JPS60200057A - Refrigeration cycle device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a vortex tube device interposed between the discharge side pipe of the compressor and the high temperature side pipe of the condenser in a refrigeration cycle. This invention relates to a new refrigeration cycle device in which a separate bypass circuit is provided that directly connects the

A refrigeration cycle such as a heat pump can be used for both cooling and heating by switching between cooling (refrigeration) operation and heating operation, but generally in a refrigeration cycle, the amount of heat radiated by the condenser is the same as the amount of heat taken in by the evaporator and the amount of heat taken by the compressor. Since it was determined by the amount of work done, it was considered impossible to obtain more heat than the sum of the amount of heat taken in during heating operation and the amount of work done by the compressor.

The object of the present invention is to be able to obtain an amount of heat greater than the sum of the amount of heat taken in from the heat source and the amount of work of the compressor without expending additional work from the outside during heating operation of the refrigeration cycle.
Furthermore, the present invention aims to provide a refrigeration cycle device that can be used for heat amplification heating and cooling (refrigeration) by switching valves.

Generally, in a refrigeration cycle, high-pressure, high-temperature superheated refrigerant vapor is discharged from a discharge pipe of a compressor.

On the other hand, a vortex tube is known as a device capable of supplying high-pressure gas to generate a vortex inside and separating the high-pressure gas into cold air and hot air for extraction.

The present inventor focused on the fact that the high-pressure gas introduced into the vortex tube is separated into a high-temperature part and a low-temperature part, and by using the characteristics of the vortex tube to further raise the temperature of the compressed vapor of the refrigerant in the refrigeration cycle, the effect of heating can be obtained during heating operation. The present invention has been made based on the discovery that the amount of heat generated can be dramatically amplified.Examples of the present invention will now be described with reference to the drawings.

FIG. 1 shows a flowchart system of a heat amplifying device according to the present invention, and a refrigerant such as Freon 22 is sealed in the system 1.

The feature of the present invention is that a vortex tube device 7 is provided between the discharge side pipe 1a of the compressed air 3 of the refrigeration cycle and the high temperature side pipe 1b of the condenser 4.
A bypass circuit lc is provided between the pipes 1a and 1b to directly connect the compressor 3 and the condenser 4 via switching valves 8a and 8b.

That is, the discharge side pipe 1a of the compressor 3 is connected to the gas supply lower a of the vortex tube device 7, and the high temperature side pipe 1b of the condenser 4 is directly communicated from the high temperature gas ratio lower b of the vortex tube device 7 to the condenser 4. A bypass circuit IC is provided.

In the illustrated embodiment, this bypass circuit IC is provided as a system that directly connects the discharge side pipe 1a of the compressor 3 and the high temperature side pipe lb of the condenser 4, and these pipes 1a, 1
Switching valves 8a and 8b are installed at the junction with b.

Therefore, in the refrigeration cycle of the apparatus of the present invention, the discharge side of the compressor 3 and the high temperature side of the If compressor 4 are connected by two circuits, one passing through the vortex tube device 7 and the other directly communicating with the bypass circuit IC. It has been done.

Note that the switching valve 8b may be a check valve provided in the pipe of the 7 examples of the vortex tube device.
In the illustrated embodiment, in order to enhance the refrigeration effect of the refrigeration cycle, the low-temperature gas ratio lower C of the vortex tube device 7 is connected to the ball flow side of the expansion valve 6 of the refrigeration cycle via a pipe 7 c /. It is.

3 and 4 show a more preferable vortex tube device for use in the heat amplifying device of the present invention, and the vortex tube device 7 includes:
A high-temperature gas having a diameter smaller than the cylindrical inner diameter of the case 9 flows through an opening at one end in the axial direction of the hollow case 9, which has a cylindrical hollow part in the inner axial direction and is equipped with a compressed gas supply lower a communicating with the cylindrical interior. A circular vortex generating device 11 is fitted into the cylindrical hollow portion of the case 9 to which the pipe 10 is connected, and has a through hole 10'a extending through the axial center.

The vortex generator 11 has a recess Ilb at the center of the end facing the high-temperature gas flow pipe 10, and a circular curved edge 11c formed around the recess Ilb has a plurality of inclines or curves extending in the radial direction. A groove lid is carved, and this groove lid
The case 9 is made to face the gas flow pipe 10, and the upper end of the groove 11d communicates with the gas supply lower a of the case 9.
It is located inside.

