JP2911875B1 - Waste printed electronic wiring board processing method and processing apparatus - Google Patents
Waste printed electronic wiring board processing method and processing apparatusInfo
- Publication number
- JP2911875B1 JP2911875B1 JP13865998A JP13865998A JP2911875B1 JP 2911875 B1 JP2911875 B1 JP 2911875B1 JP 13865998 A JP13865998 A JP 13865998A JP 13865998 A JP13865998 A JP 13865998A JP 2911875 B1 JP2911875 B1 JP 2911875B1
- Authority
- JP
- Japan
- Prior art keywords
- tin
- wiring board
- printed electronic
- electronic wiring
- processing furnace
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002699 waste material Substances 0.000 title claims abstract description 25
- 238000003672 processing method Methods 0.000 title abstract description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 56
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000011889 copper foil Substances 0.000 claims abstract description 25
- 239000003365 glass fiber Substances 0.000 claims abstract description 21
- 239000007788 liquid Substances 0.000 claims abstract description 19
- 238000010129 solution processing Methods 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000000956 alloy Substances 0.000 claims abstract description 9
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 9
- 230000006378 damage Effects 0.000 claims abstract description 9
- 230000005484 gravity Effects 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 16
- 238000002485 combustion reaction Methods 0.000 claims description 12
- 238000003756 stirring Methods 0.000 claims description 9
- 238000000926 separation method Methods 0.000 claims description 7
- 238000003915 air pollution Methods 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- 238000010000 carbonizing Methods 0.000 claims 3
- 238000007599 discharging Methods 0.000 claims 1
- 238000001914 filtration Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 9
- 239000011888 foil Substances 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- 238000002844 melting Methods 0.000 abstract description 2
- 239000002244 precipitate Substances 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 7
- 238000003763 carbonization Methods 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005188 flotation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005486 sulfidation Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Processing Of Solid Wastes (AREA)
Abstract
【要約】
【課題】 廃プリント電子配線板中の銅箔と熱硬化性プ
ラスチックとガラスファイバーを分離し回収する廃プリ
ント電子配線板の処理方法および処理装置を提供する。
【解決手段】 錫液処理炉１の中に投入された廃棄プリ
ント電子配線板は、錫液あるいはその合金液の中で破壊
攪拌装置４でもって攪拌されながら破壊できるので、配
線板の材料の銅箔と、熱硬化性プラスチックとガラスフ
ァイバーに分離することができる。銅箔は錫よりも比重
が大きくかつ融点が高いので錫と融合せずにに底面に沈
殿し、熱硬化プラスチックは炭化されながらガラスファ
イバーとともに錫より比重が小さいので錫の上表面に浮
き上がる。錫液処理炉１の底面にある分離装置６で銅箔
は分離されて外にある金属収集桶８の中に入れられ、浮
きかすすくいとり装置５で熱硬化プラスチックかすとガ
ラスファイバーは一緒にすくいとられて外にある浮きか
す収集桶９に入れることができる。An object of the present invention is to provide a processing method and a processing apparatus for a waste printed electronic wiring board for separating and collecting copper foil, thermosetting plastic, and glass fiber in the waste printed electronic wiring board. SOLUTION: Since a waste printed electronic wiring board put into a tin liquid processing furnace 1 can be broken while being stirred by a destruction stirrer 4 in a tin liquid or an alloy liquid thereof, copper as a wiring board material is used. It can be separated into foil, thermoset plastic and glass fiber. The copper foil has a higher specific gravity and a higher melting point than tin, so that the copper foil precipitates on the bottom surface without being fused with tin, and the thermosetting plastic floats on the upper surface of tin because it has a lower specific gravity than tin with glass fiber while being carbonized. The copper foil is separated by the separating device 6 on the bottom of the tin solution processing furnace 1 and put into the metal collecting tub 8 outside, and the thermosetting plastic scrap and the glass fiber are scooped together by the floating scooping device 5. It can be taken and placed in the scum collection tub 9 outside.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、廃プリント電子配
線板の処理の方法とその装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for treating waste printed electronic wiring boards.
