JPS6017925A - ワイヤボンダ用ボ−ル形成装置 - Google Patents

ワイヤボンダ用ボ−ル形成装置

Info

Publication number
JPS6017925A
JPS6017925A JP58126789A JP12678983A JPS6017925A JP S6017925 A JPS6017925 A JP S6017925A JP 58126789 A JP58126789 A JP 58126789A JP 12678983 A JP12678983 A JP 12678983A JP S6017925 A JPS6017925 A JP S6017925A
Authority
JP
Japan
Prior art keywords
discharge
voltage
low voltage
wire
switching element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58126789A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0154858B2 (enFirst
Inventor
Hitoshi Sakuma
均 佐久間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP58126789A priority Critical patent/JPS6017925A/ja
Publication of JPS6017925A publication Critical patent/JPS6017925A/ja
Publication of JPH0154858B2 publication Critical patent/JPH0154858B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning

Landscapes

  • Wire Bonding (AREA)
JP58126789A 1983-07-11 1983-07-11 ワイヤボンダ用ボ−ル形成装置 Granted JPS6017925A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58126789A JPS6017925A (ja) 1983-07-11 1983-07-11 ワイヤボンダ用ボ−ル形成装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58126789A JPS6017925A (ja) 1983-07-11 1983-07-11 ワイヤボンダ用ボ−ル形成装置

Publications (2)

Publication Number Publication Date
JPS6017925A true JPS6017925A (ja) 1985-01-29
JPH0154858B2 JPH0154858B2 (enFirst) 1989-11-21

Family

ID=14943975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58126789A Granted JPS6017925A (ja) 1983-07-11 1983-07-11 ワイヤボンダ用ボ−ル形成装置

Country Status (1)

Country Link
JP (1) JPS6017925A (enFirst)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62127651A (ja) * 1985-11-28 1987-06-09 Sanshin Ind Co Ltd エンジン用潤滑装置の異物検出器

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10629563B2 (en) * 2015-05-03 2020-04-21 Kaijo Corporation Ball forming device for wire bonder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62127651A (ja) * 1985-11-28 1987-06-09 Sanshin Ind Co Ltd エンジン用潤滑装置の異物検出器

Also Published As

Publication number Publication date
JPH0154858B2 (enFirst) 1989-11-21

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