Then, a hollow sealing camp 13 is screwed onto the back side of the vortex generator 11 via an O-ring 12, and its tip is brought into contact with the back surface of the vortex generator 11 to fix the vortex generator 11.

In this way, the compressed gas supplied into the case 9 from the gas inlet at high speed is rapidly rotated by the vortex generator 11 and turned into a vortex, a special temperature change is generated, and high temperature gas is released from the high temperature flow pipe 10. At the same time, low-temperature gas is discharged from the axial hole 11a of the vortex generating device 11 in the opposite direction to the high temperature flow tube, and the vortex flow tube device 7 shown in the figure particularly has the following features.

That is, a gap 14- is provided between the tip of the vortex generator 11 installed in the case 9 and the inner end of the hollow case 9 in which the high-temperature gas flow pipe 10 is connected.

The tapered surface of the inner circumferential surface 15 of the case is preferably formed at a uniform angle such that the station angle is 90'.

A brake member 16 made of a wire formed in a spiral shape may be interposed in the high temperature gas flow pipe 4.

This brake member 16 preferably has a spiral shape (;
Both ends 16b and 16c are bent in the radial direction of the spiral vortex.

Incidentally, a plurality of discharge holes 17 are provided in the peripheral wall at the tip of the high temperature flow pipe 10.
A heat dissipating member 19 having a cap 18 screwed onto the end thereof.
The adjustment screw 20 for releasing high-temperature gas from the center hole of the cap to the inside of the heat dissipation part) rA19 may also be used.
It can also be installed so that it can move forward and backward.

It is desirable that the gas supply lower a of the case 9 be provided at a position slightly offset from the axis.

The vortex tube device 7 shown in FIGS. 3 and 4 was developed in Japan in 1982 by the applicant of the present application as a vortex tube device with far superior performance compared to conventional ones due to the first and second features mentioned above. Although a patent application has been filed under Patent Application No. 174181, the vortex tube device used in the present invention is not limited to the one shown in the figure, and it is of course possible to use any known vortex tube. be.

In either case, compressor 3 and vortex tube device y is compressor 3
The relative relationship shall be maintained such that the function of the vortex tube device (2) is not impaired and a vortex flow at the flow velocity necessary for high-temperature separation is generated in the vortex tube device (2).

FIG. 1 shows an example in which one vortex tube device 7 is used for the compressor 3, but as described above, the function of the compressor 3 is not impaired, and each vortex tube device 7 is equipped with the necessary components for high-temperature separation. Provided that compressed refrigerant vapor is supplied to the compressor 3, for example, as shown in FIG. 2, a plurality of vortex tube devices 7 can be used in parallel.

In this case, the discharge capacity Q1 of the compressor 3 and the total supply capacity Q2 of the plurality of vortex tube devices 7 and -4n are set so as to maintain the relationship Ql>Q2.

In order to increase the fluid friction within the vortex tube device 7 and make its characteristics work efficiently, a relatively small device is desirable, so in order to obtain an effective heat amplification device,
It is more preferable to use a plurality of relatively small vortex tube devices 7.

In addition, when a plurality of vortex tube devices 7 are set in parallel in this way, the high temperature gas outlet lower b of each vortex tube device 7 may be directly connected to the shared condenser 4 via a pipe, but preferably. As shown in FIG. 2, each vortex tube device 7 is provided with an individual condenser 4, and the high temperature gas output lower b of each vortex tube device 7 is connected to the corresponding individual condenser 4 via a pipe. The outlet pipe of the condenser 4 is further connected to another common condenser 4', and the heat exchange medium such as water that has undergone the primary heat exchange in the common condenser 4' is further transferred to the individual condensers 4'. A heat exchange medium circuit is provided so that the heat exchange medium is sequentially circulated through the condenser 4 for heat exchange.

Since the refrigerant on the outlet side of each condenser 4 still retains residual heat, this configuration allows the generated heat to be extracted without wasting it, and the second condenser 4'
Since the heat exchange medium preheated at
'The heat-exchanged endothermic medium has a higher temperature, which has the effect of improving heat exchange efficiency.

Next, the operation of the present invention will be explained. First, when the device of the present invention is used as a heating device, the switching valves 8a and 8b are set so that the refrigerant superheated vapor discharged from the compressor ta3 passes through the vortex tube device 7. put.