【０００２】[0002]
【従来の技術】従来より、廃プリント電子配線板の処理
方法として使用されていた方法は、焼却、粉砕、酸洗、
攪拌浮上、固体化、熱分解などがあった。2. Description of the Related Art Conventionally, methods used for treating waste printed electronic wiring boards include incineration, pulverization, pickling,
There were stirring flotation, solidification, and thermal decomposition.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、廃棄さ
れるプリント電子配線板は数層の金属箔があって回収す
るときはがしにくく、処理が困難で回収能率が悪く、そ
の流れ作業が複雑でコストが高く経済上採算が余りとれ
ない。本発明の目的は、廃プリント電子配線板の中の主
要材料である銅箔と熱硬化性プラスチックとガラスファ
イバーを容易に分離し回収できる廃プリント電子配線板
の処理方法および処理装置を提供することにある。However, printed electronic wiring boards to be discarded have several layers of metal foil and are difficult to remove when collected, and are difficult to process and have poor collection efficiency. It is not economically profitable. An object of the present invention is to provide a processing method and a processing apparatus for a waste printed electronic wiring board which can easily separate and recover copper foil, thermosetting plastic, and glass fiber, which are main materials in the waste printed electronic wiring board. It is in.
【０００４】[0004]
【課題を解決するための手段】本発明は、まず廃棄され
るプリント電子配線板を熔解した錫液あるいはその合金
液を入れてある炉に投げ込み、その中で炭化と破壊と攪
拌との作業を行って、銅箔をはがし、熱硬化性プラスチ
ックとガラスファイバーとを錫液あるいはその合金液の
上表面に浮上させてすきとる方法を取る。錫液処理炉に
は、その中に錫あるいはその合金を燃焼して熔解させる
燃焼器を設置し、材料送入装置を錫液処理炉の前側に付
設して廃棄されたプリント電子配線板を処理炉の中に送
り込む。さらに複数の破壊攪拌装置を処理炉の中に設置
してプリント電子配線板を攪拌して破壊し、錫液あるい
はその合金液と充分に接触できるようにする。さらに浮
きかすすきとり装置を処理炉の中に設置して錫液の上表
面に浮き上がった熱硬化性プラスチックとガラスファイ
バーをすくいとって収集桶の中に入れる。さらに分離装
置を前記炉の底面に設置して沈殿した銅箔を分離させて
収集桶の中に入れる。According to the present invention, first, a printed electronic wiring board to be discarded is thrown into a furnace containing a molten tin solution or an alloy solution thereof, and the operations of carbonization, destruction, and stirring are performed therein. Then, the copper foil is peeled off, and the thermosetting plastic and the glass fiber are floated on the upper surface of the tin solution or its alloy solution to remove it. The tin liquid processing furnace is equipped with a combustor that burns and melts tin or its alloy in the tin liquid processing furnace, and a material feeder is attached to the front side of the tin liquid processing furnace to process discarded printed electronic wiring boards. Send into furnace. Further, a plurality of destruction stirrers are installed in the processing furnace to stir and break the printed electronic wiring board so that it can be sufficiently contacted with the tin solution or its alloy solution. Further, a floating rinsing device is installed in the processing furnace, and the thermosetting plastic and glass fiber floating on the upper surface of the tin solution are scooped and put into a collecting tub. Further, a separating device is installed on the bottom of the furnace to separate the precipitated copper foil and put it into a collecting tub.
【０００５】錫液処理炉の中に投入された廃棄プリント
電子配線板は、錫液あるいはその合金液の中で破壊攪拌
装置でもって攪拌されながら破壊できるので、配線板の
材料の銅箔と、熱硬化性プラスチックとガラスファイバ
ーに分離することができる。銅箔は錫よりも比重が大き
くかつ融点が高いので錫と融合せずに徐々に底面に沈殿
し、また熱硬化プラスチックは炭化されながらガラスフ
ァイバーとともに錫より比重が小さいので攪拌する内に
徐々に錫の上表面に浮き上がる。錫液処理炉の底面にあ
る分離装置で銅箔は分離されて外にある金属収集桶の中
に入れられ、浮きかすすきとり装置で熱硬化プラスチッ
クかすとガラスファイバーは一緒にすくいとられて外に
ある収集桶に入れることができる。A waste printed electronic wiring board placed in a tin solution processing furnace can be broken while being stirred in a tin solution or an alloy solution thereof by a destruction stirrer. It can be separated into thermosetting plastic and glass fiber. Copper foil has a higher specific gravity than tin and has a higher melting point, so it is not fused with tin, but gradually precipitates on the bottom.Also, while thermosetting plastic is carbonized, its specific gravity is lower than that of tin with glass fiber. Floating on the top surface of tin. The copper foil is separated by a separation device on the bottom of the tin solution treatment furnace and put into an external metal collecting tub. Can be placed in a collection tub at
【０００６】上記のように、廃棄プリント電子配線板は
銅箔と熱硬化性プラスチックとガラスファイバーとに分
離した後に回収することができるので、材料を有効にリ
サイクルすることができる。As described above, the waste printed electronic wiring board can be recovered after being separated into copper foil, thermosetting plastic, and glass fiber, so that the material can be effectively recycled.
