JPS60183791A - Method of producing insulating film of printed board for circuit - Google Patents
Method of producing insulating film of printed board for circuitInfo
- Publication number
- JPS60183791A JPS60183791A JP4065384A JP4065384A JPS60183791A JP S60183791 A JPS60183791 A JP S60183791A JP 4065384 A JP4065384 A JP 4065384A JP 4065384 A JP4065384 A JP 4065384A JP S60183791 A JPS60183791 A JP S60183791A
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- polymer
- film
- circuit
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は絶縁膜の製造方法に関するものである。[Detailed description of the invention] [Industrial application field] The present invention relates to a method for manufacturing an insulating film.
現在、一般に普及している回路用プリント基板の絶縁膜
の製造方法とじてに、熱硬化性の絶縁膜ケスクリーン印
刷によって回路用プリント基板上に所望のパターンで形
成し、この膜を熱硬化する方法が知られている。この方
法で灯、ブリメト基板上に単色の絶縁11r、iを形成
する71zに容易であるが互いに絶縁して作製した配線
パターンごとに絶縁膜の色をぬり分けることU Jif
i+ L、い。才友、配線パターンの断線、ショートラ
見つけるのに伺ら役に立た女い。Currently, the manufacturing method of insulating film for circuit printed circuit boards, which is generally popular, involves forming a thermosetting insulating film in a desired pattern on a circuit printed board by screen printing, and then thermosetting this film. method is known. Although it is easy to use this method to form single-color insulation 11r and i on the bulb board, it is also easy to color the insulation film differently for each wiring pattern that is created by insulating each other.
i+L, yes. A talented friend of mine, a woman who helped me find broken wires and short circuits.
そこで、本発明に上記の様な欠点全除去するために、回
路用プリント基板の互いに絶縁して作製した配線パター
ン上に、選択的に電着された高分子と色素からなる着色
した絶縁111r−形Fi’7 シ、かつ同時に配線パ
ターンの断線、ショートの発見に役立てることを目的と
している。Therefore, in order to eliminate all of the above-mentioned defects in the present invention, a colored insulation layer 111r- made of a polymer and a dye selectively electrodeposited on the interconnection patterns of the circuit printed circuit board, which are insulated from each other, is applied. At the same time, it is intended to be useful in discovering disconnections and short circuits in wiring patterns.
以下、本発明の重豐点である高分子の電着による着色層
の形成方法について述べる。高分子ケミ極上に電廻させ
る手段の1つとして、単1@・体(r ’+、’tt極
上で電気化学的に重合させる方法がある。この方法の一
例として、鉄板上で種々のビニル化合物全電気化学的に
重合させ、高分子皮駒金イ47たという報告がある(金
属表面技術 Vol、19.扁12゜1968)。また
最近でげ、ピロール、チオフェン等を電気化学的に重合
させ、ポリピロール、ポリチェニレン等の導電性高分子
を電!J:l/n作成した研究も盛んに行なわれている
。しかし、このような、直接単量体を電気化学的に重合
させる手段に、効率がまだ良くない、得られた膜がすで
に着色しており、着色の任意性を欠ける等、本発明に用
いるには問題点全有している。電極上に高分子’!ir
Tf 着jせるもう1つの方法として、高分子溶液よ
り電極上に高分子全不溶化、析出させる方法がある。こ
の−例としては、高分子水溶液に顔料を分散させ、金属
を浸漬し電極として用い、該金属上に着色層を電着させ
る電着塗装と呼ばれる方法が工業的に知られており、自
動車ボディのブレコーティング等に用いられている。こ
の方法の原理に、高分子に親水性基、例えばカルボキシ
ル基を導入し、そのカルボキシル基金無機アルカリ、有
機アミン等で中和、水溶化したものを用いる。そして水
溶化した高分子の水溶液に電極を浸漬し、電圧を印加す
ると、水溶液中で解離しているカルボキシルアニオンが
陽極に向って電気泳動し、電極上で水の電気分解により
生じたプロトンと反応することによって高分子が不溶化
、析出してくる。Hereinafter, the method of forming a colored layer by electrodeposition of a polymer, which is the key point of the present invention, will be described. One way to conduct electricity on a polymer chemical pole is to electrochemically polymerize it on a single @ body (r'+,'tt pole. As an example of this method, various vinyl There is a report that polymer keratin metal 47 was obtained by electrochemically polymerizing all compounds (Metal Surface Technology Vol. 19.Ban 12゜1968).Recently, dege, pyrrole, thiophene, etc. were also electrochemically polymerized. Research has been actively conducted to create electroconductive polymers such as polypyrrole and polythenylene by electrolytic polymerization.However, this method of directly electrochemically polymerizing monomers There are many problems in using it in the present invention, such as the efficiency is still not good, the obtained film is already colored, and the coloring is not arbitrary.
