JP2001107152A - Method for treating waste printed circuit board - Google Patents
Method for treating waste printed circuit boardInfo
- Publication number
- JP2001107152A JP2001107152A JP28529399A JP28529399A JP2001107152A JP 2001107152 A JP2001107152 A JP 2001107152A JP 28529399 A JP28529399 A JP 28529399A JP 28529399 A JP28529399 A JP 28529399A JP 2001107152 A JP2001107152 A JP 2001107152A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- waste printed
- wiring board
- processing furnace
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002699 waste material Substances 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 28
- 239000003365 glass fiber Substances 0.000 claims abstract description 27
- 239000011889 copper foil Substances 0.000 claims abstract description 26
- 150000003839 salts Chemical class 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 11
- 229910017053 inorganic salt Inorganic materials 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 9
- 238000003756 stirring Methods 0.000 claims abstract description 8
- 230000005484 gravity Effects 0.000 claims abstract description 6
- 239000004033 plastic Substances 0.000 claims abstract 2
- 229920003023 plastic Polymers 0.000 claims abstract 2
- 238000002485 combustion reaction Methods 0.000 claims description 9
- 230000006378 damage Effects 0.000 claims description 7
- IIPYXGDZVMZOAP-UHFFFAOYSA-N lithium nitrate Chemical compound [Li+].[O-][N+]([O-])=O IIPYXGDZVMZOAP-UHFFFAOYSA-N 0.000 claims description 4
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 claims description 4
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 claims description 4
- LPXPTNMVRIOKMN-UHFFFAOYSA-M sodium nitrite Chemical compound [Na+].[O-]N=O LPXPTNMVRIOKMN-UHFFFAOYSA-M 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 238000003672 processing method Methods 0.000 claims description 3
- PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 claims description 2
- 235000010333 potassium nitrate Nutrition 0.000 claims description 2
- 239000004323 potassium nitrate Substances 0.000 claims description 2
- 235000010344 sodium nitrate Nutrition 0.000 claims description 2
- 239000004317 sodium nitrate Substances 0.000 claims description 2
- 235000010288 sodium nitrite Nutrition 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims 5
- 229910000975 Carbon steel Inorganic materials 0.000 claims 1
- 239000010962 carbon steel Substances 0.000 claims 1
- 238000010000 carbonizing Methods 0.000 claims 1
- 238000007599 discharging Methods 0.000 claims 1
- 238000010298 pulverizing process Methods 0.000 claims 1
- 239000002912 waste gas Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 238000002844 melting Methods 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- 239000012530 fluid Substances 0.000 abstract 2
- 239000011888 foil Substances 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 239000012266 salt solution Substances 0.000 description 5
- 238000003763 carbonization Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 102100033040 Carbonic anhydrase 12 Human genes 0.000 description 1
- 102100033029 Carbonic anhydrase-related protein 11 Human genes 0.000 description 1
- 101000867855 Homo sapiens Carbonic anhydrase 12 Proteins 0.000 description 1
- 101000867841 Homo sapiens Carbonic anhydrase-related protein 11 Proteins 0.000 description 1
- 101001075218 Homo sapiens Gastrokine-1 Proteins 0.000 description 1
- 101100293260 Homo sapiens NAA15 gene Proteins 0.000 description 1
- 102100026781 N-alpha-acetyltransferase 15, NatA auxiliary subunit Human genes 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- -1 glass fiber Chemical class 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 235000002639 sodium chloride Nutrition 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/02—Separating plastics from other materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/04—Disintegrating plastics, e.g. by milling
- B29B17/0404—Disintegrating plastics, e.g. by milling to powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/02—Separating plastics from other materials
- B29B2017/0213—Specific separating techniques
- B29B2017/0217—Mechanical separating techniques; devices therefor
- B29B2017/0237—Mechanical separating techniques; devices therefor using density difference
- B29B2017/0244—Mechanical separating techniques; devices therefor using density difference in liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/02—Separating plastics from other materials
- B29B2017/0213—Specific separating techniques
- B29B2017/0255—Specific separating techniques using different melting or softening temperatures of the materials to be separated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/52—Mechanical processing of waste for the recovery of materials, e.g. crushing, shredding, separation or disassembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Mechanical Engineering (AREA)
- Processing Of Solid Wastes (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、廃棄プリント配線
板の処理方法に関する。The present invention relates to a method for treating a waste printed wiring board.
