JPS6017992A - 集積回路用セラミック基板の焼成法 - Google Patents
集積回路用セラミック基板の焼成法Info
- Publication number
- JPS6017992A JPS6017992A JP12482583A JP12482583A JPS6017992A JP S6017992 A JPS6017992 A JP S6017992A JP 12482583 A JP12482583 A JP 12482583A JP 12482583 A JP12482583 A JP 12482583A JP S6017992 A JPS6017992 A JP S6017992A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- metallized layer
- integrated circuit
- firing
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims description 32
- 239000000919 ceramic Substances 0.000 title claims description 31
- 238000000034 method Methods 0.000 title claims description 7
- 238000010304 firing Methods 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 101100313164 Caenorhabditis elegans sea-1 gene Proteins 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12482583A JPS6017992A (ja) | 1983-07-11 | 1983-07-11 | 集積回路用セラミック基板の焼成法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12482583A JPS6017992A (ja) | 1983-07-11 | 1983-07-11 | 集積回路用セラミック基板の焼成法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6017992A true JPS6017992A (ja) | 1985-01-29 |
| JPS6350861B2 JPS6350861B2 (enrdf_load_stackoverflow) | 1988-10-12 |
Family
ID=14895034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12482583A Granted JPS6017992A (ja) | 1983-07-11 | 1983-07-11 | 集積回路用セラミック基板の焼成法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6017992A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0439599A (ja) * | 1990-06-01 | 1992-02-10 | Hidaka Seiki Kk | 熱交換器用フィンの製造法 |
| JPH05144967A (ja) * | 1991-11-19 | 1993-06-11 | Kyocera Corp | 半導体素子収納用パツケージの製造方法 |
-
1983
- 1983-07-11 JP JP12482583A patent/JPS6017992A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0439599A (ja) * | 1990-06-01 | 1992-02-10 | Hidaka Seiki Kk | 熱交換器用フィンの製造法 |
| JPH05144967A (ja) * | 1991-11-19 | 1993-06-11 | Kyocera Corp | 半導体素子収納用パツケージの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6350861B2 (enrdf_load_stackoverflow) | 1988-10-12 |
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