【０００７】[0007]
【発明の実施の形態】以下、本発明の実施例を図面に基
づいて説明する。本発明の熔解状錫によるプリント電子
配線板の処理方法は図１に示すような処理過程で処理さ
れる。最初にプリント電子配線板を熔解錫液処理炉１の
中に投げ込み、プリント電子配線板の上にある銅箔を錫
板に充分接触させ、プリント電子配線板を破壊攪拌装置
４で攪拌させて破壊し、プリント電子配線材の材料の銅
箔とプラスチックを剥がさせる外、また同時に熱硬化性
プラスチックを炭化させる。Embodiments of the present invention will be described below with reference to the drawings. The method for processing a printed electronic wiring board with molten tin according to the present invention is performed in a process as shown in FIG. First, the printed electronic wiring board is thrown into the molten tin solution processing furnace 1, the copper foil on the printed electronic wiring board is brought into sufficient contact with the tin plate, and the printed electronic wiring board is agitated by the destruction / stirring device 4 and destroyed. Then, the copper foil and the plastic of the material of the printed electronic wiring material are peeled off, and at the same time, the thermosetting plastic is carbonized.
【０００８】次にプリント電子配線板を続けてかき回し
て、それでプリント電子配線板が持っている銅箔と熱硬
化性プラスチックとガラスファイバーとは皆比重が異な
るので完全に相互に分離する。熱硬化性プラスチックと
ガラスファイバーとは熔解状錫液の上表面に浮かび上が
るので浮きかすすきとり装置３ですきとる。すきとった
熱硬化性プラスチックとガラスファイバーは浮きかす収
集桶９の中に入れる。Next, the printed electronic wiring board is continuously stirred, so that the copper foil, the thermosetting plastic and the glass fiber of the printed electronic wiring board are completely separated from each other because they have different specific gravities. Since the thermosetting plastic and the glass fiber appear on the upper surface of the molten tin solution, they are removed by the floating rinsing device 3. The clear thermoset plastic and glass fiber are placed in a scum collection tub 9.
【０００９】次にプリント電子配線板の熱硬化性プラス
チックが炭化するときに発生した揮発性ガラスを燃焼器
２で燃焼して破壊する。燃焼器２で燃焼したが未だ完全
に破壊されてない揮発性ガスは熔解状錫液処理炉１の外
にある燃焼室７の中に導入し、その中で再び燃焼して化
学的に安定なガスに変化させる。熱硬化プラスチックと
ガラスファイバーから分離し、処理炉の底面に沈殿した
銅箔はある一定の時間おきにまた一定量に分離装置６で
もって錫液の中から取り出す。取り出した銅箔は金属収
集桶８の中に入れる。Next, the volatile glass generated when the thermosetting plastic of the printed electronic wiring board is carbonized is destroyed by burning in the combustor 2. Volatile gas burned in the combustor 2 but not yet completely destroyed is introduced into a combustion chamber 7 outside the molten tin solution treatment furnace 1, where it is burned again to be chemically stable. Change to gas. The copper foil separated from the thermosetting plastic and the glass fiber and settled on the bottom surface of the processing furnace is taken out of the tin solution by the separating device 6 at regular intervals and in a constant amount. The removed copper foil is put into a metal collecting tub 8.
