JPS60183157A - Connection of recording head, drive circuit part and support - Google Patents

Abstract

PURPOSE:To enhance positional determination accuracy by simplifying a jig used in connection, by connecting a recording head, a drive circuit part and a support by injecting an adhesive from one or more of the piercing hole provided to the support. CONSTITUTION:A recording head 5, a drive circuit part 4 and a support 1 are formed by a known method and, after piercing holes 2 are provided to the support 1, the positional alignment of the recording head 5, the drive circuit part 4 and the support 1 is performed by a known method and an adhesive is injected from the piecing holes 2 to connect the recording head 5, the drive circuit part 4 and the support 1. The adhesive injection parts may be limited to the part where the piercing holes 2, the recording head 5 and the drive circuit part 4 are contacted, and the recording head 5 and the drive circuit part 4 can be set to the entire surface of the support 1 of the part contacted with the support 1 by a press injection means but injection is pref. performed so as to embed the piercing holes 2.

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field The present invention relates to a method for joining a recording head, a drive circuit section, and a support of a liquid jet recording apparatus.

(2) Background technology The inkjet recording method (liquid jet recording method) is capable of high-speed recording, in that the noise generated during recording is extremely small to the extent that it can be ignored, and it has a fixation rate of 5% compared to plain paper. Recently, Seki ID has been attracting a lot of attention because it allows full-color recording without the need for extensive processing.

Generally, the recording head of a recording device used for inkjet recording has an orifice that discharges droplets.
, a liquid flow path corresponding to each orifice, and for each liquid flow path,
Energy generating means for forming flying droplets in the liquid filling the liquid flow path is provided, and each liquid flow path has a structure in which liquid is supplied from a liquid chamber communicating with each liquid flow path. There is.

Such a recording head is fixed on a support such as a carriage that can relatively scan the recording material, along with a drive circuit section for supplying a recording signal to the energy generating means of the recording head. is common.

Conventionally, a common method for fixing such a recording head and drive circuit section on a support is to apply an adhesive to the support and stick the recording head, drive circuit section, and support together. Met.

However, in this method, the positioning of the recording head, which requires high positioning accuracy, is performed after applying the adhesive, which makes positioning difficult, and because it is not possible to use an adhesive with a short bonding time, it may lead to sticking. There were problems such as the time required for joining, and a large-scale jig was required for joining. Furthermore, with the method of positioning after applying adhesive, the adhesive at the joints tends to become uneven and gaps are likely to form.For this reason, heat dissipation is difficult in recording heads that generate heat using heat generating elements as energy generating means. There were drawbacks such as reduced effectiveness.

(3) Disclosure of the Invention The present invention has been made in view of the above-mentioned facts, and an object of the present invention is to provide a recording head, a drive circuit section, and a support body of a liquid jet recording apparatus that solves the above-mentioned problems. The object of the present invention is to provide a new joining method.

The above objects of the present invention are achieved by the present invention as follows. When bonding a recording head of a liquid jet recording device, a drive circuit section of the head, and a support between the head and the drive circuit section, one or more through holes are provided in the support, and an adhesive is applied through the through holes. A method for joining a recording head, a driving circuit section, and a support body of a liquid jet recording apparatus, characterized in that the recording head, drive circuit section, and support body are joined by injection.

(4) Best Mode for Carrying Out the Invention The present invention will be described in detail below with reference to the drawings.

FIG. 1 is a diagram showing the completed assembly of a recording head, a drive circuit section, and a support shown for explaining one embodiment of the method of the present invention, and shows the assembled components in the droplet ejection direction (first direction).
2 is a side view seen from a direction perpendicular to the arrow direction in the figure. FIG. 2 is a view of the support viewed from the joint surface side.

In Figures 1 and 2, reference numeral 1 denotes a support, and when the recording head 5 generates heat, it is generally made of a material with good thermal conductivity such as aluminum or silicon nitride. . Reference numeral 2 denotes through holes provided on the support 1 to carry out the method of the present invention, and in this example, there are eight through holes. In the present invention, it is essential to provide the support 1K and one or more through holes 2, but the installation position, number and shape of these through holes 2 can be set as desired. Reference numeral 5 denotes a well-known recording head equipped with a desired energy generating means, such as a heating element, a piezoelectric element, etc., and 4 denotes a well-known recording head equipped with a control means such as a drive circuit board for supplying a recording signal etc. to the recording head 5. This is the drive circuit section.

After creating the recording head 5, drive circuit section 4, and support l by a well-known method, and providing the through-hole 2 in the support 1,
The recording head 5, drive circuit section 4, and support body 1 are aligned using a well-known method, and adhesive is injected into the through hole 2 to bond them together. The adhesive may be of the desired material, such as epoxy, such as Amune or Loctite, an ultraviolet curing agent such as acrylic, silicone conductive paste (adhesive), or epoxy mixed with a filler such as Az metal powder. Can be used.

The portion where the adhesive is injected may be limited to the portion where the through hole 2 contacts the recording head 5 and the drive circuit portion 4, or
Although it is possible to fill the entire surface of the support 1 where the recording head 5 and drive circuit section 4 come into contact with the support 1 by means such as press-fitting, it is preferable to inject so as to fill the through holes 2.