【０００２】[0002]
【従来の技術】プリント配線板は自然分解により消滅し
ないので、廃棄するときは必ず前処理してその材料を回
収し、環境汚染の根源になるのを避けねばならない。本
発明の出願人は１９９８年５月２０日付で特許第２９１
１８７５号「廃棄プリント配線板の処理方法および処理
装置」に係る特許出願をしている。この方法によれば、
銅箔と熱硬化性プラスチックとガラスファイバーとを分
離させるための熱媒として錫液を使用している。2. Description of the Related Art Since printed wiring boards do not disappear due to spontaneous decomposition, they must be pre-treated to recover their materials before disposal to avoid becoming a source of environmental pollution. The applicant of the present invention filed a patent no.
A patent application has been filed for No. 1875 “Processing method and processing apparatus for waste printed wiring boards”. According to this method,
A tin liquid is used as a heat medium for separating the copper foil, the thermosetting plastic, and the glass fiber.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上述の
処理方法に使用される錫は価格が比較的高く、さらに銅
やガラスファイバーなどが分離する際に多少付着するか
ら、回収された銅やガラスファイバーの純度は高くな
く、錫は損失する。したがって、本発明の目的は、廃棄
プリント配線板の銅箔と熱硬化性プラスチックとガラス
ファイバーとを分離させるのに使用されている錫を使用
せずに安価に分解処理する廃棄プリント配線板の処理方
法を提供することにある。However, the tin used in the above-mentioned processing method is relatively expensive, and moreover, when copper and glass fibers are separated, they adhere slightly when they are separated. Is not high in purity and tin is lost. Therefore, an object of the present invention is to treat a waste printed wiring board by disassembling it at a low cost without using tin used for separating copper foil, thermosetting plastic and glass fiber of the waste printed wiring board. It is to provide a method.
【０００４】[0004]
【課題を解決するための手段】上述の課題を解決するた
めの本発明の廃棄プリント配線板の処理方法は、廃棄さ
れるプリント配線板を、溶融した無機塩類を内部に入れ
ている処理炉の中に投げ込み、その処理炉中で炭化、破
壊粉砕および撹拌の作業を行って銅箔をはがし、熱硬化
性プラスチックおよびガラスファイバーを無機塩類液の
上に浮上させてすくい取る方法である。無機塩類液によ
る処理炉の内部には無機塩類を燃焼して溶融させる燃焼
機を設置し、材料送入装置を処理炉の前側に付設して廃
棄されたプリント配線板を処理炉の中に送り込む。さら
に、複数の破壊撹拌装置を処理炉の中に設置してプリン
ト配線板を撹拌して破壊し、無機塩類液と充分に接触で
きるようにする。また、浮きかすすくい取り装置を処理
炉の中に設置して、無機塩類液の上表面に浮き上がった
熱硬化性プラスチックおよびガラスファイバーの残留物
をすくい取って収集桶の中に入れる。さらに吸い上げポ
ンプを処理炉の底面に設置して、沈殿した銅箔を吸い取
って収集箱の中に入れる。According to the present invention, there is provided a method of treating a discarded printed wiring board, comprising the steps of: In this method, copper foil is peeled off by performing carbonization, destruction crushing, and stirring operations in a processing furnace, and a thermosetting plastic and glass fiber are floated on an inorganic salt solution and scooped. A combustor that burns and melts inorganic salts is installed inside the processing furnace using inorganic salt liquid, and a material feeding device is attached to the front side of the processing furnace to send discarded printed wiring boards into the processing furnace. . Further, a plurality of destruction stirrers are installed in the processing furnace to stir and break the printed wiring board so that it can be sufficiently contacted with the inorganic salt solution. In addition, a floating scooping device is installed in the processing furnace, and the residue of the thermosetting plastic and the glass fiber floating on the upper surface of the inorganic salt solution is scooped and put into a collecting tub. Further, a suction pump is installed on the bottom of the processing furnace, and the precipitated copper foil is sucked and put into a collection box.
