JPS60180136A - Handling apparatus for semiconductor element inspection - Google Patents
Handling apparatus for semiconductor element inspectionInfo
- Publication number
- JPS60180136A JPS60180136A JP3553784A JP3553784A JPS60180136A JP S60180136 A JPS60180136 A JP S60180136A JP 3553784 A JP3553784 A JP 3553784A JP 3553784 A JP3553784 A JP 3553784A JP S60180136 A JPS60180136 A JP S60180136A
- Authority
- JP
- Japan
- Prior art keywords
- setting
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- section
- lights
- numeral display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】 （技術分野） 本発明は半導体素子検査用ハンドリング装置に関する。[Detailed description of the invention] (Technical field) The present invention relates to a handling device for testing semiconductor devices.
（従来技術）
従来、半導体素子の特性検査をするノ・ンドリング装置
は、半導体素子の種類によシ検査条件を設定し直すよう
になっている。(Prior Art) Conventionally, a non-driving device for testing the characteristics of a semiconductor device is designed to reset testing conditions depending on the type of semiconductor device.
第１図（ａｌ 、 （ｂ）は従来の半導体素子検査用ノ
・ンドリンク装置の一例の正面図及び側面図である。FIGS. 1A and 1B are a front view and a side view of an example of a conventional non-link device for testing semiconductor devices.
第１図ｆａｌ 、 ｌｂ）に示すように、ハンドリング
装置は、供給部１．測測定２．内部回路等を収納する収
納部３．半導体素子の種類ごとに検査条件を設定し直す
検査条件設定部４から構成されている。As shown in FIG. 1 (fal, lb), the handling device includes a supply section 1. Measurement measurement 2. Storage section 3 for storing internal circuits, etc. It consists of an inspection condition setting section 4 that resets inspection conditions for each type of semiconductor element.
第２図は第１図（ａ）に示す半導体素子検査用ハンドリ
ング装置の検査条件設定部の正面図である。FIG. 2 is a front view of the inspection condition setting section of the handling device for semiconductor device inspection shown in FIG. 1(a).
検査を行うときには、まず電源スィッチ５を「ＯＮＪに
し、半導体素子検査条件に基づいて、分類スイッチ６の
設定、モードスイッチ７の設定、ダブルコンタクトのデ
ジスイッチ８の数字設定及びｏＮ−ＯＦＦスイッチ９の
設定、収納数デジスイッチ１０の数字設定、分類デジス
イッチ１２の数字設定、高温試験０Ｎ−ＯＦＦスイッチ
１３の設定、待機時間デジスイッチ１４の数字設定、及
び設定温度デジスイッチの数字設定をやらなければなら
ない。これを検査者が数字の設定を間違えたり、設定変
更の方法を間違えたりすると良品の半導体素子が不良品
として収納されたり、不良品の半導体素子が良品として
収納されたシするという問題が起る。When performing an inspection, first turn the power switch 5 ON and then set the classification switch 6, mode switch 7, double contact digital switch 8 numeric setting, and ON-OFF switch 9 based on the semiconductor device inspection conditions. Settings, numerical settings for the storage number digital switch 10, numerical settings for the classification digital switch 12, high temperature test 0N-OFF switch 13 settings, numerical settings for the standby time digital switch 14, and numerical settings for the setting temperature digital switch. If the inspector sets the numbers incorrectly or changes the settings incorrectly, there is a problem that good semiconductor devices may be stored as defective or defective semiconductor devices may be stored as non-defective. It happens.
半導体素子の種類は非常に多いために、検査者は品種が
変るたびに検査条件を設定し直す回数も非常に多く、設
定ミスを起しやすいという欠点がある。Since there are so many types of semiconductor devices, inspectors have to reset test conditions very often each time the type of device changes, making it easy to make setting errors.
（発明の目的）
本発明の目的は上記欠点を除去し、被検査半導体素子の
種類の変更による検査条件の設定全ミスなしに、かつ容
易に行うことのできる半導体素子検査用ハンドリング装
置を提供することにある。(Object of the Invention) An object of the present invention is to provide a handling device for semiconductor device testing that eliminates the above-mentioned drawbacks and allows easy testing of semiconductor devices without any mistakes in setting test conditions due to changes in the type of semiconductor device to be tested. There is a particular thing.
（発明の構成）
本発明の半導体素子検査用ハンドリング装置は、被検査
半導体素子の供給部、測定部、収納部、検査条件設定部
を有し特性検査を行う半導体素子検査用ハンドリング装
置において、検査条件を記憶した記憶媒体を挿入する挿
入部と前記挿入部に挿入された記憶媒体を読込む読込装
置と前記読込装置に読込まれた検査条件情報により検査
条件を設定する条件設定部とを前記検査条件設定部に設
けたこと全特徴として構成される。(Structure of the Invention) The handling device for semiconductor device testing of the present invention includes a supply section, a measurement section, a storage section, and a test condition setting section for semiconductor devices to be tested, and performs characteristic testing. An insertion section for inserting a storage medium storing conditions, a reading device for reading the storage medium inserted into the insertion section, and a condition setting section for setting inspection conditions based on the inspection condition information read into the reading device. It is configured as all the features provided in the condition setting section.
