JPS60178689A - Method of producing printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention]! 81 Technical Field of the Invention The present invention relates to a method for manufacturing a printed wiring board, and particularly to a method for manufacturing a printed wiring board in which a desired pattern can be easily formed without using a mask.

fbl Technology Background In recent years, electronic devices have made remarkable progress, and the printed wiring boards, which are the most important part of electronic devices, are being improved day by day.
There is a strong demand for the development of a method for manufacturing a printed wiring board that can easily produce a prototype printed wiring board without using a mask.

(C1 Problem with the prior art) The conventional method for manufacturing printed wiring boards is to attach a conductive foil made of copper (Cu) or the like to a substrate made of glass epoxy resin, etc., and then apply a resist on the conductive foil. After coating the resist, a mask with a predetermined pattern is placed on the resist and exposed, and the portions that are easily etched by exposure are removed by etching to form a pattern, and the remaining conductive foil is etched. A manufacturing method was used in which the resist on the Bakun was cleaned.However, each time a printed wiring board was changed, a mask with a newly designed pattern had to be made, which was expensive and took a long time to produce. There was a problem.

fd) Purpose of the Invention The object of the present invention is to provide a novel method for manufacturing a printed wiring board that can be manufactured easily and simply without using a mask, in order to solve the above-mentioned conventional problems. be.

(e) Structure of the Invention In order to achieve the above-mentioned object, the present invention involves attaching a conductor foil onto a substrate, forming a thin metal or resin sheet with solder or the like that melts at low temperature on the conductor foil, With the sheet coated with the solder etc. placed so as to be in contact with the conductive foil, a desired pattern is irradiated with light onto the metal plate to adhere the solder onto the conductive foil and etched. This is achieved by forming a desired pattern.

(fl Embodiments of the Invention Hereinafter, embodiments of the method for manufacturing a printed wiring board according to the present invention will be described in detail with reference to the drawings.

FIG. 1 is a front view of the first step, and (
b) is a front view of the second step.

In the first step, a conductor foil 2 made of copper or the like is formed by plating or the like on the entire surface of a substrate l made of glass epoxy resin, ceramic, etc., and in addition to this, a conductor foil 2 made of copper or the like is formed on the entire surface of the substrate l made of glass epoxy resin, ceramic, etc., and in addition to this, a conductor foil 2 made of metals to which plating is difficult to adhere, such as aluminum, stainless steel, etc. After applying solder plating 4 etc. to the metal foil 3 made of
If a desired pattern is drawn with a light beam 5 such as an infrared beam or a laser beam from the metal foil 3 side through a lens 6 while the solder plating 4 adhered to The solder plating 4 corresponding to the pattern is melted and transferred to the conductive foil 2 formed on the substrate 1. In this state, the laminated metal foil 3 is removed from the substrate 1.
When the substrate 1 is removed and the substrate 1 is etched, the transferred solder becomes an etching resist and the conductor foil 2 is removed, forming a desired pattern.

FIG. 2 is a perspective view of a printed wiring board formed by the method for manufacturing a printed wiring board according to the present invention, in which the same parts as the previous one are given the same reference numerals, and 7 is the formed pattern. .

(gl) Effects of the Invention As is clear from the above explanation, the method for manufacturing a printed wiring board according to the present invention does not require the use of an expensive mask and is easier, simpler, and takes less time than the conventional manufacturing method. Since it can be manufactured, costs can be reduced, and parts can be easily soldered, making it extremely advantageous when applied to trial production.

[Brief explanation of the drawing]

FIG. 1 is a front view of the 11th fa
b) is a front view of the second step, and FIG. 2 is a perspective view of a printed wiring board formed by the method for manufacturing a printed wiring board according to the present invention. In the figure, 1 is a substrate, 2 is a conductor foil, 3 is a metal foil, 4 is a solder plating, 5 is a light beam, 6 is a lens, and 7 is a pattern. Figure 1 (0) (bl Figure 2

Claims (1)

[Claims] 41 pieces of conductive foil are placed on a substrate, a thin sheet of metal or resin is coated with solder that melts at low temperatures, and the sheet coated with the solder is placed in contact with the conductive foil. 11. In this state, a desired pattern is formed on the metal plate with a light beam. A method for manufacturing a printed wiring board, characterized in that a desired pattern is formed by depositing the solder on the conductive foil by applying G-irradiation and etching or the like.