the recovered solder 13 is hardly deteriorated by oxidation, the desired characteristics may be ensured depending on the application, and thus the regeneration process can be omitted.
[0074]
In the above-described embodiment, the solder 13 is melted using nitrogen gas. However, an inert gas such as argon gas or helium gas may be used.
[0075]
【The invention's effect】
An electronic board member recovery apparatus according to the present invention includes a conveyor for transporting an electronic board in which mounted components are connected by solder, an apparatus for supplying nitrogen gas or an inert gas, and a nitrogen gas or inert gas supplied from the apparatus. A circulation circuit having a heating means for heating the gas, and an air supply fan for blowing the nitrogen gas or inert gas heated by the heating means to the electronic substrate, and the molten solder provided in the circulation circuit are removed. Since it has a structure equipped with a solder removing means and an outside air intrusion suppressing means for suppressing the outside air from entering when nitrogen gas or inert gas is blown onto the electronic substrate, it can be efficiently heated through the solder portion, It can be easily recovered without wetting the substrate or solder.
Further, since heat accompanying heating is difficult to be transmitted to the mounted component, damage can be suppressed, and the possibility of reuse of the collected mounted component is increased.
Further, since the hot air blown to the soldering surface is nitrogen gas or inert gas, the recovered solder can be prevented from being oxidized, so that the regeneration efficiency is improved.
In addition, since the entry of air is suppressed by the outside air entry suppression means, the solder is hardly oxidized and the regeneration efficiency is improved.
[0076]
Further, since the solder removing means is constituted by a rotating wire brush, the solder can be efficiently removed from the electronic substrate, and can be recovered at a high recovery rate in a short time.
[0077]
Moreover, since it was set as the structure which sprays the nitrogen gas or inert gas heated with the heating means from the downward direction of an electronic substrate, it can heat efficiently through a solder part.
[0078]
Further, since the wire brush is driven by the heated nitrogen gas or inert gas in the circulation circuit, the energy required for rotational driving of the wire brush can be reduced, and the running cost is reduced.
[0079]
In addition, since the wire brush is rotated at a rotation speed of 500 rpm or more, it is possible to prevent the solder from remaining without being scraped off or remaining attached to the wire brush and adhering to the electronic substrate again.
[0080]
In addition, since the circulation circuit is provided with a suction pump for sucking nitrogen gas or inert gas blown onto the electronic substrate, the nitrogen gas or inert gas reaches the heating means through the circulation circuit and is re-heated to re-solder the solder. Can be used for melting.
[0081]
In addition, the gas pressure in the circulation circuit is controlled so as to satisfy the following conditions: feed pressure> suction pump pressure> atmospheric atmosphere, so that mixing of air into the circulation circuit is suppressed, and nitrogen gas or inert gas is highly concentrated. It can be circulated.
[0082]
Further, by providing the solder suction recovery means for sucking and recovering the solder removed by the solder removal means, it is possible to suppress scattering of the solder that has been melted and dropped, thereby improving the solder recovery efficiency.
[0083]
Also, since the solder suction recovery means is composed of the suction pump provided in the circulation circuit, the pump and circuit required for the solder suction become unnecessary, the equipment can be simplified, and the running cost is reduced by reducing the energy required for suction. Can be achieved.
[0084]
In addition, since the outside air entry suppression means is constituted by a plastic curtain, air can be blocked by the plastic curtain and solder oxidation can be suppressed.
[0085]
In addition, when the electronic board is transported into the outside air entry suppression means by a conveyor, it is preheated by heated nitrogen gas or inert gas, so the electronic board on which a member having a large heat capacity is mounted by preheating. The whole is heated, the heating load in the nitrogen gas blowing process is reduced, and the solder is efficiently melted.
[0086]
Further, since the heating means is configured to heat the nitrogen gas or the inert gas to 250 ° C. or higher, the melting of the solder is efficiently performed.
[0087]
Further, since the solder removing means is configured to remove the solder by the wind pressure of nitrogen gas or inert gas, the solder can be recovered without excessively heating the solder.
[0088]
In addition, a conveyor that holds and conveys an electronic board in which mounted components are connected by solder while being inclined or overturned so that the mounted components can be dropped by its own weight, a cylinder that supplies nitrogen gas or inert gas, A circulation circuit having heating means for heating nitrogen gas or inert gas supplied from a cylinder, and an air supply fan for blowing the nitrogen gas or inert gas heated by the heating means onto the electronic substrate, solder, and mounting components And a member removing means for removing and removing the gas by an air pressure of nitrogen gas or an inert gas, and an outside air ingress suppressing means for suppressing the entry of outside air when the nitrogen gas or the inert gas is blown onto the electronic substrate. As a result, the heating efficiency of the hot air is good, and it is possible to recover the mounting parts to the electronic board without deforming the solder without excessively heating the solder. After that the running cost can be reduced, thereby improving the work efficiency.
[0089]
In addition, a net shelf for receiving mounted components is provided at the bottom of the electronic board, and nitrogen gas or inert gas is sprayed from the top to bottom of the electronic board in the through hole penetration direction. The solder in the surface and the through hole can be efficiently dropped and collected, and the solder and the mounted component can be separated by the net shelf, so that the mounted component and the solder can be efficiently collected and separated.
