JPS60174268U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS60174268U JPS60174268U JP6236984U JP6236984U JPS60174268U JP S60174268 U JPS60174268 U JP S60174268U JP 6236984 U JP6236984 U JP 6236984U JP 6236984 U JP6236984 U JP 6236984U JP S60174268 U JPS60174268 U JP S60174268U
- Authority
- JP
- Japan
- Prior art keywords
- element array
- surface side
- pattern surface
- soldering
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図はこの考案の一実施例を示すもので、
第１図は縦断側面図、第２図は一部の平面図、第３図は
従来例を示す縦断側面図である。
１・・・絶縁基板、２・・・素子配列面、３，４・・・
電子素子、５・・・接続端子、６・・・パターン面、７
・・・半 。
田、８・・・付加される他の電子素子、１ｏ・・・接続
端子、１１・・・導電線。Figures 1 and 2 show an embodiment of this invention.
FIG. 1 is a longitudinal side view, FIG. 2 is a partial plan view, and FIG. 3 is a longitudinal side view of a conventional example. 1... Insulating substrate, 2... Element array surface, 3, 4...
Electronic element, 5... Connection terminal, 6... Pattern surface, 7
...Half. 8... Other electronic elements to be added, 1o... Connection terminal, 11... Conductive wire.
Claims (1)
続端子を反対側のパターン面に貫通させて半田により接
続するようにしたものにおいて、他の電子素子の接続端
子を前記パターン面側から前記素子配列面側に突出させ
、前記パターン面側から前記素子配列面側に突出する前
記接続端子と所定の前記パターン面とに半田により接続
される− 導電線を前記素子配列側から前記絶縁基板
に貫通させたことを特徴とするプリント基板。In a device in which the connection terminals of a large number of electronic devices mounted on the element array surface of an insulating substrate are passed through the pattern surface on the opposite side and connected by soldering, the connection terminals of other electronic devices are connected from the pattern surface side. A conductive wire is connected from the element array side to the insulating substrate by soldering to the connection terminal that protrudes toward the element array surface side and protrudes from the pattern surface side to the element array surface side and the predetermined pattern surface. A printed circuit board characterized by having a through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6236984U JPS60174268U (en) | 1984-04-26 | 1984-04-26 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6236984U JPS60174268U (en) | 1984-04-26 | 1984-04-26 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60174268U true JPS60174268U (en) | 1985-11-19 |
Family
ID=30591522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6236984U Pending JPS60174268U (en) | 1984-04-26 | 1984-04-26 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60174268U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5972196A (en) * | 1983-09-16 | 1984-04-24 | 松下電器産業株式会社 | Part mounting device |
-
1984
- 1984-04-26 JP JP6236984U patent/JPS60174268U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5972196A (en) * | 1983-09-16 | 1984-04-24 | 松下電器産業株式会社 | Part mounting device |
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