Another method for depositing Tf is to completely insolubilize and precipitate the polymer from a polymer solution onto the electrode. As an example of this, a method called electrocoating is known industrially, in which a pigment is dispersed in an aqueous polymer solution, a metal is immersed in it, and used as an electrode, and a colored layer is electrodeposited on the metal. It is used for blur coating, etc. The principle of this method is to introduce a hydrophilic group, such as a carboxyl group, into a polymer, and then neutralize the carboxyl group with an inorganic alkali, an organic amine, etc. to make it water-soluble. Then, when the electrode is immersed in an aqueous solution of the water-soluble polymer and a voltage is applied, the carboxyl anions dissociated in the aqueous solution electrophores toward the anode and react with protons generated by water electrolysis on the electrode. As a result, the polymer becomes insolubilized and precipitates out.
すなわち、陽極上では次式に示す反応が起こり、高分子
の析出が見られることになる。That is, the reaction shown in the following formula occurs on the anode, and polymer precipitation is observed.
2H70→4H”−1−021+40−また、親水性基
に塩基性基(例えはポリアミン)を用い、酸により中和
、水溶化すれば、逆に電極上で高分子の析出が見られる
ことになる。2H70→4H"-1-021+40-Also, if a basic group (for example, polyamine) is used as the hydrophilic group and it is neutralized and made water-solubilized with an acid, polymer precipitation will be observed on the electrode. Become.
電着された高分子が電気絶縁性の場合、電極が高分子で
被覆されるとともに電流が減少し、それ以上の被覆を妨
けるため膜厚の増大は期待できないと考えられるが、実
際は水の電気分解による発生酸素の気泡のため初期の完
全被覆は避けられ、絶縁層となるまでにある程度の膜厚
が得られることとなる。If the electrodeposited polymer is electrically insulating, the current decreases as the electrode is coated with the polymer, preventing further coating, so no increase in film thickness can be expected. However, in reality, water Due to the oxygen bubbles generated by electrolysis, complete coverage at the initial stage is avoided, and a certain degree of film thickness can be obtained by the time it becomes an insulating layer.
アニオン電着用の高分子とじては、天然乾性油トマレイ
ン酸の付加物、カルボキシル基を導入したアルキド樹層
、エポキシ樹脂とマレイン酸の付加物、カルボキシル−
X全導入したポリブタジェン1、i l旨、アクリル酸
またはメククリル酸とそのエステルとの共重合体等が用
いられ、電着皮膜の特性により他の高分子または官能基
を持つ有機化合物を高分子骨格中に導入する場合もある
。Polymers for anionic electrodeposition include adducts of natural drying oil tomaleic acid, alkyd trees with carboxyl groups introduced, adducts of epoxy resin and maleic acid, carboxyl-
A copolymer of acrylic acid or meccrylic acid and its ester, etc., is used, and depending on the characteristics of the electrodeposited film, other polymers or organic compounds with functional groups are added to the polymer skeleton. Sometimes it is introduced inside.
また、高分子中のカルボキシル基、水酸基等の親水性官
能基の量は重要であり、親水性基が多すぎると′M電着
層不溶化が十分でなく、不均一な膜となり、少なすきる
と中和時の水溶性が不充分となる。高分子の溶媒として
は水が主成分1′あるが、イングロハノール、 n −
フチルアルコール、t−ブチルアルコール、メチルセロ
ソルブ、エチルセロンルブ、インプロピルセロソルブ、
プチルセロソルフ、シエチレングリコールメチルエーテ
ル。In addition, the amount of hydrophilic functional groups such as carboxyl groups and hydroxyl groups in the polymer is important; if there are too many hydrophilic groups, the insolubilization of the electrodeposited layer will not be sufficient, resulting in an uneven film. Water solubility during neutralization becomes insufficient. As a solvent for polymers, water is the main component 1', but ingrohanol, n-
Phthyl alcohol, t-butyl alcohol, methyl cellosolve, ethyl seronlube, inpropyl cellosolve,
Butyl cellosol, cyethylene glycol methyl ether.
