JPS60172409A - Drill breakage detection element and printed board drilling method - Google Patents
Drill breakage detection element and printed board drilling methodInfo
- Publication number
- JPS60172409A JPS60172409A JP2296884A JP2296884A JPS60172409A JP S60172409 A JPS60172409 A JP S60172409A JP 2296884 A JP2296884 A JP 2296884A JP 2296884 A JP2296884 A JP 2296884A JP S60172409 A JPS60172409 A JP S60172409A
- Authority
- JP
- Japan
- Prior art keywords
- drill
- detection element
- printed board
- drill breakage
- breakage detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B49/00—Measuring or gauging equipment on boring machines for positioning or guiding the drill; Devices for indicating failure of drills during boring; Centering devices for holes to be bored
- B23B49/001—Devices for detecting or indicating failure of drills
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Drilling And Boring (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明はプリント板のスルーホール下孔加工時にドリル
折れを検出するためのドリル折れ検出要素、及びそれを
用いたプリント板の孔明は方法に関するものである。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a drill breakage detection element for detecting a drill breakage during drilling of a through-hole in a printed board, and a method for drilling a printed board using the same. It is.
通信装置あるいは電子計算装置などの電子機器には配線
の合理化と部品搭載の合理化のために多層プリント板が
用いられている。この多層プリント板には各層間の導体
を接続するためにプリント板を貫通した孔の内面にメッ
キを施したスルーホールが設けられている。最近の多層
プリント板においては電子機器の実装密度の高度化に伴
ってスルーホールの数も多くかり、１枚のプリント板に
数千から敷石も設けられるようになって来ている。Multilayer printed boards are used in electronic equipment such as communication devices or electronic computing devices to rationalize wiring and component mounting. This multilayer printed board is provided with through holes that are plated on the inner surfaces of holes that penetrate the printed board in order to connect conductors between each layer. In recent multilayer printed boards, the number of through holes has increased as electronic equipment has become more densely packed, and one printed board now has thousands of paving stones.
このスルーホールの下孔加工は通常高速数値制御ボール
盤が用いられてｂる。一方スルーホールの下孔は直径が
０．３〜０．５ ｍと細い。このため多層シリンド板の
積層数が多くなり全体の厚さが厚くなると孔あけ途中で
のドリル折れが発生し易くなる。このドリル折れにより
ドリルの折れ込んだプリント板は何らかの方法で救済す
ることは出来るが、ドリル折れ全発見するのに全孔を加
工した後では孔数が多いため発見に多大な手数及び時間
を要１７作業性が悪い。このためドリル折れをその直後
に発見するための手段として切粉の排出状態を光学的方
法で監視する方法が用いられているが、この方法では切
粉がドリルに付着して回転したり、あるいは飛散するた
め信頼性のある検出が困雛であるという欠点があった。A high-speed numerically controlled drilling machine is usually used to prepare the through holes. On the other hand, the diameter of the pilot hole of the through hole is as narrow as 0.3 to 0.5 m. For this reason, as the number of laminated layers of the multilayer cylinder plate increases and the overall thickness increases, the drill becomes more likely to break during drilling. Although it is possible to salvage a printed board that has been bent by a drill due to this drill breakage, it takes a lot of effort and time to find all the drill breaks because there are many holes after all the holes have been machined. 17 Workability is poor. For this reason, optical methods are used to monitor the discharge state of chips as a means of detecting drill breakage immediately after the breakage occurs, but this method does not allow chips to adhere to the drill and cause it to rotate, or The drawback is that reliable detection is difficult due to scattering.
本発明は上記従来の欠点に鑑み、ドリル折れをその直後
に信頼性のある検出ができるドリル折れ検出要素及びプ
リント板孔明は方法を提供することを目的とするもので
ある。SUMMARY OF THE INVENTION In view of the above-mentioned drawbacks of the prior art, it is an object of the present invention to provide a drill breakage detection element and a method for drilling a printed board, which can reliably detect a drill breakage immediately after the breakage occurs.
そしてこの目的は本発明によれば、絶縁板の両面に銅箔
を張シ付け、その両面の銅箔間の導通によりドリル折れ
を検出できるようにしたことを特徴とするドリル折れ検
出要素を提供することによって達成される。また前記ド
リル折れ検出要素を被加工プリント板に重ねた状態で孔
明は加工を行ない、ドリルの上下運動に同期して前記ド
リル折れ検出要素の両面の銅箔間の導通を検知すること
によジトリル折れを検出することを特徴とするプリント
板孔明は方法を提供することによって達成される。According to the present invention, this object provides a drill breakage detection element characterized in that copper foil is pasted on both sides of an insulating plate, and a drill breakage can be detected by conduction between the copper foils on both sides. This is achieved by In addition, the drill is processed while the drill breakage detection element is stacked on the printed board to be processed, and the ditrile is detected by detecting conduction between the copper foils on both sides of the drill breakage detection element in synchronization with the vertical movement of the drill. Printed board clearing characterized by detecting folds is accomplished by providing a method.
以下、本発明実施例を図面によって詳述する。 Embodiments of the present invention will be described in detail below with reference to the drawings.
