JPS601834A - Resin sealing device for semiconductor device - Google Patents

Abstract

PURPOSE:To prevent remaining under an unreacted state of the cull of a resin in a pot, etc., and to shorten one-time resin extrusion working time by forming the nose section of a plunger and at least one of the sections of a bottom force constituting the bottom of the pot for the resin to shapes containing projections. CONSTITUTION:A resin tablet 5 is charged into a pot 8, the top section of a cone collides with the resin tablet 5 with the dropping of a plunger 9 and the top of the cone gradually intrudes toward the central section of the tablet 5 because the nose section of the plunger 9 takes the cone. Consequently, not only the peripheral section of the resin tablet 5 is heated from a top force 6 and a bottom force 7 but also the central section is heated from the nose section (its projection 9a) of the plunger 9. Accordingly, the whole resin tablet 5 is heated substantially and uniformly and reacts. As a result, the cull of a resin curing in a very short time after a point of time of the completion of the dropping of the plunger 9 and a sealed semiconductor device can be extracted because the resin 5c remaining in the pot 8 at the point of time when the dropping of the plunger 9 is completed sufficiently reacts already.

Description

[Detailed description of the invention] The present invention relates to a resin sealing device for semiconductor devices.

[Technical Background of the Invention] As shown in FIG.
, and a plunger 4 for extruding resin inserted into a bot 3 formed in 2. Note that cavities (not shown) for setting semiconductor devices to be sealed are provided on both sides of the bot 3 (runners connecting these cavities and the bot 3 are also not shown).

In such a resin sealing device, the portion of the lower mold 2 that constitutes the tip of the plunger 4 and the bottom of the bot 3 is
It is a flat surface parallel to the surface perpendicular to the axial direction of the plungers 1 to 4.

Therefore, the resin extrusion work using this J: Eel resin sealing device is performed as follows. First, a (thermosetting) resin tablet 5 is put into the pot 3, and the plunger 4 is inserted into the pot 3 from the upper end thereof. The tip of the plunger 4 inserted into the pot 3 and the upper and lower molds 1,
2, the resin tablet 5 is heated and fluidized, and by the pressure of the plunger 4, the semiconductor device to be resin-sealed is passed through the runner and extruded into the cavity. Then, by lowering the plunger 4 to a predetermined depth inside the bot 1-3, the extrusion of the tree Il into the cavity is completed, and then the bot 3
After the resin remaining inside the pot and runner has hardened, the upper mold 1 and the lower mold 2 are separated from each other, and the resin inside the pot and runner and the semiconductor device sealed with resin inside the cavity are taken out. -0 Such a resin extrusion operation is performed, and this is repeated.

[Problems with the background art] The tip of the plunger 4 and the bottom mold 2 of the bottoms of the bottles 1 to 3
Since the portions are parallel flat surfaces, the surface (periphery) of the resin tablet 5 placed in the pot 3 is in contact with the tip of the flat plunger 4, the lower mold 2, and the upper mold 1. It contacts the peripheral wall surface and is heated by these from the periphery toward the center. Therefore, the central portion of the resin tablet 5 (indicated by 5a in FIG. 1) is heated the slowest.

Therefore, the resin tablet 5 is heated and fluidized from its periphery, and at the end of the descent of the plunger 4,
As shown by 5b in FIG. 2, the center portion of the resin tablet 5 tends to remain in the pot 3 in an unreacted state (therefore, uncured), and as a result, the resin remaining in the pot is trapped. This will interfere with the delivery. Furthermore, in order to eliminate such unreacted portions, the time required for one resin extrusion operation must be increased. In addition, such a thing is remarkable when using the resin tablet 1 which does not heat up.

[Object of the Invention] The present invention has been made to solve the above-mentioned problems.It heats the resin tablet placed in the pot evenly and efficiently, including the center, so that the inside of the pot, etc. It is an object of the present invention to provide a resin sealing device for a semiconductor device which prevents resin cull from remaining in an unreacted state and further shortens the time required for one resin extrusion operation.