ジエチレングリコールエチルニーデル、ジアセトンアル
コール等の親水性溶媒が高分子の重合用溶媒として含ま
れる。含オれる親水性溶媒の種類。Hydrophilic solvents such as diethylene glycol ethyl needle and diacetone alcohol are included as solvents for polymerization of polymers. Type of hydrophilic solvent contained.
1は、やはり膜厚や電着層の均一性に大きく影響する。1 also greatly influences the film thickness and uniformity of the electrodeposited layer.
また、電張層を着色する方法と1−てに、染料もしくけ
顔料全重着高分子溶液中に分散し、高分子と共に色素を
膜中に取り込む方法が採用できる。Further, as a method for coloring the electrical tension layer, a method can be employed in which a dye or pigment is first dispersed in a fully polymerized polymer solution, and the dye is incorporated into the film together with the polymer.
以下、本発明を実施例にもとづき詳説−する。Hereinafter, the present invention will be explained in detail based on examples.
(1)図にボすよう力回路用プリ/ト基板1の配線パタ
ーン2,5,4.5上に、色分けきれた絶縁膜を作製す
る場合を考える。(1) As shown in the figure, let us consider the case where insulating films with different colors are formed on the wiring patterns 2, 5, 4.5 of the circuit printed/printed board 1.
下紀絹成の塗Xi (ニスビア、mD−30(IQ 神
東塗刺製)
ニスビアED−1000
を用い、以下の組成の電着浴を作る。An electrodeposition bath having the following composition is prepared using Shimoki Kinunari's coating Xi (Nisvia, mD-30 (IQ Shinto Nuri Sashi Co., Ltd.) and Nisvia ED-1000).
使用する油溶性染料に、親水性溶媒可溶型のものに限定
され、耐光性が非常にすぐれている金属錯塩構造のもの
が望ましい。例えば、次式のような分子構造を持つもの
がある。(製品名でにAiZen 5pilon 、
01eoeoi li’ast等)C!H3
カラーインデックス番号 5olvent Red 8
浴の作成手111tlは、ニスビアED−3000を水
に溶解させる。次に染料會メチルセロソルブ九溶解させ
る。このとき1染料重f#比Xはメチルセロソルブに対
する染料の溶解度奮起えない範囲で任意に選ばれる。染
別會溶解させたメチルセロソルブ全前記水溶液に加え、
染isI ffi均一に分散させる。The oil-soluble dyes used are limited to those soluble in hydrophilic solvents, and preferably have a metal complex salt structure with very good light resistance. For example, some molecules have the following molecular structure: (The product name is Aizen 5pilon,
01eoeoi li'ast etc.) C! H3 Color index number 5olvent Red 8
In the bath preparation step 111tl, Nisbia ED-3000 is dissolved in water. Next, dissolve the dye in methyl cellosolve. At this time, the dye weight f# ratio X is arbitrarily selected within a range that does not affect the solubility of the dye in methyl cellosolve. Add all of the dissolved methyl cellosolve to the above aqueous solution,
Distribute the dye evenly.
このときメチルセロソルブは分散幌として働いているが
、添加量が多くなったり、セロソルブのアルキル基の炭
素わが増えると、膜7卵の増大、110の液の中に、回
路用プリント基板1を津漬する。プリント基板の中で、
赤色の絶縁膜?電着したい部分である電源ライン2全陽
極として10’t/の電圧全3分間印加する。このとき
電流値は通電直後大きな値を示すが、次第に減少し、や
がてほとんどゼロに近づく。続いて回路用プリント基板
を定着液〃・ら引きとげ、電圧が印加されていない部分
に付着した溶液を水で洗い流す。以後同様の操作を黒の
染料7公散した電着液中、緑色の染料全分散した定着液
中、および黄色の染料を分散したH1沼液中で繰り返す
ことにより、グランドライン6゜配線パター/4.配線
パターン5の上に各々黒色、緑色および黄色の絶縁膜全
作製する。次に用箔により形成した絶縁膜中のポリエス
テル樹脂とメラミン#を脂全縮合反応(175℃、50
分)によって硬化させる。At this time, methyl cellosolve acts as a dispersion film, but if the amount added or the amount of carbon in the alkyl group of cellosolve increases, the amount of film 7 will increase, and the printed circuit board 1 will not be placed in the solution 110. Pickle. inside the printed circuit board,
Red insulation film? A voltage of 10't/ is applied for a total of 3 minutes as an anode to the power line 2, which is the part to be electrodeposited. At this time, the current value shows a large value immediately after energization, but gradually decreases and eventually approaches almost zero. Next, the circuit printed circuit board is removed from the fixing solution, and the solution adhering to areas where no voltage is applied is washed away with water. Thereafter, by repeating the same operation in the electrodeposition solution in which black dye 7 was dispersed, in the fixing solution in which green dye was completely dispersed, and in the H1 swamp solution in which yellow dye was dispersed, a ground line 6° wiring pattern/ 4. All black, green, and yellow insulating films are formed on the wiring pattern 5, respectively. Next, the polyester resin in the insulating film formed using the foil and melamine # were subjected to a fat total condensation reaction (175°C, 50°C).
