JPH06226977A - Ink jet head - Google Patents

Abstract

PURPOSE:To facilitate controlling the amount and permeation of an adhesive which permeates the space of the joining surface between a nozzle plate and a passage substrate by introducing the adhesive by the capillary force of a channel installed on the joining surface of the passage substrate. CONSTITUTION:A channel 22, which is formed by injection molding, dicing saw processing, etc., is installed on the joining surface 21 of a passage substrate (composed of a passage substrate 1 and piezoelectric voltage 8). After a nozzle plate being positioned with the jouning surface 21 of the passage substrate, an adhesive with viscosity and surface tension set appropriately is introduced into the channel space formed between the channel 22 and the nozzle plate 2 by the capillary force to fill the entire space. When the dimensions of each part and leakage is set so that the capillary force (channel capillary force) of a nozzle hole, the capillary force (space capillary force) of the space of the joining surface, and the capillary force of a penetrating hole (penetrating capillary force) are in the relation of (nozzle capillary force)<(channel capillary force) or (penetrating capillary force)<(space capillary force), the adhesive permeates the joining surface easily without clogging the nozzle hole through the channel or the penetrating hole.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet head. More specifically, the present invention relates to an inkjet head in which the nozzle plate and the flow path substrate are easily and reliably joined.

[0002]

2. Description of the Related Art FIGS. 4 (a), 4 (b) and 4 (c) are views showing the basic structure of an ink jet head of an ink jet recording apparatus, and FIG. 4 (a) is a perspective view showing the components.
4B is a perspective view showing the back surface of the flow channel plate, and FIG. 4C is a perspective view when the constituent elements are integrally joined. In the figure, 1 is a flow channel plate, 2 is a nozzle plate, and 3 is a nozzle. Reference numeral 4 is a partition wall, 5 is a pressure chamber, 6 is an ink chamber, 7 is an ink supply port, 8 is a piezoelectric body, and 9 is a piezoelectric body.
Is a partition slit, 10 is a strained portion, 11 is a filler, and 12 is a substrate.

In FIG. 4, the flow path plate 1 is provided with an ink chamber 6 which receives ink supplied from the ink supply port 7 and stores ink therein, as shown in FIG. Further, a plurality of pressure chambers 5 that communicate with the ink chamber 6 and are partitioned by the partition wall 4 to form a flow path for the ink and generate a pressure wave in the ink by pressurization are provided in parallel. A piezoelectric body 8 and a substrate 12 are sequentially joined to the flow path plate 1, and the piezoelectric body 8 is provided with a strain section 10 that applies pressure to the pressure chamber 5. The strained portion 10 is partitioned by the partition slit 9, and the partition slit 9 is filled with a soft and elastic filler 11. A nozzle plate 2 having a nozzle 3 corresponding to the pressurizing chamber 5 is joined to the nozzle side 5a of the pressurizing chamber 5 of the flow path plate 1, and is integrally configured as shown in FIG. 4 (c). When a signal based on image information is applied to the strain section 10, the volume inside the pressurizing chamber 5 changes to generate a pressure wave, and an ink droplet is ejected from the nozzle.

FIG. 5 is a diagram for explaining an example of a conventional technique for joining the nozzle plate 2 to the ink jet head as described above, and FIG. 5 shows a case where the joining material is removed by excimer laser light. FIG. First, as shown in FIG. 5A, a film-shaped bonding material 16 is attached to the bonding surface 15a of the base plate 15 in which the nozzles 3 and the ink flow paths (not shown) are formed. Next, as shown in FIG. 5B, after the bonding material 16 is attached to the bonding surface 15a of the base plate 15, the bonding material 16 blocking the nozzle 3 on the base plate surface is irradiated with excimer laser light 17 as photon energy. To remove. At this time, it is possible to squeeze the excimer laser beam 17 to the size of the nozzle hole diameter to remove the holes one by one, but a metal plate with a plurality of holes of substantially the same size as the nozzle hole diameter is used as a mask. It is also possible to shorten the time by simultaneously using a plurality of them and removing a plurality of them simultaneously. In addition, in the next step of joining, in order to prevent the joining material from being clogged in the nozzle, the removal amount of the joining material is set to be larger than the nozzle hole diameter. FIG. 5C shows a step of joining the base plate 15 and the nozzle plate 18 to each other. After the nozzles of the base plate 15 and the nozzle plate 18 are aligned with each other before joining, a pressing force is applied by using a hot press. 2 kg / c
Bonding is possible in a short time under the conditions of m ² , heating temperature = 100 ° C., and heating time = 10 seconds.