[Summary of the Invention] The present invention provides a resin sealing device for a semiconductor device, which includes an upper mold, a lower mold, and a resin extrusion plunger 17 inserted into a pot formed in the upper and lower molds. ,
Said plunge 1? At least one of the parts of the lower mold constituting the tip of the resin pot and the bottom of the resin pot is shaped to include a protrusion.

[Embodiments of the Invention] FIG. 3 is a sectional view showing one embodiment of a resin sealing device according to the present invention. As shown in the figure, 6 is an upper mold, 7 is a lower mold, 8 is a pot formed by these upper and lower molds 6.7, and 9 is a plunger inserted into the pot 8. The tip of the plunger 9 is a conical projection 9a. A portion of the lower mold 7 forming the bottom of the bottle 1-8 is a flat surface perpendicular to the axial direction of the plunger 9.

Therefore, since the tip of the plunger 9 has a conical shape, as the resin tablet 5 is put into the pot 8 and the plunger 9 is moved downward, the top of the cone hits the resin tablets 1 to 5. Then, dig into the center. Therefore, not only the peripheral part of the resin tablet 5 is heated by the upper mold 6 and the lower mold 7, but also the center part is heated by the tip (protrusion 9a) of the plunger 9, and as a result, the resin tablet 5
is heated and reacted substantially uniformly throughout. Therefore, as shown in FIG.
(dimension C) has fully reacted, so that the cured resin shell and the sealed semiconductor device can be taken out in a very short time after the plunger 9 finishes descending.

FIG. 5 is a sectional view showing another embodiment of the resin sealing device according to the present invention. In the figure, the same parts as in FIG. 3 are indicated by the same reference numerals. As illustrated, the tip of the plunger 10 is a flat surface perpendicular to its axial direction. pot 11
A portion of the lower mold 12 that constitutes the bottom of the mold 12 is composed of a conical protruding portion 12a. Therefore, the plunger 10
By lowering the protrusion 12a, the tip 9 of the protrusion 12a sinks into the center of the resin tablet 1 inserted into the bottle 11, and the entire resin tablet 5, including the center, is completely Heats efficiently and evenly. Therefore, at the end point 04 of the plunger 10, the pot 1
The resin remaining in 1 has reacted sufficiently. Note that during the descent of the plunger 10, the heated and fluidized resin hits the slope of the protrusion 12a and is efficiently guided into the runner.

FIG. 6 is a sectional view showing still another embodiment of the resin sealing device according to the present invention. In the figure, the same parts as in FIG. 3 are indicated by the same reference numerals. As shown, plunge l113
A protrusion 13a is formed at a part of the tip. The part of the lower mold 7 that constitutes the bottom of the bot 14 is the plunger 13
It is a flat surface perpendicular to the axial direction. Therefore, by lowering the plunger 13, the protrusion 13a sinks into the center of the resin tablet 5 put into the bot 14, and the entire resin tablet 5, including the center, is efficiently Heats evenly and reacts.

[Effects of the Invention] As explained above, according to the present invention, the resin tablet placed in the bot is evenly and efficiently heated and reacts, including its center, so no extra time is required for its hardening. One-time resin extrusion work can be performed efficiently and in a short time without taking up

[Brief explanation of drawings]

1 and 2 are cross-sectional views of a conventional resin sealing device, FIGS. 3 and 4 are cross-sectional views showing an embodiment of the resin sealing device according to the present invention, and FIG. 5 is a cross-sectional view of a conventional resin sealing device. FIG. 6 is a sectional view showing still another embodiment of the resin sealing device according to the present invention. 6... Upper mold 7.12... Lower mold 8.11.1
4...Bot 9.10,13...Plunge Il application agent Patent attorney Kikuchi Department 5

Claims (1)

[Claims] Upper mold J: In a resin sealing device for a semiconductor device comprising an upper mold, a lower mold, and a resin extrusion plunger inserted into a bot formed in the upper and lower molds, the tip of the plunger 17 and a resin sealing device for a semiconductor device, characterized in that at least one of the parts of the lower mold constituting the bottom of the bot is shaped to include a protruding part.