【０００５】処理炉の中に投入された廃棄プリント配線
板は、無機塩類液の中で破壊撹拌装置により撹拌されな
がら破壊粉砕されるので、材料として使用されていた銅
箔と熱硬化性プラスチックとガラスファイバーとに分離
することができる。銅箔は、無機塩類よりも比重が大き
くかつ融点が高いので無機塩類と化合せず底面に徐々に
沈殿し、また熱硬化性プラスチックはガラスファイバー
と同様に無機塩類より比重が小さいので、攪拌中に炭化
されながらガラスファイバーとともに徐々に無機塩類液
の上表面に浮き上がる。これにより、処理炉の底面にあ
る吸い上げポンプで銅箔は吸い取られて分離され、外部
にある金属収集箱の中に入れられ、また浮きかすすくい
取り装置で熱硬化性プラスチックおよびガラスファイバ
ーは一緒にすくい取られ、外部にある収集箱に入れられ
る。[0005] The waste printed wiring board put into the processing furnace is destroyed and pulverized while being stirred by the destruction stirrer in the inorganic salt solution, so that the copper foil used as the material and the thermosetting plastic are removed. It can be separated into glass fiber. Copper foil has a higher specific gravity and a higher melting point than inorganic salts, so it gradually precipitates on the bottom surface without being combined with inorganic salts, and thermosetting plastic has a lower specific gravity than inorganic salts like glass fiber, so stirring While being carbonized, it gradually floats on the upper surface of the inorganic salt solution together with the glass fiber. In this way, the copper foil is sucked and separated by a suction pump on the bottom of the processing furnace, placed in an external metal collecting box, and the thermosetting plastic and glass fiber are put together by a floating scooping device. They are skimmed and placed in an external collection box.
【０００６】上述のように、廃棄プリント配線板から材
料である銅箔と熱硬化性プラスチックとガラスファイバ
ーとを経済的かつ有効に分離して回収することができる
ので、材料を有効にリサイクルできる。As described above, the copper foil, the thermosetting plastic, and the glass fiber, which are materials, can be economically and effectively separated and collected from the waste printed wiring board, so that the materials can be effectively recycled.
【０００７】[0007]
【発明の実施の形態】以下、本発明の実施例を図面に基
づいて説明する。本発明の一実施例による廃棄プリント
配線板の処理過程およびその処理装置が上記の特許第２
９１１８７５号と異なる点は、本実施例では熱媒に錫を
使用せず溶融無機塩類を使用していることにある。無機
塩類は、亜硝酸ナトリウム、硝酸ナトリウム、硝酸カリ
ウム、硝酸アンモニウムまたは硝酸リチウムなどを使用
するか、あるいはこれらの無機塩類のうち二種類、三種
類または三種類以上を混合したものを使用する。これら
の無機塩類はある温度以下では完全に無害であるうえ、
化学的にかなり安定しているから、廃棄プリント配線板
の処理に便利である。Embodiments of the present invention will be described below with reference to the drawings. The process and apparatus for processing a waste printed wiring board according to an embodiment of the present invention are described in the above-mentioned Patent No. 2
The difference from 911875 is that in this embodiment, tin is not used as a heat medium and molten inorganic salts are used. As the inorganic salts, sodium nitrite, sodium nitrate, potassium nitrate, ammonium nitrate, lithium nitrate, or the like is used, or two, three, or a mixture of three or more of these inorganic salts are used. These inorganic salts are completely harmless below a certain temperature,
Because it is chemically stable, it is convenient for treating waste printed wiring boards.