As described above, after the nozzle plate 18 and the base plate 15 are bonded together via the bonding material 16, the bonding material in the nozzle 3 can be removed from the nozzle plate 18 or the base plate 15 side. The joining material clogged in the nozzle 3 is irradiated with excimer laser light and removed.

[0006]

However, according to the above-mentioned prior art, the excimer laser is used to remove the unnecessary bonding material, which increases the equipment cost, and the head member, Alternatively, the metal mask may be damaged, and it is difficult to control the processing conditions.

[0007]

In order to solve the above problems, the present invention provides (1) a flow channel substrate having an ink flow channel formed thereon,
In an ink jet head formed by joining a nozzle plate having nozzles communicating with the flow passage, a groove for introducing an adhesive is provided on a nozzle plate joining surface of the flow passage plate, and further, (2) above (1) ), The nozzle plate has a through hole communicating with the groove separately from the nozzle hole, and further, (3) in (1) or (2) above, the flow path substrate bonding surface of the nozzle plate, or Roughening treatment is applied to both the nozzle plate joining surface of the flow path substrate or both of the joining surfaces, and (4) In the above (3), the roughening treatment is UV. Irradiation treatment or corona discharge treatment, and (5) In (1) and (2) above, the capillary force acting on each of the nozzle holes, grooves, through holes, gaps in the joint surface, and nozzle capillary force < Groove capillary force or through-hole capillary force <gap capillary force As described above, the size and wettability of each part are set.

[0008]

[Function] A groove is provided on the joint surface of the flow path substrate, and an adhesive is introduced into the groove so that the adhesive penetrates into the gap between the joint surfaces by the capillary force generated between the joint surfaces of the substrate and the nozzle plate. , The amount of adhesive and the degree of penetration can be easily controlled, and workability is improved. Further, the adhesive in the groove is exposed to the outside air through the through hole provided in the nozzle plate, and the volume change of the adhesive at the time of curing is adjusted by the adhesive at the exposed portion to change the volume of the adhesive. The strain acting between the substrate and the nozzle plate due to is relaxed.

[0009]

1 (a) to 1 (d) are views showing an embodiment of the present invention. Hereinafter, description will be made in the order of (a) to (d).
(A) shows the flow channel substrate side joint surface 21, and the groove 22 is provided in the flow channel substrate side joint surface 21 (consisting of the flow channel substrate 1 and the piezoelectric body 8). The groove 22 is formed by injection molding, dicing saw processing or the like. (B) shows a state in which the nozzle plate 2 is installed and aligned on the flow path substrate side joint surface 21. (C) A state in which an adhesive having a viscosity and surface tension set appropriately is applied to the groove space formed by the groove 22 and the nozzle plate 2, and the adhesive is introduced into the entire space by capillary force (shaded line 31). Indicates. (D) is a wettability between the adhesive and the nozzle plate joint surface, the flow path substrate joint surface, and the surface tension, viscosity, and curing characteristics of the adhesive. 2 shows a state (shaded line 32) of permeating the entire gap between the joint surfaces of the nozzle plate 2 and the nozzle plate 2.

FIG. 2 shows another embodiment of the present invention. The difference from the embodiment shown in FIG.
2'is widened to facilitate the introduction of adhesive.

FIG. 3 shows another embodiment of the present invention. In this embodiment, the through hole 2 communicating with the groove portion is formed in the nozzle plate 2.
3 is provided, and when the nozzle plates are joined, the adhesive is partially exposed to the outside air through the through holes 23. As a result, the volume change of the adhesive when the adhesive is cured is adjusted by the adhesive in the through holes 23, and the influence (strain) exerted between the flow path substrate bonding surface 21 and the nozzle plate 2 due to the adhesive volume change. Can be relaxed. This through hole 23 is formed by injection molding, press working, punching (punching) working, dicing saw working, laser working, or the like.