【００１０】本発明の熔解状錫あるいはその合金による
廃物プリント電子配線板の処理装置は図２に示すよう
に、錫液処理炉１と、燃焼器２と、材料送入装置３と、
数個の破壊攪拌装置４と、浮きかすすきとり装置５と、
分離装置６と、燃焼室７と、金属収集桶８と、浮きかす
収集桶９とで構成される。燃焼器２は錫液処理炉１の中
に設置され、この炉１の中においてある固体の錫を加熱
熔解させて熔解状（液）にするとともに熱硬化プラスチ
ックの炭化で発生した揮発性ガスを燃焼する作業をす
る。As shown in FIG. 2, the apparatus for processing waste printed electronic wiring boards made of molten tin or an alloy thereof according to the present invention comprises a tin liquid processing furnace 1, a combustor 2, a material feeding apparatus 3, and
Several destruction-stirring devices 4
It comprises a separating device 6, a combustion chamber 7, a metal collecting tub 8, and a scum collecting tub 9. The combustor 2 is installed in a tin liquid treatment furnace 1 in which solid tin is heated and melted into a molten state (liquid), and volatile gas generated by carbonization of the thermosetting plastic is heated. Work to burn.
【００１１】材料送入装置３は錫液処理炉１の前側に付
設して、吸入ポンプと輸送案内板とで構成されて、廃棄
されたプリント電子配線板を錫液処理炉の中に送り込
む。数個の破壊攪拌装置４は錫液処理炉１の内部に適当
に配置して、プリント電子配線板をかき回して破壊し、
錫液と接触する面積を増加させる。浮きかすすきとり装
置５は破壊攪拌装置４の上方に設置され、錫液の上表面
に浮かんでいる熱硬化プラスチックかすとガラスファイ
バーをすくいとり、処理炉１の外に連接している浮きか
す収集桶９の中に送り込む。The material feeding device 3 is provided at the front side of the tin solution processing furnace 1 and includes a suction pump and a transport guide plate, and feeds the discarded printed electronic wiring board into the tin solution processing furnace. Several breaking stirrers 4 are appropriately arranged inside the tin solution processing furnace 1 to stir and break the printed electronic wiring board,
Increase the area in contact with the tin solution. The floating debris removal device 5 is installed above the destruction stirrer 4 and scoops the thermosetting plastic residue and glass fiber floating on the upper surface of the tin liquid, and collects the floating residue connected to the outside of the processing furnace 1. Send it into pail 9.
【００１２】分離装置６は錫液処理炉１の底部に設置
し、この分離装置６は濾過網かあるいはポンプで構成さ
れ、さらに処理炉１の外に設置している金属収集桶８と
連結し、分離し沈殿した銅箔を金属収集桶８の中に送り
込む。燃焼室７は錫液処理炉１の外に設置して処理炉１
と連結されて、熱硬化プラスチックが炭化後に発生し燃
焼器２で燃焼されたが未だ完全に燃焼していない揮発性
ガスをこの燃焼室７に送り込んで再び燃焼して化学的に
分解させて安定なガスにしてから空気汚染制御装置を経
由して大気中に排出する。The separation device 6 is installed at the bottom of the tin solution processing furnace 1, and this separation device 6 is constituted by a filter net or a pump, and is connected to a metal collecting tub 8 installed outside the processing furnace 1. Then, the separated and precipitated copper foil is fed into the metal collecting tub 8. The combustion chamber 7 is installed outside the tin solution processing furnace 1 and
The volatile gas which is generated after carbonization and is burned in the combustor 2 but not yet completely burned is sent to the combustion chamber 7 and burnt again to be chemically decomposed to be chemically decomposed and stabilized. And then discharge it to the atmosphere via an air pollution control device.
【００１３】本発明の処理方法は非燃焼の反応にして、
空気や酸素を供給する必要がなく、加熱に要するエネル
ギーを節約できる。さらに非燃焼反応なので、完全に燃
焼したがどうか配慮する必要がなく、温度と残留時間の
ような操作条件はその範囲が広くなる。空気や酸素を必
要としないので、その処理過程中に発生するのはただ熱
硬化性プラスチックの硫化後の揮発性ガスだけなので廃
棄量がとても少なく、従って廃棄処理に係わる設備の費
用と場所を節約できる。[0013] The treatment method of the present invention is a non-combustion reaction,
There is no need to supply air or oxygen, and the energy required for heating can be saved. Furthermore, since it is a non-combustion reaction, there is no need to consider whether it has completely burned, and operating conditions such as temperature and residence time have a wider range. Since no air or oxygen is required, only a small amount of volatile gas is generated during sulfidation of the thermosetting plastic during the process, resulting in very little waste, thus saving the cost and space of waste disposal equipment. it can.