（実施例） 次に、本発明の実施例について図面を用いて説明する。(Example) Next, embodiments of the present invention will be described using the drawings.
第３図は本発明の一実施例の正面図、第４図は本発明の
一実施例に使用する記憶媒体の一例の平面図である。FIG. 3 is a front view of an embodiment of the present invention, and FIG. 4 is a plan view of an example of a storage medium used in the embodiment of the present invention.
この実施例は、被検査半導体素子の供給部１゜測定部２
．収納部３．検査条件設定部を有し特性検査を行う半導
体素子検査用ノ・ンドリンク装置において、検査条件を
記憶した記憶媒体としての磁気カード２７を挿入する挿
入部としてのカード挿入口１７と、このカード挿入口１
７に挿入された磁気カード２７ｆ、読込む読込装置（図
示せず）と、読込装置に読込まれた検査条件情報によシ
検査条件を設定する条件設定部（図示せず）とを検査条
件設定部４′に設けたことを特徴として構成される。In this embodiment, a semiconductor device to be inspected is supplied from a supply section 1 and a measurement section 2.
．． Storage part 3. A non-link device for testing semiconductor devices that has a test condition setting section and performs characteristic tests includes a card insertion slot 17 as an insertion section into which a magnetic card 27 as a storage medium storing test conditions is inserted; Mouth 1
7, a reading device (not shown) for reading the magnetic card 27f, and a condition setting section (not shown) for setting the test conditions based on the test condition information read into the reading device. The structure is characterized in that it is provided in the section 4'.
この実施例では、記憶媒体として磁気カード２７を用い
、これに品種毎の検査条件を記憶させておく。磁気カー
ド２７は半導体素子の品種毎に１つずつ用意する。In this embodiment, a magnetic card 27 is used as a storage medium, and test conditions for each product type are stored in this card. One magnetic card 27 is prepared for each type of semiconductor element.
次に、この実施例の動作について説明する。半導体素子
の検査を行うときに、まず、電源スィッチ５’１ｒＯＮ
Ｊにし、作業条件に書いである番号と同じ番号の磁気カ
ード２７を選びカード挿入口１７に投入する。すると読
込装置が磁気カードに記憶しである検査条件情報を読込
み、条件をすべてセットし分類モニターＬＥＤ１８の点
灯、モードＬＥＤ１９の点灯、ダブルコンタクトの数字
ディスプレイ２０への表示及びＯＮ −ＯＦＦ ＬＥＤ
２１の点灯、収納数数字ディスプレイ２２への表示、
分類数字ディスプレイ２３への表示、高温試験０Ｎ−Ｏ
ＦＦＬＥＤ２４の点灯、待機時間数字ディスプレイ２５
への表示及び設定温度数字ディスプレイ２６への表示を
おこなう。検査者は設定を一切する必要がなく、これに
より設定ミスを無くすこと ５−
ができる。Next, the operation of this embodiment will be explained. When inspecting semiconductor devices, first turn on the power switch 5'1r.
J, select the magnetic card 27 with the same number as the number written in the work conditions, and insert it into the card insertion slot 17. Then, the reading device reads the inspection condition information stored in the magnetic card, sets all the conditions, lights the classification monitor LED 18, lights the mode LED 19, displays on the double contact numeric display 20, and turns on the ON-OFF LED.
21 is lit, the storage number is displayed on the numerical display 22,
Display on classification number display 23, high temperature test 0N-O
FFLED 24 lights up, standby time numeric display 25
and the set temperature numerical display 26. The inspector does not need to make any settings, which eliminates setting errors.
上記実施例では、記憶媒体として磁気カードを用いたが
、記憶媒体としては磁気ディスク、磁気テープ、パンチ
カード等を用いることができる。In the above embodiment, a magnetic card is used as the storage medium, but a magnetic disk, magnetic tape, punch card, etc. can also be used as the storage medium.
（発明の効果）
以上詳細に説明したように、本発明は、半導体素子の検
査条件情報を品種毎に記憶媒体に記憶させておき、この
記憶媒体の挿入、読込みにより検査条件を自動的に設定
できるようにしたので、検査条件設定のミスがなく、迅
速に、しかも容易に条件設定できる半導体素子検査用ハ
ンドリング装置が得られるという効果を有する。(Effects of the Invention) As explained in detail above, the present invention stores inspection condition information for each type of semiconductor device in a storage medium, and automatically sets inspection conditions by inserting and reading this storage medium. As a result, there is an effect that a handling device for testing semiconductor devices can be obtained which can quickly and easily set the conditions without making any mistakes in setting the test conditions.