【０００８】次に、図１および図２に示すように、廃棄
プリント配線板を処理する各種の過程は以下のとおりで
ある。 第１工程：処理する廃棄プリント配線板を鋼材で作った
処理炉１の中に投げ込む。廃棄プリント配線板の銅箔と
処理炉１の中の溶融無機塩類とを十分に接触させ、同時
に配線板を破壊粉砕するとともに撹拌し、銅箔を廃棄プ
リント配線板からはがし、またその間に廃棄プリント配
線板の熱硬化性プラスチックを炭化させる。Next, as shown in FIGS. 1 and 2, various processes for treating a waste printed wiring board are as follows. First step: A waste printed wiring board to be processed is thrown into a processing furnace 1 made of steel. The copper foil of the waste printed wiring board and the molten inorganic salts in the processing furnace 1 are sufficiently brought into contact with each other. The thermosetting plastic of the wiring board is carbonized.
【０００９】第２工程：炭化した廃棄プリント配線板を
継続して撹拌し、比重が互いに異なる銅箔と熱硬化性プ
ラスチックとガラスファイバーとを完全に分離させる。
その分離過程は以下のとおりである。 (2-1-1)銅箔と分離して溶融無機塩類の上表面に浮上し
た熱硬化性プラスチックおよびガラスファイバーの残留
物を浮きかすすくい取り装置５ですくい取る。Second step: The carbonized waste printed wiring board is continuously stirred to completely separate the copper foil, thermosetting plastic, and glass fiber having different specific gravities from each other.
The separation process is as follows. (2-1-1) The residue of the thermosetting plastic and the glass fiber floated on the upper surface of the molten inorganic salt separated from the copper foil is scooped by the scooping and scooping device 5.
【００１０】(2-1-2)すくい取った熱硬化性プラスチッ
クおよびガラスファイバーは浮きかす収集桶の中に入れ
る。 (2-2-1)廃棄プリント配線板の熱硬化性プラスチックが
炭化するときに発生した揮発性ガスを燃焼機２で燃焼さ
せる。 (2-2-2)燃焼機２で完全に燃焼しない揮発性ガスを燃焼
室７の中に導入し、その燃焼室７中で再び燃焼させて安
定したガスに変化させ、空気中に排出する。(2-1-2) The scooped thermosetting plastic and glass fiber are placed in a floating tub. (2-2-1) The volatile gas generated when the thermosetting plastic of the waste printed wiring board is carbonized is burned by the combustor 2. (2-2-2) Volatile gas that is not completely burned by the combustor 2 is introduced into the combustion chamber 7, and is again burned in the combustion chamber 7 to change into a stable gas and discharged into the air. .
【００１１】(2-3-1)熱硬化性プラスチックおよびガラ
スファイバーから分離した銅箔を一定時間に一定量取り
出す。 (2-3-2)取り出した銅箔を金属収集箱８の中に入れる。 上述の処理炉１の中に設置する燃焼機２は、処理炉１の
中に入れる無機塩類を溶融するのに使用する。また処理
炉１の前端には材料送入装置３を設置し、廃棄したプリ
ント配線板を処理炉１の中に送り込む。処理炉１の内部
には数組の破壊撹拌装置４を設置して廃棄プリント配線
板を破壊するとともに撹拌し、粉砕されたプリント配線
板と無機塩類とが充分に接触するようにする。破壊撹拌
装置４の上方には浮きかすすくい取り装置５を設置し、
処理炉１の外に設置されている浮きかす収集桶９と連結
する。さらに処理炉１の底部に吸い上げポンプ６を設置
し、処理炉１の外に設置されている金属収集箱８と連結
する。これにより、熱硬化性プラスチックとガラスファ
イバーと銅箔とはそれぞれ別々に処理炉１から取り出さ
れて収集される。また、燃焼室７を処理炉１と連結して
設置し、処理炉１中における熱硬化性プラスチックの炭
化の際に発生し燃焼機２で完全に燃焼されなかった揮発
性ガスを燃焼室７の中に導入し、安定した無害なガスに
分解させて空気中に排出する。(2-3-1) A certain amount of copper foil separated from thermosetting plastic and glass fiber is taken out for a certain time. (2-3-2) Put the removed copper foil into the metal collection box 8. The combustor 2 installed in the processing furnace 1 described above is used to melt the inorganic salts put into the processing furnace 1. At the front end of the processing furnace 1, a material feeding device 3 is installed, and the discarded printed wiring board is fed into the processing furnace 1. Several sets of destruction stirrers 4 are installed inside the processing furnace 1 to destroy and stir the waste printed wiring board so that the pulverized printed wiring board and inorganic salts are sufficiently contacted. Floating and skimming device 5 is installed above destructive stirring device 4,
It is connected to a scum collection tub 9 installed outside the processing furnace 1. Further, a suction pump 6 is installed at the bottom of the processing furnace 1 and connected to a metal collection box 8 installed outside the processing furnace 1. Thereby, the thermosetting plastic, the glass fiber, and the copper foil are separately taken out of the processing furnace 1 and collected. Further, the combustion chamber 7 is installed in connection with the processing furnace 1, and volatile gas generated during carbonization of the thermosetting plastic in the processing furnace 1 and not completely burned by the combustor 2 is removed from the combustion chamber 7. Introduce into stable, harmless gas and discharge into the air.