【００１４】破壊と攪拌の動作により錫液と廃物プリン
ト電子配線板と相互に充分に接触させるばかりでなく両
者の接触面積を増加させる。熱硬化プラスチックの炭化
により多数層のプリント電子配線板がはげてお互いに分
離し、内に含まれている銅箔はプリント電子配線板本体
の熱硬化プラスチックとガラスファイバーから離れて銅
箔をはがす目的が達せられる。The breaking and stirring operations not only bring the tin liquid and the waste printed electronic wiring board into sufficient contact with each other, but also increase the contact area between them. The multi-layer printed electronic wiring boards are peeled and separated from each other by carbonization of the thermosetting plastic, and the copper foil contained inside is separated from the thermosetting plastic and glass fiber of the printed electronic wiring board body and the copper foil is peeled off. Is achieved.
【００１５】熱硬化プラスチックの炭化により発生する
揮発性ガスは錫液処理炉の中から逃げ出さないで燃焼器
の中に導入されて燃焼されるので、この揮発性ガスがあ
ちこちに流動することなく、かつ燃焼室の中で再び燃焼
されて完全に破壊される。プリント電子配線板の中に含
まれている銅箔は非燃焼反応でない操作で処理される酸
化されずに回収できるのでその回収コストが減少される
のみならず、その後処理の過程が簡単になる。The volatile gas generated by the carbonization of the thermosetting plastic is introduced into the combustor and burned without escaping from the tin solution treatment furnace, so that the volatile gas does not flow around. And it is burnt again in the combustion chamber and completely destroyed. Since the copper foil contained in the printed electronic wiring board can be recovered without being oxidized by a non-combustion operation, not only the recovery cost is reduced, but also the subsequent processing is simplified.
【図１】本発明の熔解状錫によるプリント電子配線板の
処理方法の流れ作業図である。FIG. 1 is a flow chart of a method for processing a printed electronic wiring board with molten tin according to the present invention.
【図２】本発明の熔解状錫によるプリント電子配線板の
処理装置の組合せ図である。FIG. 2 is a combination diagram of a processing apparatus for a printed electronic wiring board using molten tin according to the present invention.
１ 錫液処理炉 ２ 燃焼器 ３ 材料送入装置 ４ 破壊攪拌装置 ５ 浮きかすすきとり装置 ６ 分離装置 ７ 燃焼室 ８ 金属収集桶 ９ 浮きかす収集桶 REFERENCE SIGNS LIST 1 tin liquid treatment furnace 2 combustor 3 material feeding device 4 destruction stirrer 5 floating debris removing device 6 separation device 7 combustion chamber 8 metal collecting tub 9 floating debris collecting tub
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭49−53123（ＪＰ，Ａ) 特開 平２−88725（ＪＰ，Ａ) 特開 平６−200256（ＪＰ，Ａ) 特開 平６−256863（ＪＰ，Ａ) 特開 平９−170034（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) B09B 3/00 B09B 5/00 C22B 7/00 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-49-53123 (JP, A) JP-A-2-88725 (JP, A) JP-A-6-200256 (JP, A) JP-A-6-200256 256863 (JP, A) JP-A-9-170034 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) B09B 3/00 B09B 5/00 C22B 7/00
Claims (7)
の合金液処理炉に投入し、攪拌と破壊により前記廃プリ
ント電子配線板中に含まれる銅箔を前記廃プリント電子
配線板からはがし、前記廃プリント電子配線板中に含ま
れる熱硬化性プラスチックを炭化させる過程と、 前記熱硬化性プラスチックが炭化した後、比重が異なる
銅箔と熱硬化性プラスチックとガラスファイバーとを分
離する過程と、 前記処理炉中の錫液あるいはその合金液の上面に浮き上
がる熱硬化性プラスチックかすとガラスファイバーとを
浮きかすすきとり装置ですきとる過程と、 すきとった熱硬化性プラスチックかすとガラスファイバ
ーを浮きかす収集桶の中に入れる過程と、 前記の熱硬化性プラスチックを炭化させる時に発生した
揮発性ガスを前記処理炉の中に設置している燃焼器で燃
焼する過程と、 前記燃焼器で燃焼したガスおよびまだ完全に破壊されて
いない揮発性ガスを、前記処理炉の外に設置している燃
焼室に送入して、再び燃焼して安定なガスに変化させる
過程と、 分離され沈殿した銅箔を、一定の時間毎にまたは一定量