In addition, during bonding, the bonding surface 3 composed of the recording head 5, the drive circuit section 4, and the support body 1 is filled with a material having a high thermal conductivity, such as an inorganic filler made of silicone, etc., in contact with the through hole 2. After applying the adhesive to all surfaces except for the surfaces to be bonded, perform the same positioning as described above, inject the adhesive into the through hole 2, and partially adhere them (i.e., adhere only the portion of the through hole 2 of the bonding surface 3), etc. It is also possible to do so, and in this case, the heat dissipation effect can be improved.

According to the method of this example, after the recording head 5, drive circuit section 4, and support body 1 are positioned, it is possible to bond them together, and therefore, these can be positioned with high precision. Furthermore, since bonding is performed after positioning, it is possible to use an adhesive having a desired bonding time. Furthermore, by providing a through hole, ultraviolet rays can be irradiated through the through hole, so it is possible to effectively use an ultraviolet curable adhesive, which has been difficult to use in the past 7). In other words, 1-) After injecting the above-mentioned ultraviolet curing agent, if ultraviolet rays are irradiated through the through hole at the desired time, it is possible to achieve strong adhesion in a short time and at the desired time. . In addition, as the above-mentioned filling month, after applying an adhesive 2 with high thermal conductivity, such as the above-mentioned silicone paste (silicon adhesive), an adhesive with a short adhesion time, such as the above-mentioned ultraviolet curing agent, etc., is applied and penetrated. It is also possible to inject it into the hole 2 and partially adhere it, but in this case, in addition to the heat dissipation effect, it is also possible to improve the adhesion.

Figures 3 and 4 are diagrams for explaining another embodiment of the present invention, with Figure 3 being a completed assembled view similar to Figure 1, and Figure 4 showing the support body from the joint surface side. This is the view.

In this example, a recess 6 is provided around the through hole 2 of the support 1 to serve as an adhesive reservoir or a filler part to improve adhesive strength and heat dissipation effect.

That is, when the recess 6 is used as an adhesive reservoir, after the above-mentioned positioning, the adhesive is injected into the through hole 2 as well, and the recording head 5, drive circuit section 4, and support 1 are injected into the through hole 2.
join. According to this method, a large amount of adhesive is injected into the recess 6, so that the adhesive strength is improved.

If the recess 6 is to be used as a filling material, for example, after the above-mentioned positioning, the filling material is injected through the through hole 2, and the bonding surface of the recording head 5 and the drive circuit section 4 is connected to the through hole 2.
The recording head 5, the drive circuit 4, and the support 1 are joined by removing the filler between them and injecting adhesive from the through hole 2 so as to fill the through hole 2. In this case as well, if the filling feathers are made of a material having high thermal conductivity as described above, it is possible to improve the heat dissipation effect.

FIG. 5 is a diagram for explaining still another embodiment of the present invention, and shows a completed assembled view similar to FIG. 1.

In this example, the through hole 2 provided in the support 1 is funnel-shaped. Thereby, the adhesive can be sufficiently injected, and the adhesive area can also be increased, so that the adhesive force can be improved. In addition, when the adhesive is an ultraviolet curing agent, the funnel shape of the through hole 2 plays the role of a light guide for the rung having a backward characteristic (spreading) during ultraviolet irradiation, and the ultraviolet rays A sufficient amount of flooring can be formed inside the resin, and curing can be performed sufficiently and quickly.

The effects brought about by the present invention described above include those listed below.

(2) By providing a through hole in the support and injecting the adhesive through the through hole, it became possible to perform the adhesion process after positioning. Therefore, it was possible to simplify the jigs and the like for joining, and it was also possible to improve positioning accuracy.

■Since it is possible to fill the joint surface with a filler material with high thermal conductivity, it is possible to improve the heat dissipation effect and adhesiveness.

The 0 through holes allow the use of UV-curable adhesives with strong adhesion and good heat resistance, and can be bonded by irradiating UV rays from the back side.

[Brief explanation of drawings]

1 and 2 are diagrams for explaining one embodiment of the present invention, FIGS. 3 and 4 are diagrams for explaining another embodiment, and FIG. 6 is a diagram for explaining yet another embodiment. FIG. 1...Support body 2...Through hole 3...Joining surface 4...Drive circuit section 5...Recording head 6...Rotation section 7...Droplet discharge direction Patent applicant Canon Co., Ltd. Company Figure 1 Figure 2 Figure 2 Figure 3 Figure 5

Claims (2)

[Claims] (1) When joining a recording head of a liquid jet recording device, a drive circuit section of the head, and a support for the head and drive circuit, one or more through holes are provided in the support, and one or more through holes are formed in the support. A method for joining a recording head, a driving circuit section, and a support body of a liquid jet recording apparatus, the method comprising joining the recording head, drive circuit section, and support body by injecting an adhesive. (2) The bonding method according to claim 1, wherein the adhesive is an ultraviolet curing adhesive.