第１図（ａｌ 、 （ｂ）は従来の半導体素子検査用ノ
・ンドリング装置の正面図及び側面図、第２図は第１図
（ａｌに示す半導体素子検査用）・ンドリンク装置の検
査条件設定部の正面図、第３図は本発明の一実施例の正
面図、第４図は本発明の一実施例に使用する記憶媒体の
一例の平面図である。１・・・・・・供給部、−６＝
２・・・・・・測定部、３・・・・・・収納部、４，４
′・・・・・・検査条件設定部、５・・・・・・電源ス
ィッチ、６・・・・・・分類スイッチ、７・・・・・・
モードスイッチ、８・・・・・・ダブルコンタクトデジ
スイッチ、９・・・・・・ダブルコンタク）ＯＮ−ＯＦ
Ｆスイッチ、１０・・・・・・収納数デジスイッチ、１
１・・・・・・カウントリセットスイッチ、１２・・・
・・・分類デジスイッチ、１３・・・・・・高温試験ｌ
０Ｎ−ＯＦＦｊスイッチ、１４・・・・・・待機時間デ
ジスイッチ、１５・・・・・・設定温度デジスイッチ、
１６・・・・・・温度表示数字ディスプレイ、１７・・
・・・・カード挿入口、１８・・・・・・分類モニター
ＬＥＤ、１９・・・・・・モー）’ＬＥＤ、２０・・・
・・・ダブルコンタクト数字ディスプレイ、２１・・・
・・・ダブルコンタクト０Ｎ−ＯＦＦ表示ＬＥＤ、２２
・・・・・・収納数数字ディスプレイ、２３・・・・・
・分類数字ティスプレィ、２４・・・・・・高温試験Ｏ
Ｎ −ＯＦＦ 表示ＬＥＤ、２５・・・・・・待機時間
数字ディスプレイ、２６・・・・・・設定温度数字ディ
スプレイ、２７・・・・・・磁気カード。
猶１頂
警２百Figures 1 (al) and (b) are front and side views of a conventional no-and-link device for testing semiconductor devices, and Figure 2 is the testing conditions for the no-and-link device shown in Figure 1 (for testing semiconductor devices shown in al). 3 is a front view of the setting section, FIG. 3 is a front view of an embodiment of the present invention, and FIG. 4 is a plan view of an example of a storage medium used in the embodiment of the present invention.1... Supply section, -6= 2... Measuring section, 3... Storage section, 4, 4
'...Inspection condition setting section, 5...Power switch, 6...Classification switch, 7...
Mode switch, 8...Double contact digital switch, 9...Double contact) ON-OF
F switch, 10... Storage number digital switch, 1
1... Count reset switch, 12...
...Classification digital switch, 13...High temperature test l
0N-OFFj switch, 14...standby time digital switch, 15...set temperature digital switch,
16...Temperature numerical display, 17...
...Card insertion slot, 18...Classification monitor LED, 19...' LED, 20...
...Double contact numeric display, 21...
...Double contact 0N-OFF display LED, 22
...Storage number numeric display, 23...
・Classification number display, 24...High temperature test O
N-OFF Display LED, 25...Waiting time numeric display, 26...Temperature setting numeric display, 27...Magnetic card. 1st grade police 200
Claims (1)
ハンドリング装置において、検査条件を記憶した記憶媒
体を挿入する挿入部と前記挿入部に挿入された記憶媒体
を読込む読込装置と前記読込装置に読込まれた検査条件
情報により検査条件を設定する条件設定部とを前記検査
条件設定部に設けたことを特徴とする半導体素子検査用
ノーンドリンク装置。[Claims] A supply section, a measurement section, and a storage section for semiconductor devices to be tested. A handling device for semiconductor device testing that has a test condition setting section and performs a characteristic test, comprising an insertion section into which a storage medium storing test conditions is inserted, a reading device reading the storage medium inserted into the insertion section, and the reading device. 1. A non-link device for testing semiconductor devices, characterized in that the test condition setting section includes a condition setting section for setting test conditions based on test condition information read into the test condition setting section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3553784A JPS60180136A (en) | 1984-02-27 | 1984-02-27 | Handling apparatus for semiconductor element inspection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3553784A JPS60180136A (en) | 1984-02-27 | 1984-02-27 | Handling apparatus for semiconductor element inspection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60180136A true JPS60180136A (en) | 1985-09-13 |
Family
ID=12444480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3553784A Pending JPS60180136A (en) | 1984-02-27 | 1984-02-27 | Handling apparatus for semiconductor element inspection |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60180136A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995017793A1 (en) * | 1993-12-23 | 1995-06-29 | Amphenol-Tuchel Electronics Gmbh | Device for programming a receiving device by means of a smart card reader |
-
1984
- 1984-02-27 JP JP3553784A patent/JPS60180136A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995017793A1 (en) * | 1993-12-23 | 1995-06-29 | Amphenol-Tuchel Electronics Gmbh | Device for programming a receiving device by means of a smart card reader |
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