毎に分離装置で取り出す過程と、 取り出した銅箔を金属収集箱の中に入れる過程と、 により処理する廃プリント電子配線板の処理方法。1. A waste printed electronic wiring board is put into a tin liquid or alloy solution treatment furnace thereof, and a copper foil contained in the waste printed electronic wiring board is peeled off from the waste printed electronic wiring board by stirring and breaking. A step of carbonizing the thermosetting plastic contained in the waste printed electronic wiring board; and a step of separating the copper foil, the thermosetting plastic, and the glass fiber having different specific gravities after the thermosetting plastic is carbonized, The process of removing the thermosetting plastic residue and glass fiber floating on the upper surface of the tin solution or its alloy solution in the processing furnace with a wiping device, and collecting the removed thermosetting plastic residue and glass fiber A step of placing the gas in the vat; and setting volatile gas generated when carbonizing the thermosetting plastic in the processing furnace. Burning the gas in the combustor, and feeding the gas burned in the combustor and the volatile gas that has not been completely destroyed to the combustion chamber installed outside the processing furnace, and again The process of burning into stable gas, the process of removing the separated and precipitated copper foil at regular intervals or in a fixed amount, and the process of placing the removed copper foil in a metal collection box And a method of treating a waste printed electronic wiring board by the following method.
にする燃焼器と、 前記錫液処理炉の前側に付設され廃プリント電子配線板
を前記錫液処理炉の中に送入する材料送入装置と、 前記錫液処理炉の中に設置し、送入される廃プリント電
子配線板を攪拌するとともに破壊する複数個の破壊攪拌
装置と、 前記破壊攪拌装置の上方に設置され、前記錫液の表面に
浮き上がる熱硬化プラスチックとガラスファイバーをす
きとる浮きかすすきとり装置と、 前記錫液処理炉の底面に設置され、その底面に沈殿する
銅箔を分離する分離装置と、 を備えることを特徴とする廃プリント電子配線板の処理
装置。2. A tin liquid processing furnace, a combustor installed in the tin liquid processing furnace to heat solid tin to be a liquid, and a waste printed electronic wiring board attached to a front side of the tin liquid processing furnace. And a plurality of destruction stirrers installed in the tin solution processing furnace for stirring and destroying the waste printed electronic wiring board to be fed. Floating and wiping device installed above the destruction stirrer to remove the thermosetting plastic and glass fiber floating on the surface of the tin liquid; And a separation device for separating a copper foil to be processed.
とを特徴とする請求項２記載の廃プリント電子配線板の
処理装置。3. The processing apparatus according to claim 2, wherein the separation device comprises a filtration net.
とを特徴とする請求項２記載の廃プリント電子配線板の
処理装置。4. The apparatus according to claim 2, wherein the separation device comprises a pump.
つ前記錫液処理炉の外に設置され、前記錫液処理炉の中
からすきとられた炭化した熱硬化プラスチックかすとガ
ラスファイバーを収集する浮きかす収集桶を備えること
を特徴とする請求項２記載の廃プリント電子配線板の処
理装置。5. A method for collecting carbonized thermosetting plastic chips and glass fibers that are connected to the floating debris removal device and installed outside the tin solution processing furnace and are removed from the tin solution processing furnace. The waste printed electronic wiring board processing apparatus according to claim 2, further comprising a collecting tub that collects waste.
理炉の外に設置され、分離された銅箔を収集する金属収
集桶を備えることを特徴とする請求項２記載の廃プリン
ト電子配線板の処理装置。6. The waste printed electronic device according to claim 2, further comprising a metal collecting tub connected to the separating device and installed outside the tin solution processing furnace, for collecting the separated copper foil. Equipment for processing wiring boards.