【００１２】[0012]
【発明の効果】本発明の廃棄プリント配線板の処理方法
は、次の効果がある。 (1)熱煤の無機塩類は非金属の化合物なので、廃棄プリ
ント配線板から分離した銅箔、熱硬化性プラスチックお
よびガラスファイバーの上に付着したりせず、回収され
た銅箔およびガラスファイバーはその純度が高い。 (2)無機塩類の価格は錫よりも安いから、廃棄プリント
配線板の処理コストは大幅に軽減される。The method for treating a waste printed wiring board of the present invention has the following effects. (1) Since the inorganic salts of thermal soot are non-metallic compounds, the recovered copper foil and glass fiber do not adhere to the copper foil, thermosetting plastic and glass fiber separated from the waste printed wiring board. Its purity is high. (2) Since the price of inorganic salts is lower than that of tin, the processing cost of waste printed wiring boards is greatly reduced.
【００１３】(3)回収された銅箔およびガラスファイバ
ーは純度が高いので、材料として再び利用できる。(3) The recovered copper foil and glass fiber have high purity and can be reused as materials.
【図１】本発明の一実施例による廃棄プリント配線板の
処理方法の作業工程図である。FIG. 1 is a work process diagram of a method of processing a waste printed wiring board according to an embodiment of the present invention.
【図２】本発明の一実施例による廃棄プリント配線板の
処理装置を示す模式図である。FIG. 2 is a schematic view showing an apparatus for processing a waste printed wiring board according to an embodiment of the present invention.
１ 処理炉 ２ 燃焼機 ３ 材料送入装置 ４ 破壊撹拌装置 ５ 浮きかすすくい取り装置 ６ 吸い上げポンプ ７ 燃焼室 ８ 金属収集桶 ９ 浮きかす収集桶 DESCRIPTION OF SYMBOLS 1 Processing furnace 2 Burner 3 Material feeding device 4 Destruction stirrer 5 Floating and scooping device 6 Suction pump 7 Combustion chamber 8 Metal collecting tub 9 Floating and collecting tub
───────────────────────────────────────────────────── フロントページの続き (72)発明者 李 維欣 台湾新竹市光復路２段68号 Ｆターム(参考） 4D004 AA24 BA05 CA04 CA07 CA12 CA15 CA26 CB02 CB13 CB26 CB34 CB42 CB43 CB50 CC11 DA02 DA12 4K001 AA09 BA22 CA01 CA03 CA11 GA19 GB01 GB02 GB05 GB09 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Li Wexin F-term (reference) 4D004 AA24 BA05 CA04 CA07 CA12 CA15 CA26 CB02 CB13 CB26 CB34 CB42 CB43 CB50 CC11 DA02 DA12 4K001 AA09 BA22 CA01 CA03 CA11 GA19 GB01 GB02 GB05 GB09
Claims (6)
を入れ、その溶融無機塩類が入れられた処理炉の中に廃
棄プリント配線板を投げ込み、その廃棄プリント配線板
を撹拌して破壊粉砕し、前記廃棄プリント配線板から銅
箔をはがし、前記廃棄プリント配線板の熱硬化性プラス
チックを炭化させる第１工程と、 前記熱硬化性プラスチックが炭化された廃棄プリント配
線板を継続して撹拌し、前記廃棄プリント配線板から比
重が互いに異なる銅箔と熱硬化性プラスチックとガラス
ファイバーとを分離させて回収する第２工程とを含み、 前記第２工程は、前記溶融無機塩類の上表面に浮き上が
った熱硬化性プラスチックおよびガラスファイバーの残
留物をすくい取って浮きかす収集桶の中に回収する第１
ステップと、前記熱硬化性プラスチックが炭化されると
きに発生する揮発性ガスを前記処理炉の内部に設置され
る燃焼機で燃焼し、前記燃焼機で燃焼しきれない揮発性
ガスを前記処理炉に連結している燃焼室に導入し再び燃
焼して空気中に排出する第２ステップと、前記処理炉で
分離された銅箔を所定時間おきに所定量除去装置で取り
出し、金属収集桶の中に回収する第３ステップとを含む