[0090]
The method for recovering an electronic substrate according to the present invention is a method for recovering a member of an electronic substrate having a mounting component such as an electronic component, in a state where the step of cleaning the electronic substrate and the entry of outside air into the electronic substrate are suppressed The step of melting the solder by blowing heated nitrogen gas or inert gas onto the electronic substrate, the step of removing the molten solder, and the electronic substrate from which the solder has been removed are cooled by nitrogen gas or inert gas. By providing the process and the process of recovering the mounted component from the electronic substrate from which the solder has been removed, it is possible to efficiently heat through the solder portion and to easily recover without wetting the electronic substrate and the solder.
Further, since heat accompanying heating is difficult to be transmitted to the mounted component, damage can be suppressed, and the possibility of reuse of the collected mounted component is increased.
Further, since the hot air blown to the soldering surface is nitrogen gas or inert gas, the recovered solder can be prevented from being oxidized, so that the regeneration efficiency is improved.
In addition, since the entry of air is suppressed by the outside air entry suppression means, the solder is hardly oxidized and the regeneration efficiency is improved.
[0091]
In addition, since the electronic substrate is preheated with heated nitrogen gas or inert gas before the solder is melted, the temperature of the entire electronic substrate on which the member having a large heat capacity is mounted is increased by the preheating, and the nitrogen gas blowing step The heating load is reduced, and the solder is efficiently melted.
[0092]
Moreover, since the solder is removed by rotating the wire brush in the step of removing the melted solder, it is possible to efficiently remove the solder from the electronic substrate, so that the solder can be recovered at a high recovery rate in a short time.
[0093]
Moreover, since heated nitrogen gas or inert gas is sprayed from the bottom of the electronic substrate, it can be efficiently heated through the solder portion.
[0094]
Moreover, since the drive source of a wire brush is rotated by the heated nitrogen gas or inert gas in a circulation circuit, the energy required for the rotation drive of a wire brush can be reduced, and a running cost reduces.
[0095]
In addition, since the wire brush is rotated at a rotation speed of 500 rpm or more, it is possible to prevent the solder from remaining without being scraped off or remaining attached to the wire brush and adhering to the electronic substrate again.
[0096]
Moreover, since the nitrogen gas or the inert gas blown to the electronic substrate is sucked by the suction pump provided in the circulation circuit, the nitrogen gas or the inert gas reaches the heat exchanger through the circulation circuit, and again by heating again. It can be used for melting of solder.
[0097]
In addition, the gas pressure in the circulation circuit is controlled so as to satisfy the following conditions: feed pressure> suction pump pressure> atmospheric atmosphere, so that mixing of air into the circulation circuit is suppressed, and nitrogen gas or inert gas is highly concentrated. It can be circulated.
[0098]
In addition, since the solder removed by the solder removing means is sucked and collected by the solder sucking and collecting means, it is possible to suppress the scattering of the molten and dropped solder and improve the efficiency of collecting the solder.
[0099]
In addition, the suction pump provided in the circulation circuit sucks and collects the solder removed by the solder removal means, eliminating the need for a pump and circuit required for the solder suction, simplifying the device, and energy required for the suction. The running cost can be reduced.
[0100]
In addition, since the entrance of outside air from the entrance of the electronic board is suppressed by the plastic curtain, the air can be blocked by the plastic curtain and the oxidation of the solder can be suppressed.
[0101]
Further, since the nitrogen gas or the inert gas is heated to 250 ° C. or higher by the heating means, the melting of the solder is performed efficiently.
[0102]
Moreover, since the solder is removed by the wind pressure of nitrogen gas or inert gas, the solder can be recovered without excessively heating the solder.
[0103]
Also, there is a method for recovering a member of an electronic substrate having a mounting component such as an electronic component, a step of cleaning the electronic substrate, and a conveyor that holds the electronic substrate in an inclined or overturned state so that the mounting component can be dropped by its own weight. The solder is melted by blowing the heated nitrogen gas or inert gas onto the electronic substrate in a state that suppresses the ingress of outside air to the electronic substrate, and the molten solder and mounted components are nitrogen gas or inert. Efficient hot air heating efficiency and excessive heating of the solder by providing a process of removing and removing by the wind pressure of gas and a process of separating and recovering mounted components dropped from the electronic board with a net shelf In addition, since it is possible to simultaneously collect the mounted parts on the electronic substrate without deforming them, the running cost can be reduced and the work efficiency can be improved.
[Brief description of the drawings]
FIG. 1 shows the first embodiment and is a cross-sectional view of a solder recovery apparatus.
FIG. 2 is a diagram showing the first embodiment and is an electronic substrate member recovery process diagram.
FIG. 3 shows the second embodiment, and is a cross-sectional view of a solder recovery device.
FIG. 4 is a diagram showing a second embodiment and is an electronic board member recovery process diagram.
FIG. 5 is a view showing a conventional electronic substrate solder removal apparatus.