The refrigerant in the refrigeration cycle system 1 takes in heat from a heat source such as water W in the evaporator 2, evaporates, and is sucked into the compressor 3.

The superheated vapor of the refrigerant compressed in the compressor 3 is transferred to the pipe 1
a to the vortex tube device 7, and in the process of passing from the supply lower a of the vortex tube device 7 through the groove 11d of the vortex generator 11, it becomes a high-speed vortex, and due to the temperature change characteristics of the vortex tube device 7,
The airflow is divided into a higher temperature airflow and a lower temperature airflow flowing toward the opposing lower outputs b, 7c of the vortex tube device 7.

Since the high-pressure refrigerant vapor supplied to the vortex tube device 7 is compressed by the compressor 3 of the refrigeration cycle, from the viewpoint of the entire refrigeration cycle, the refrigerant vapor is discharged from the high temperature side lower b of the vortex tube device 7. The increased temperature of the steam is increased heat without expending additional work.

In this way, the high-temperature part of the high-pressure refrigerant vapor that has been thermally amplified by the vortex tube device 7 is transferred from the outlet of the high-temperature flow tube 10 to the condenser 4.
After the heat is radiated by heat exchange with water W etc., the expansion valve
The pressure is reduced in the evaporator 2 and the evaporator 2 is circulated again.

In this way, when the device of the present invention is used as a heating device, the superheated vapor of the refrigerant compressed and heated by the compressor 3 is further heated by the vortex tube device 7 and then condensed. The amount of heat obtained in vessel 4 is significantly increased.

On the other hand, the refrigerant vapor in the low-temperature portion separated inside the swirl tube device 7 is introduced into the system 1 from the low-temperature section lower C through the pipe 7c'. When connected to the downstream side of the refrigerant, cooling of the refrigerant is promoted and the refrigeration effect of the refrigeration cycle is improved.

Here, a test example of the thermal amplification effect when the device of the present invention is used in heating operation will be explained.

Test example (1) Type of heat pump refrigerant Freon 22 Refrigerant situation Compressor piston displacement capacity = 46 if/hour Refrigerant circulation amount G = 301 kg/hour (Volume efficiency = 0.85) Compressor rated output = 7.5 kW Heat source section using 12 vortex tube devices arranged in parallel as in the example shown in Figure 2. Heat release section in which water at 16°C was supplied to the evaporator at a flow rate of 151.7 minutes and heat exchanged at 16°C. (2) The pressure and temperature of the refrigerant in each state in the heat pump system during operation of the device were as follows.47 minutes) was 7 minutes.
The water was discharged as 4°C warm water.

Therefore, the amount of heat released from the condenser is (74-16)”cx30I!, x60min=104,4
00Kcal/hour The amount of heat absorbed from the heat source is (16-6)"cx15I!, x60 minutes - 9,000K
cal/hour What is the amount of heat for that amount of work? , 5KWX860Kcal/hour=
Since the output of the compressor used is 7.5KW, assuming that the amount of heat absorbed from the outside air of the heat pump is 5,000Kcal/hour, it is empirically measured in the refrigeration cycle of this test example. The coefficient of performance is 104 00- <90QO+50007.5 (KW
)X860 (Kcal/hour) 90400 14.0 6450.

(3) When the changes in the refrigerant in each state in the table above are expressed on a Mollier diagram, it is as shown in Figure 5. (Since the pressure in the table is gauge pressure, 1 atmosphere is added to the Mollier diagram. ing).

If we add the enthalpy at each state change from this figure, we get A ” B-----11K c a l /
kgC=I)-----8K c a l
/ kg, but since 12 vortex tube devices are used, the total enthalpy between C and 0 is 8 x 12 = 96 K ca 1 / kgC
-E-・----60K cal/kg
Therefore, the coefficient of performance calculated from the change in the state of the refrigerant is (8X12
+60 Yu 156. 14.111 11, which is almost the same as the energy balance based on the empirical calculation.

In the above test example, it was demonstrated that 90,400 Kcal of heat could be obtained from the heat utilization side per hour, but as is clear from Figure 5, the enthalpy of each of A-B and B-E is about 11
and 61, the coefficient of performance of the conventional heat pump according to the same standard is ■Sat #5.5 1, and the amount of heat obtained is (7.5 KW x 860 Kcal/hour) x 5.5 = 35
, stays at 475 Kcal/hour.