ことを特徴とする廃棄プリント配線板の処理方法。1. A molten inorganic salt is put into a processing furnace made of a carbon steel material, a waste printed wiring board is thrown into a processing furnace containing the molten inorganic salt, and the waste printed wiring board is agitated and broken. Pulverizing, removing the copper foil from the waste printed wiring board, and carbonizing the thermosetting plastic of the waste printed wiring board; and continuously stirring the waste printed wiring board carbonized with the thermosetting plastic. And a second step of separating and recovering copper foil, thermosetting plastic, and glass fiber having different specific gravities from the waste printed wiring board, wherein the second step is performed on the upper surface of the molten inorganic salts. A first method of scooping out the raised thermosetting plastic and glass fiber residues and collecting them in a floating tub
And burning the volatile gas generated when the thermosetting plastic is carbonized by a combustor installed inside the processing furnace, and removing the volatile gas that cannot be completely burned by the combustor to the processing furnace. A second step of introducing the mixture into a combustion chamber, burning it again, and discharging it into the air, and removing a predetermined amount of copper foil separated in the processing furnace by a predetermined amount at a predetermined time, and removing the copper foil from the metal collection tank. And a third step of recovering the waste printed wiring board.
ム、硝酸ナトリウム、硝酸カリウム、硝酸アンモニウム
および硝酸リチウムのうちの一つ、あるいは二つ以上を
混合したものであることを特徴とする請求項１記載の廃
棄プリント配線板の処理方法。2. The method according to claim 1, wherein the molten inorganic salts are one or a mixture of two or more of sodium nitrite, sodium nitrate, potassium nitrate, ammonium nitrate and lithium nitrate. How to treat waste printed wiring boards.
前記廃棄プリント配線板を攪拌して破壊粉砕する破壊攪
拌装置が設置され、その破壊撹拌装置の上方に前記廃棄
プリント配線板から分離した熱硬化性プラスチックおよ
びガラスファイバーをすくい取る浮きかすすくい取り装
置が設置され、前記処理炉の前端に前記廃棄プリント配
線板を前記処理炉の中に投げ込むための材料送り込み装
置が設置され、前記処理炉の内部の底部に前記廃棄プリ
ント配線板から分離沈殿した銅箔を取り出すための吸い
上げポンプが設置されていることを特徴とする請求項１
記載の廃棄プリント配線板の処理方法。3. A destruction stirrer for agitating and destroying and crushing the combustor and the waste printed wiring board inside the processing furnace, and a heat separated from the waste printed wiring board above the destruction stirrer. A floating scooping device for scooping curable plastic and glass fiber is installed, and a material feeding device for throwing the waste printed wiring board into the processing furnace is installed at a front end of the processing furnace. 2. A suction pump for removing a copper foil separated and settled from the waste printed wiring board at an inner bottom portion.
A method for treating a waste printed wiring board as described in the above.