[Explanation of symbols]
1 Conveyor, 2 Nitrogen gas circulation circuit, 3 Solder recovery part, 4 Nitrogen cylinder, 5 Heat exchanger, 7 Wire brush, 8 Filter, 9 Suction pump, 10 Solder recovery tank, 11 Electronic board, 12 Mounted parts, 13 Solder, 14 Plastic curtain, 15 Member collection part, 16 Net shelf, 17 Solder scrap.

Claims (20)

A conveyor for transporting an electronic board in which mounted components are connected by solder;
An apparatus for supplying nitrogen gas or inert gas, a heating means for heating the nitrogen gas or inert gas supplied from the apparatus, and the nitrogen gas or inert gas heated by the heating means for supplying the electronic substrate A circulation circuit having an air supply fan that blows on
A solder removing means for removing the molten solder provided in the circulation circuit;
When the nitrogen gas or inert gas is blown onto the electronic substrate, the outside air entry suppression means for suppressing the outside air from entering,
An electronic board member recovery apparatus comprising: a wire brush that rotates the solder removal means, and the wire brush is driven by the heated nitrogen gas or inert gas in the circulation circuit. Member recovery apparatus for an electronic substrate of claim 1, wherein the said nitrogen gas or inert gas heated by the heating means is configured to blow from below the electronic substrate. Member recovery apparatus for an electronic substrate of claim 1, wherein the rotating the wire brush 500rpm or more rpm.   2. The electronic substrate member recovery apparatus according to claim 1, wherein a suction pump for sucking the nitrogen gas or the inert gas sprayed on the electronic substrate is provided in the circulation circuit. 5. The electronic substrate member recovery apparatus according to claim 4, wherein the gas pressure in the circulation circuit is controlled so as to satisfy an air supply pressure> a suction pump pressure> an atmospheric atmosphere.   2. The electronic board member collecting apparatus according to claim 1, further comprising solder suction collecting means for sucking and collecting the solder removed by the solder removing means. 7. The electronic board member collecting apparatus according to claim 6, wherein the solder sucking and collecting means is constituted by a suction pump provided in the circulation circuit.   2. The electronic substrate member recovery apparatus according to claim 1, wherein the outside air entry suppression means is formed of a plastic curtain.   2. The electronic board according to claim 1, wherein the electronic board is preheated by the heated nitrogen gas or inert gas when the electronic board is conveyed by the conveyor into the outside air entry suppression means. Member recovery device.   2. The electronic substrate member recovery apparatus according to claim 1, wherein the heating unit is configured to heat the nitrogen gas or the inert gas to 250 ° C. or higher. A method for recovering a member of an electronic board having a mounted component such as an electronic component,
Cleaning the electronic substrate;
A step of melting solder by blowing a heated nitrogen gas or inert gas onto the electronic substrate in a state in which the entry of outside air into the electronic substrate is suppressed;
Removing the molten solder;
Cooling the electronic substrate from which the solder has been removed with nitrogen gas or an inert gas;
Recovering the mounted component from the electronic substrate from which the solder has been removed;
In the step of removing the melted solder, the wire brush is rotated to remove the solder, and the drive source of the wire brush is rotated by the heated nitrogen gas or inert gas. Electronic member recovery method. The method for recovering an electronic board member according to claim 11, wherein the electronic board is preheated with the heated nitrogen gas or inert gas before melting the solder. 12. The electronic substrate member recovery method according to claim 11 , wherein the heated nitrogen gas or inert gas is sprayed from below the electronic substrate. The member recovery method for an electronic substrate according to claim 11, wherein the wire brush is rotated at a rotation speed of 500 rpm or more. An apparatus for supplying nitrogen gas or inert gas, a heating means for heating nitrogen gas or inert gas supplied from the apparatus, and the nitrogen gas or inert gas heated by the heating means to the electronic substrate 12. The member recovery method for an electronic board according to claim 11 , wherein the nitrogen gas or the inert gas blown to the electronic board is sucked by a suction pump provided in a circulation circuit having an air supply fan to be blown. 16. The method for recovering a member of an electronic substrate according to claim 15, wherein the gas pressure in the circulation circuit is controlled so as to satisfy a condition of air supply pressure> suction pump pressure> air atmosphere. An apparatus for supplying nitrogen gas or inert gas, a heating means for heating nitrogen gas or inert gas supplied from the apparatus, and the nitrogen gas or inert gas heated by the heating means to the electronic substrate 12. The member recovery method for an electronic board according to claim 11 , wherein the solder removed by the solder removal means is sucked and collected by a solder suction collection means provided in a circulation circuit having an air supply fan to be blown. . 18. The electronic board member recovery method according to claim 17 , wherein the solder removed by the solder removing means is sucked and recovered by a suction pump provided in the circulation circuit. 12. The electronic substrate member recovery method according to claim 11 , wherein an outside air is prevented from entering the electronic substrate by a plastic curtain. The member recovery method for an electronic substrate according to claim 11, wherein the nitrogen gas or the inert gas is heated to 250 ° C. or more by the heat exchanger.

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