Therefore, the difference in the amount of heat of about 55,000 OOKcal/hour is obtained by the heat amplification effect of the device of the present invention without expending any additional energy.

The above has described the case where the refrigeration cycle device of the present invention is used as a heating device, but when the device is used as a refrigeration or cooling device, the switching valves 8a and 8b are operated so that the refrigerant passes through the bypass circuit 1c. By switching, cooling operation can be performed as before.

In this way, when the refrigeration cycle device of the present invention is used as a heating device, it can generate a large amount of heat that far exceeds the sum of the amount of heat taken in from the heat source and the amount of heat obtained by the work of the compressor, without expending any additional work. Not only can heat be amplified, but the same device can also be used for cooling (freezing) operation simply by operating a switching valve.

[Brief explanation of drawings]

FIG. 1 is a flowchart of a heat amplifying device according to the present invention, FIG. 2 is a flowchart of a main part of another embodiment, and FIGS. 3 and 4 are preferred embodiments of a vortex tube device used in the present invention. FIG. 3 is an explanatory diagram of its assembly, and FIG. 4 is a longitudinal sectional view thereof. FIG. 5 is a functional explanatory diagram showing a test example on a Mollier diagram when the device of the present invention is operated in heating mode. 1--------- System IC・-- Bypass circuit 2 --- Evaporator 3-- Compressor 4
------Condenser 5--・-1-------Liquid receiver 6---Expansion valve 7-----1--Vortex flow Pipe devices 8a, 8b---------...
One switching valve 9------------ Vortex generator
14--Gap 15-1--Tapered inner circumferential surface 16--Brake member patent applicant Janchik Co., Ltd. Agent Patent attorney Naoyoshi Sato Figure 1 Figure 2 Procedural Amendment Document 1982 Tsuka 2 Kazuo Wakasugi, Commissioner of the Japan Patent Office■, Indication of the case Japanese Patent Application No. 59-54364 2, Title of the invention Refrigeration cycle device 3, Relationship with the case by the person making the amendment Address of the patent applicant 15-20 Sugawara-cho, Hamamatsu City, Shizuoka Prefecture Name (Name)
Jantic Co., Ltd. 4, IaηL 2 people, Address: 3rd floor 7, Miyoshi Building, 1-23-2 Nishi-Shinbashi, Minato-ku, Tokyo
, Contents of the amendment As per external sales (1) The scope of claims is corrected as shown in the attached sheet. (2) Page 4, line 13 of the specification, “High temperature gas outlet 80~
Adjust to 95%, low temperature gas outlet 20-3%. ” is corrected as follows. "At least 80% (IC) and less than 0% of the gas introduced from the high-pressure gas supply lower a of the vortex tube device 7 flows out from the high-temperature gas outlet lower b, and the rest flows out from the low-temperature gas outlet lower C." Patent As claimed, the low temperature gas output lower C of the vortex tube device 7 is connected to the refrigeration cycle system 1 via a pipe 70', and the discharge side pipe 1a of the compressor 3 and the high temperature side pipe I of the condenser are connected.
Bypass circuit I via switching valves 13a and 3b between
(2) A refrigeration cycle device characterized in that a refrigeration cycle device (2) is provided with a refrigeration cycle system 1. Refrigeration cycle device (3) according to scope 1: pipe 7c' of low temperature gas outlet lower c of vortex tube device 7
The refrigeration cycle device according to claim 1 or 2, characterized in that the refrigeration cycle device is connected between the condenser 4 and the expansion valve 6 of the refrigeration cycle system I.

Claims (2)

[Claims] (1) Discharge side pipe 1 of compressor 3 in refrigeration cycle
a to the high pressure gas supply lower a of the vortex tube device 7, connect the high temperature side pipe 1b of the condenser 4 to the high temperature gas lower b of the vortex tube device 7, and connect the low temperature gas outlet lower C of the vortex tube device 7. is connected to the refrigeration cycle system l via a pipe 7c', and a bypass circuit 1c is further provided between the discharge side pipe 1a of the compressor 3 and the high temperature side pipe lb of the condenser via switching valves 8a and 13b. A refrigeration cycle device featuring (2) The refrigeration cycle system 1 according to claim 1, characterized in that a plurality of vortex tube devices 7 are interposed in parallel between the compressor 3 and the condenser 4 of the refrigeration cycle system 1. The refrigeration cycle device according to claim 1 or 2, characterized in that it is connected between the condenser 4 and the expansion valve 6.