に設置されて前記浮きかすすくい取り装置に連結され、
前記浮きかすすくい取り装置により前記溶融無機塩類の
上表面からすくい取られた熱硬化プラスチックおよびガ
ラスファイバーを前記浮きかす収集桶の中に回収するこ
とを特徴とする請求項３記載の廃棄プリント配線板の処
理方法。4. The floating debris collecting tub is installed outside the processing furnace and connected to the floating debris removing device.
The waste printed wiring board according to claim 3, wherein the thermosetting plastics and glass fibers scooped from the upper surface of the molten inorganic salts by the floating scooping device are collected in the floating tub. Processing method.
置され、前記吸い上げポンプは前記金属収集桶に連結さ
れ、前記吸い上げポンプにより取り出された銅箔を前記
金属収集桶の中に回収することを特徴とする請求項３記
載の廃棄プリント配線板の処理方法。5. The metal collecting tub is installed outside the processing furnace, the suction pump is connected to the metal collecting tub, and the copper foil taken out by the suction pump is collected in the metal collecting tub. 4. The method for treating a waste printed wiring board according to claim 3, wherein:
理炉と連結されるように設置され、前記熱硬化性プラス
チックが炭化するときに発生し前記燃焼機で燃焼しきれ
ない揮発ガスを前記燃焼室の中に導入し、前記燃焼室に
導入された揮発性ガスを燃焼させて安定したガスに分解
し空気中に排出することを特徴とする請求項１記載の廃
棄プリント配線板の処理方法。6. The combustion chamber is installed outside the processing furnace so as to be connected to the processing furnace, and generates a volatile gas generated when the thermosetting plastic is carbonized and cannot be burned by the combustor. 2. The treatment of a waste printed wiring board according to claim 1, wherein the waste gas is introduced into the combustion chamber, and the volatile gas introduced into the combustion chamber is burned, decomposed into a stable gas, and discharged into the air. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28529399A JP2001107152A (en) | 1999-10-06 | 1999-10-06 | Method for treating waste printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28529399A JP2001107152A (en) | 1999-10-06 | 1999-10-06 | Method for treating waste printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001107152A true JP2001107152A (en) | 2001-04-17 |
Family
ID=17689657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28529399A Pending JP2001107152A (en) | 1999-10-06 | 1999-10-06 | Method for treating waste printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001107152A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007190551A (en) * | 2006-01-20 | 2007-08-02 | Hsieh Sen Wu | Method of recycling wasted printed-circuit-board |
| CN102152373A (en) * | 2010-12-30 | 2011-08-17 | 陈耀武 | Zero-carbon high-fiber environment-friendly sheet synthesized by waste circuit board powder and production process thereof |
| KR101141542B1 (en) | 2010-04-09 | 2012-05-03 | 한국지질자원연구원 | Method for Glass Fiber Separation from Depolymerization of Waste Circuit Boards Using Organic Solvent |
| CN112678827A (en) * | 2020-12-11 | 2021-04-20 | 北京工业大学 | Method for preparing silicon carbide from waste circuit board light plate cracking slag |
-
1999
- 1999-10-06 JP JP28529399A patent/JP2001107152A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007190551A (en) * | 2006-01-20 | 2007-08-02 | Hsieh Sen Wu | Method of recycling wasted printed-circuit-board |
| KR101141542B1 (en) | 2010-04-09 | 2012-05-03 | 한국지질자원연구원 | Method for Glass Fiber Separation from Depolymerization of Waste Circuit Boards Using Organic Solvent |
| CN102152373A (en) * | 2010-12-30 | 2011-08-17 | 陈耀武 | Zero-carbon high-fiber environment-friendly sheet synthesized by waste circuit board powder and production process thereof |
| CN102152373B (en) * | 2010-12-30 | 2012-07-04 | 肖超锋 | Zero-carbon high-fiber environment-friendly sheet synthesized by waste circuit board powder and production process thereof |
| CN112678827A (en) * | 2020-12-11 | 2021-04-20 | 北京工业大学 | Method for preparing silicon carbide from waste circuit board light plate cracking slag |
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