cure by 1 minute).
以上述べrc工程によって、回路用プリント基板の配線
バター/上に多色にぬり分けられた絶縁膜を作製するこ
とができた。Through the rc process described above, it was possible to fabricate an insulating film colored in multiple colors on the wiring butter of a printed circuit board.
また、配線パターン2,3,4.5に断線がある場合に
汀断紳箇所からみて陽極に近い部分のみに絶縁膜が形成
され、断線箇所から先に高分子の重着がおこらないので
、断線箇所の発見が非′、+@に容易である。一方、パ
ターン間に、’/ヨードがある場合には、陽極につない
でいないパターン上に絶縁膜が形成されるので、ただち
に発見できる。In addition, when there is a break in the wiring patterns 2, 3, 4.5, the insulating film is formed only in the part close to the anode when viewed from the break point, and polymer deposition does not occur from the break point first. It is extremely easy to find the location of the disconnection. On the other hand, if there is a '/iodine between the patterns, the insulating film is formed on the pattern that is not connected to the anode, so it can be detected immediately.
(2)実施例1)において、電着浴としてカチオン性高
分子の水溶液音用い、配線パターン全各々陰極に接続す
ることにより、多色にぬり分けられた絶t!P、H!1
を作製した。浴としては、以下の組成のもの音用いた。(2) In Example 1), by using an aqueous solution of a cationic polymer as the electrodeposition bath and connecting each of the wiring patterns to the cathode, a multicolored ZET! P, H! 1
was created. The bath had the following composition:
浴の作成手順を以下に述べる。アクリル樹脂の一部、エ
チルセロソルブの一部よ門・よび顔料の全部を混合し、
この混合物を実験室内3Xロールミル(小平製作新製)
で顔料粒径が0.4μI11以下になるまで分散する。The bath preparation procedure is described below. Mix some of the acrylic resin, some of the ethyl cellosolve, and all of the pigment.
This mixture was processed using a 3X roll mill (newly manufactured by Kodaira Seisaku) in the laboratory.
Disperse until the pigment particle size becomes 0.4μI11 or less.
この分散した混合物にアクリル樹脂の残りとエチルセロ
ソルブの残りおよびイングロビルアルコール全混合する
。そして、中和剤酢酸の全部を徐々に滴下し、続いて水
で希釈し電着浴とした。To this dispersed mixture, the remaining acrylic resin, the remaining ethyl cellosolve, and Inglovir alcohol are all mixed. Then, all of the neutralizing agent acetic acid was gradually added dropwise, and then diluted with water to prepare an electrodeposition bath.
以上、実施例で具体的に述べたように、本発明による回
路用プリント基板の絶縁膜の製造方法は配線パターン上
に、選択的L・こ1川角さi”した高分子と色才からな
る着色した絶縁1株を形成し、以後、同イψの操作音1
;嫁、る色の染利全分散しfc畠分子′市着溶液で繰り
返すという工程なので、色分けさ1]、た絶縁IIIj
iを簡便Cてがっ大量に作製する上できわめて有効であ
る。まfこ、配線パターンの断メロ!、ショートの発見
にも有効である。As described above in detail in the examples, the method for manufacturing an insulating film for a printed circuit board according to the present invention consists of selectively forming a polymer with an angle of L. 1 piece of colored insulation is formed, and from then on, the same ψ operation sound 1 is formed.
Because the process involves completely dispersing the colored dye and repeating it with the FC Hatake Molecule Irrigation Solution, the color classification is 1] and insulation III.
