JPS601835A - Resin sealing device for semiconductor device - Google Patents

Abstract

PURPOSE:To prevent remaining under an unreacted state of the cull of a resin in a pot, etc., and to shorten one-time resin sealing working time by forming a plunger in double structure consisting of an internal section and an external section arranged on the outside of the internal section so as to be positioned on the same axis as the internal section. CONSTITUTION:When a resin tablet 5 is charged into a pot 3 and the external section 6b of a plunger 6 inserted into the pot 3 is dropped, a mainly peripheral section heated and fluidized by a top force 1, a bottom force 2 and the external section 6b in the resin tablet 5 passes in a runner and is extruded into a cavity. When the internal section 6a of the plunger 6 is dropped immediately after or before the dropping of the external section 6b is completed, the residual resin tablet 5 except fluidized one passes in the runner 7 and is extruded into the cavity. Accordingly, a resin is extruded by the plunger 6 while a resin 5 remaining in the pot 3 sufficiently reacts and cures in a very short time after the completion of a final dropping up to a predetermined position of the plunger 6.

Description

[Detailed description of the invention] The present invention relates to a resin sealing device for semiconductor devices.

[Technical Background of the Invention] As shown in FIG. 1, a resin sealing device for a semiconductor device includes an upper mold 1 and a lower mold 2;
A plunger 4 for extruding resin is inserted into a pot 3 formed in 2. Note that a cavity (not shown) in which a semiconductor device to be sealed is set is provided between the upper mold 1 and the lower mold 2 on both sides of the bottle 3 (these cavities and (The run-nor connecting pot 3 is also not shown).

In such a resin sealing device, the portion of the lower mold 2 that constitutes the tip of the plunger 4 and the bottom of the pot 3 is
It is a flat surface parallel to a surface perpendicular to the axial direction of plunge +74.

Therefore, resin sealing of a semiconductor device using such a tree 110,] can be performed as follows. First, a semiconductor device to be resin-sealed is set in the cavity, a (thermosetting) resin tablet 5 is put into the jar 1, and the plunger 4 is inserted into the jars 1 to 3 from the upper end thereof. The resin tablet 5 is heated to 1"L by the tip of the plunger 4 inserted into the bottles 1 to 3 and the lower molds 1 and 2, and becomes fluidized by the pressure of the plunger y4. The resin passes through the runner and is pushed out into the cavity in which the semiconductor device to be resin-sealed is set.Then, by lowering the plunger 4 to a predetermined depth within the pot 3, the resin extrusion into the cavity is completed. Then, after the resin remaining in the pot 3 and the runner hardens, the upper mold 1 and the lower mold 2 are separated from each other and the semiconductor device sealed with resin in the cull and cavity is taken out.

Resin sealing work is performed in this manner.

[Problems with the Background Art] The resin tablet 5 placed in the pot 3 is molded into the lower mold 2 whose surface (periphery) constitutes the tips of the flat plungers A74 and the bottoms of the bottles 1 to 3. and the peripheral wall surface of the upper mold 1 constituting the bot 3, and heat from these parts is transmitted from the periphery to the center of the resin tablet 1-5. Therefore, the central part of the resin tablet 5 (the first
5a in the figure) is heated the slowest.

Therefore, the resin tablets i to 5 are heated and fluidized from their peripheral parts, and at the end of the descent of the plunger 4, the central part of the resin tablet 5 is in an unreacted state (therefore, unreacted) as shown by 5b in FIG. Curing), the resin remains in the pot 3, etc., and therefore the resin remains in the pot.
This will hinder the removal of the product. Furthermore, in order to eliminate such unreacted portions, it is necessary to lengthen the time required for one resin blocking operation. Incidentally, such a problem becomes apparent when using resin tablets I~ that do not breheat.

[Object of the Invention] The present invention has been made to solve the above-mentioned problems.It efficiently heats the resin tablets placed in the pot and removes the resin from the inside of the pot. It is an object of the present invention to provide a resin sealing device for a drying drying device that does not leave any residue in an unreacted state and further shortens the time required for one resin sealing operation.

[Summary of the Invention] The present invention provides a semiconductor device including an upper mold, a lower mold, etc., and a resin extrusion plunger inserted into a bob 1 formed in the upper mold and the lower mold. In the resin sealing device for the plunger 1! is characterized in that it has a double structure consisting of an inner part and an outer part disposed coaxially outside the inner part.

[Embodiments of the Invention] FIG. 3 is a sectional view showing one embodiment of resin sealing work according to the present invention. As shown in the figure, 1 is an upper mold, 2 is a lower mold, 3 is a bot formed by these upper and lower molds 1.2, and 6 is a plunger 11 inserted into the bots 1-3. The plunger 6 consists of a columnar inner part 6a disposed coaxially, and a cylindrical outer part 6b disposed coaxially with the inner part 6a. It is made once. These inner parts 6
a and the outer portion 6b are each independently driven by drive means (not shown) four times within the bot-3. d'3, is the semiconductor device to be sealed placed inside the cell l-'? 1 ability (not shown) is provided between the upper mold 1 and the lower mold 2 on both sides of the bot 3 (runners connecting these cavities and the bot 3 are also not shown)
.

As described above, the resin sealing operation is performed as follows using the resin sealing apparatus according to the present invention. Namely, first, a semiconductor device to be resin-sealed is placed in a cavity. When the resin tablets 5 are placed in the cylinders 1 to 3 and the outer portion 6b of the plunger 6 inserted into the cylinder 3 is lowered, the resin tablets 5 are poured into the resin tablets 1 as shown in FIG. Of these, (mainly) the peripheral portions heated and fluidized by the tips of the upper mold 1, lower mold 2, and outer portion 61 are pushed out into the cavity through the runner. While the resin tablet 5 is being lowered through the bot 3, the portion (mainly the center portion) remaining inside the outer portion 61) of the resin tablet 5 is effectively heated and fluidized by the outer portion 6b.

Then, immediately after or before the end of the descent of the outside portion 6b, if the inside portion 6a of the plunger 6 is lowered ten times,
The remaining fluidized resin tuffret 5 is extruded into the cavity through the runner 7.

In this way, the resin is extruded by the plunger, and on the other hand, from the time when the plunger 6 finally finishes descending to the predetermined position, the resin remaining in the bot 3 is extruded at λ (j time) as shown in FIG. No. 5 reacts sufficiently and hardens.

[Effects of the Invention] As explained above, according to the present invention, the resin tablets placed in the pot are heated evenly including the center thereof, so that the resin tablets are heated with high efficiency for hardening. One resin sealing operation can be performed efficiently and in a short time without taking any extra time.

[Brief explanation of drawings]

1 and 2 are sectional views of a conventional resin sealing device, and FIGS. 3, 4, and 5 are sectional views showing one embodiment of the resin sealing device according to the present invention. 1... Upper mold 2... Lower mold 3... Bot 9
．． 6...Plunge<p 6a...Inner part 6b・
・・Outer Part Application Agent Patent Attorney Kikuchi 5th Department 1st Cause 2rX1

Claims (1)

[Claims] "Lower mold J3 J: A resin stopper for semiconductor devices comprising a lower mold and a resin extrusion plunger inserted into the holes formed in the upper and lower molds,
A resin sealing device for a semiconductor device, characterized in that the plunger has a two-piece structure consisting of an inner portion and an outer portion disposed coaxially with the inner portion.