Further, roughening of the joint surface is effective as a means for improving the wettability as a factor of the capillary force and the adhesive strength of the joint surface. As the roughening treatment, for example,
UV irradiation, corona discharge treatment, etc. are available.

Further, in the present invention, the capillary force generated in the nozzle hole (nozzle capillary force), the capillary force generated in the groove (capillary force of the groove), the capillary force generated in the gap between the joint surfaces (the gap capillary force) and the through hole. Capillary force (through-hole capillary force) is nozzle capillary force <
If the dimensions and wettability of each part are set so that groove capillary force or through-hole capillary force <gap capillary force, adhesive is introduced from the groove or through-hole to bond to the joint surface without blocking the nozzle hole. The agent can be penetrated.

[0014]

[Advantageous Effects] According to claim 1, since a groove is provided in the joint surface on the side of the flow path substrate and the adhesive is introduced by the capillary force from the groove, a gap between the joint surface between the nozzle plate and the flow path substrate is formed. It is easy to control the amount of the adhesive and the degree of penetration when the adhesive is permeated into the. Effect on claim 2; The adhesive is exposed through the through hole provided in the nozzle plate, and the strain due to the volume change when the adhesive is cured can be alleviated.
Effect on Claim 3; By roughening the joint surface, the wettability of the joint surface is increased and the adhesive strength is improved.

[Brief description of drawings]

FIG. 1 is a diagram for explaining an embodiment of a nozzle plate joining method according to the present invention.

FIG. 2 is a diagram for explaining another embodiment of the nozzle plate joining method according to the present invention.

FIG. 3 is a diagram for explaining another embodiment of the nozzle plate joining method according to the present invention.

FIG. 4 is a diagram for explaining an example of an inkjet head to which the present invention is applied.

FIG. 5 is a diagram for explaining an example of a conventional nozzle plate joining method and a conventional adhesive removal method.

[Explanation of symbols]

1 ... Flow path substrate, 2 ... Nozzle plate, 3 ... Nozzle, 4 ... Partition wall,
5 ... Pressurization chamber, 6 ... Ink chamber, 7 ... Ink supply port, 8 ... Piezoelectric body, 9 ... Partition slit, 10 ... Distorted part, 11 ... Filler,
12 ... Substrate, 15 ... Base plate, 16 ... Bonding material,
17 ... Excimer laser light, 18 ... Nozzle plate, 21
... Flow path substrate side bonding surface, 22 ... Groove, 23 ... Through hole.

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Yoichiro Miyaguchi 1-3-6 Nakamagome, Ota-ku, Tokyo Inside Ricoh Co., Ltd. (72) Inventor Kenichi Ichikawa 1-3-6 Nakamagome, Ota-ku, Tokyo In stock company Ricoh (72) Inventor Masayuki Iwase 1-3-6 Nakamagome, Ota-ku, Tokyo Inside Ricoh stock company (72) Inventor Osamu Naruse 1-3-6 Nakamagome, Ota-ku, Tokyo Inside Ricoh company (72) Inventor Yoshihisa Ota 1-3-6 Nakamagome, Ota-ku, Tokyo Inside Ricoh Co., Ltd. (72) Inventor Tsutomu Sasaki 1-3-3 Nakamagome, Ota-ku, Tokyo Inside Ricoh Co., Ltd.

Claims (3)

[Claims] 1. An ink jet head comprising a flow path substrate having an ink flow path and a nozzle plate having nozzles communicating with the flow path, wherein an adhesive is applied to a nozzle plate bonding surface of the flow path plate. An ink jet head having a groove to be introduced. 2. The ink jet head according to claim 1, wherein the nozzle plate has a through hole communicating with the groove in addition to the nozzle hole. 3. The roughening treatment according to claim 1 or 2, wherein the flow path substrate bonding surface of the nozzle plate, the nozzle plate bonding surface of the flow path substrate, or both of the bonding surfaces are roughened. Inkjet head characterized in that