This method is extremely effective in easily producing large quantities of i. Mafko, the wiring pattern is broken! , it is also effective for discovering short circuits.
l・>、1は回路用プリント基鈑を示す。
1・回路用プリント、J^板
2゛°甫源シイノ
ロ・・・グランドライン
4・・−緑色の絶縁膜を電着する配線パターン5・・k
色の絶縁膜ケ審着する配線パターン以 」=
出願人 セイコー電子工業株式会社
(他1名)
代i41人弁理士 最 上 務
第1頁の続き
■発明者 杉野谷 充 東京
会社
@発明者 寺1)由美子 東京
会社
■り発明者 加藤 面構 東京
会社
@発明者 銘木 A2 逗子
@発明者 安用 淳−茅ケ
@発明者 野村 豊和 習志
@発明者 遠1)相馬 東京
[相]発明者 伊藤 慎二習志
都江東区亀戸6丁目31番1号 セイコー電子工業株式
部江東区亀戸6丁目31番1号 セイコー電子工業株式
内
部江東区亀戸6丁目31番1号 セイコー電子工業株式
市川ノ根3丁目1番7号
崎市東海岸南2丁目1旙13号
野市東習志野5丁目1番1号
都葛飾区金町6丁目6番14号
野市東習志賢3丁目7番24号l.>, 1 indicates a printed circuit board. 1. Circuit print, J^ board 2゛°power source...ground line 4...-wiring pattern for electrodepositing green insulating film 5...k
"The wiring pattern for attaching the colored insulating film" = Applicant: Seiko Electronics Industries Co., Ltd. (and 1 other person) Patent attorney: Mogami, 41st attorney Continued from page 1 ■ Inventor: Mitsuru Suginoya Tokyo Company @ Inventor: Temple 1) Yumiko Tokyo Company ■ Inventor Kato Menka Tokyo Company @ Inventor Precious wood A2 Zushi @ Inventor Atsushi Yasuyo - Kayake @ Inventor Toyokazu Nomura Naushi @ Inventor Far 1) Soma Tokyo [Sou] Inventor Shinji Ito 6-31-1 Kameido, Koto-ku, Narashito Seiko Electronic Industries Co., Ltd. 6-31-1 Kameido, Koto-ku Seiko Electronic Industries Co., Ltd. 6-31-1 Kameido, Koto-ku Seiko Electronic Industries Co., Ltd. 3-1 Ichikawanone No. 7: 2-1 Minami Higashikawa, Saki-shi No. 13: 5-1-1 Higashi-Narashino, No-shi 6-6-14 Kanamachi, Katsushika-ku, Miyako
Claims (1)
配線パターン上に、選択的に電着された高分子と色素か
らなる着色した絶縁膜を形成し、以後同様の操作ケ異な
る色で繰り返すことを特徴とする回路用プリント基板の
絶縁膜の製造方法。In printed circuit boards, a colored insulating film made of selectively electrodeposited polymers and dyes is formed on wiring patterns that are insulated from each other, and the same process is then repeated in different colors. A method for manufacturing an insulating film for a printed circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4065384A JPS60183791A (en) | 1984-03-02 | 1984-03-02 | Method of producing insulating film of printed board for circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4065384A JPS60183791A (en) | 1984-03-02 | 1984-03-02 | Method of producing insulating film of printed board for circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60183791A true JPS60183791A (en) | 1985-09-19 |
JPH0211030B2 JPH0211030B2 (en) | 1990-03-12 |
Family
ID=12586508
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4065384A Granted JPS60183791A (en) | 1984-03-02 | 1984-03-02 | Method of producing insulating film of printed board for circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60183791A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6164101A (en) * | 1984-09-05 | 1986-04-02 | 日本電気株式会社 | Circuit part and method of producing same |
JP2012117055A (en) * | 2010-11-08 | 2012-06-21 | Hitachi Chemical Co Ltd | Insulator ink resin composition, resist pattern, and resist pattern-forming method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50118255A (en) * | 1974-03-04 | 1975-09-16 | ||
JPS57140755U (en) * | 1981-02-27 | 1982-09-03 |
-
1984
- 1984-03-02 JP JP4065384A patent/JPS60183791A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50118255A (en) * | 1974-03-04 | 1975-09-16 | ||
JPS57140755U (en) * | 1981-02-27 | 1982-09-03 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6164101A (en) * | 1984-09-05 | 1986-04-02 | 日本電気株式会社 | Circuit part and method of producing same |
JP2012117055A (en) * | 2010-11-08 | 2012-06-21 | Hitachi Chemical Co Ltd | Insulator ink resin composition, resist pattern, and resist pattern-forming method |
Also Published As
Publication number | Publication date |
---|---|
JPH0211030B2 (en) | 1990-03-12 |
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