炉の中で熱硬化プラスチックを炭化するときに発生しか
つ前記燃焼器による燃焼で破壊されなかった揮発性ガス
を再び燃焼させ、化学的に安定なガスに変化させて空気
汚染制御装置を経由して空気中に排出する燃焼室を備え
ることを特徴とする請求項２に記載の廃プリント電子配
線板の処理装置。7. A tin gas processing furnace, wherein volatile gas generated when carbonizing the thermosetting plastic in the tin liquid processing furnace and not destroyed by combustion by the combustor is burned again. 3. The waste printed electronic wiring board processing apparatus according to claim 2, further comprising a combustion chamber for converting the gas into a chemically stable gas and discharging the gas into the air via an air pollution control device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13865998A JP2911875B1 (en) | 1998-05-20 | 1998-05-20 | Waste printed electronic wiring board processing method and processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13865998A JP2911875B1 (en) | 1998-05-20 | 1998-05-20 | Waste printed electronic wiring board processing method and processing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2911875B1 true JP2911875B1 (en) | 1999-06-23 |
| JPH11319767A JPH11319767A (en) | 1999-11-24 |
Family
ID=15227146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13865998A Expired - Lifetime JP2911875B1 (en) | 1998-05-20 | 1998-05-20 | Waste printed electronic wiring board processing method and processing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2911875B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113322377A (en) * | 2021-05-28 | 2021-08-31 | 江西威尔高电子科技有限公司 | Tin stripping extraction device for circuit board production |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5319525B2 (en) | 2006-07-10 | 2013-10-16 | アドバンスド テクノロジー マテリアルズ，インコーポレイテッド | System and method for managing a material reservoir having an information storage element |
-
1998
- 1998-05-20 JP JP13865998A patent/JP2911875B1/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113322377A (en) * | 2021-05-28 | 2021-08-31 | 江西威尔高电子科技有限公司 | Tin stripping extraction device for circuit board production |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11319767A (en) | 1999-11-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100821792B1 (en) | The method of recycling wasted printed- circuit-board | |
| US10953444B2 (en) | Process for the recycling of waste batteries and waste printed circuit boards in molten salts or molten metals | |
| US5979033A (en) | Method of recycling waste printed circuit boards | |
| US6319391B1 (en) | Removal of metal from graphite | |
| US6089479A (en) | Method for treating waste printed circuit boards with molten mixture of inorganic salts | |
| JPH09324222A (en) | Method for recovering metal from plastic adhered with nonferrous metals | |
| CN105543486A (en) | Method for recovering valuable metals in waste circuit boards | |
| JP2911875B1 (en) | Waste printed electronic wiring board processing method and processing apparatus | |
| JP2004261700A (en) | Cleaning method and cleaning device for contaminated soil | |
| KR102658327B1 (en) | Methods, devices and systems for processing complex waste sources | |
| US20050247162A1 (en) | Precious metals recovery from waste materials using an induction furnace | |
| CN113802009A (en) | Printed circuit board recycling and gold removing process | |
| US5511496A (en) | Method of recovering glass and metal from solid residues produced in refuse incineration plants | |
| JP2001107152A (en) | Method for treating waste printed circuit board | |
| JP2000210650A (en) | Treatment of abandoned electronic equipment | |
| JP7368407B2 (en) | How to dispose of waste solar panels | |
| JPH06256863A (en) | Method for recovering metal from circuit board and device therefor | |
| JP3535381B2 (en) | Collection of valuable metals | |
| JP3762501B2 (en) | Waste disposal method for electrical products such as OA equipment and home appliances | |
| CN1071372C (en) | Method for recovering and treating printed circuit board by using molten tin and apparatus thereof | |
| JPH09225445A (en) | Treatment of waste printed circuit board mounted with electronic parts | |
| JP2000157958A (en) | Recovering method of organic matter and inorganic matter from waste | |
| JPH10113647A (en) | Method for recovering valuable metal from refuse incineration ash | |
| JP2001239231A (en) | Method of recovering heavy metals from discharged material in waste incineration facility | |
| JPH0377861B2 (en) |