第１図は本発明によるドリル折れ検出要素及びそれを用
いたプリント板の孔明は方法を説明するための図である
。同図において、１はドリル、２は被加ニブリント板、
３は）ＩＪル折れ検出要素、４は絶縁板、５及び６は銅
箔、７は笥４圧源、８Ｈ′検出器、９はシーケンサ−１
１０は孔加工装置の制御装置、１１は孔加工装置をそれ
ぞれ示している。FIG. 1 is a diagram for explaining a drill breakage detection element and a method for drilling a printed board using the same according to the present invention. In the same figure, 1 is a drill, 2 is a niblint plate to be applied,
3) IJ bend detection element, 4 is an insulating plate, 5 and 6 are copper foils, 7 is a 4-pressure source, 8H' detector, 9 is a sequencer 1
Reference numeral 10 indicates a control device for the hole processing device, and numeral 11 indicates the hole processing device.
本発明のドリル折れ検出要素３は第１図に示す如く、絶
縁板４０両面に銅箔を張り付けたものである。As shown in FIG. 1, the drill breakage detection element 3 of the present invention has an insulating plate 40 with copper foil pasted on both sides.
次にこのドリル折れ検出要素を用いた本発明のｆＩＪン
ト板孔明は方法を説明する。先ずドリル折れ検出要素３
の両面の銅箔５，６間に電圧源７と検出器８を並列に接
続し、検出器８はシーケンサ−９に接続する。シーケン
サ−９は制御装置１０に接続され、制御装置１０は孔加
工装置１１に接続される。そして孔加工装置１１のドリ
ル上下情報は制御装ｆｔ１ｏ及びシーケンサ−９にフィ
ーＰバックするようになっている。このように接続され
たト・リル折れ検出要素３は柚加エブリ、ント板２の上
又は下に重ねられ（図は下に重ねられている）ドリル１
によって被加ニブリント板２及びドリル折れ検出要素３
の両者を貫通して孔明けされる。Next, a method for drilling a fIJ plate according to the present invention using this drill breakage detection element will be described. First, drill breakage detection element 3
A voltage source 7 and a detector 8 are connected in parallel between the copper foils 5 and 6 on both sides, and the detector 8 is connected to a sequencer 9. The sequencer 9 is connected to a control device 10, and the control device 10 is connected to a hole drilling device 11. The drill up/down information of the hole processing device 11 is fed back to the control device ft1o and the sequencer 9. The drill break detection element 3 connected in this way is superimposed on or below the drill plate 2 (in the figure, it is superimposed on the bottom).
The applied Niblint plate 2 and the drill breakage detection element 3 are
A hole is drilled through both.
そして第２Ｍの如（ＰＩＪルの上昇・下降に同期してド
リル折れ検出要素のシ冒−ト又はオープンを監視する。Then, in synchronization with the raising and lowering of the PIJ, the second M monitors whether the drill breakage detection element is opened or opened.
その結果、ａ部の如くドリル下降時にシ日−トとなり、
ドリル上昇後にオープンとなるのは、ドリルがドリル折
れ検出要素を貫通したときのみショートとなることで、
この状態はドリル折れの無い状態と判断される。次にｂ
部の如くドリル下降時にショートが々ければドリルはド
リル折れ検出要素まで屈いていないことになり、その前
の孔明けでドリルが折れていることがわかる。As a result, as shown in part a, the drill becomes shattered when descending.
The reason why the drill becomes open after it rises is because it becomes a short circuit only when the drill passes through the drill breakage detection element.
This state is determined to be a state in which the drill does not break. then b
If there are frequent short circuits when the drill is lowered, as shown in section 2, it means that the drill has not bent to the drill breakage detection element, and it can be seen that the drill was broken during the previous hole drilling.
また８部の如くドリル上列中もドリル折れ検出要素がシ
冒−トであることは、ドリル折ね検出？饗゛・中にドリ
ルが残っていることを示しておりドリル折れと判断され
る。このようにしてドリル折れ発生の直後にそれを検出
することができる。Also, as shown in Part 8, the fact that the drill breakage detection element is in the seat even in the upper row of drills means that the drill breakage is detected? This indicates that there is a drill remaining inside the bowl, which indicates that the drill is broken. In this way, drill breakage can be detected immediately after it occurs.
なおドリル折れ検出要素３を被加ニブリント板の上に重
ねて孔加工を行なう場合には、第３図の１部の如くドリ
ル下降時にのみ）＆ ＩＪル折れ検出要素がショートと
なるのが正常であり、ｂ部の如くドリル上昇中もショー
トであることはドリル折れ検出要素にｌ’ ＩＪルが残
っていることであり、ドリル折れと判断される。Note that when drilling a hole with the drill break detection element 3 superimposed on the Niblint plate to be applied, it is normal for the IJ rule break detection element to become short only when the drill is lowered, as shown in part 1 of Figure 3. Therefore, the fact that there is a short circuit even while the drill is rising as shown in part b means that l'IJle remains in the drill breakage detection element, and it is determined that the drill is broken.
本発明のプリント板の孔明は方法は以上の如くにして孔
明は直後にドリル折れを検出することができる。なお被
加ニブリント板がその両面にｔ４ターン形成されていな
い銅箔が全面にある場合には、それをドリル折れ検出用
に用い前述のドリル折れ検出要素を省くことができる。The method for drilling a printed board according to the present invention is as described above, and drill breakage can be detected immediately after drilling. Note that if the applied niblint plate has copper foil on both sides thereof, which is not formed with T4 turns, it can be used for detecting drill breakage, and the above-mentioned drill breakage detection element can be omitted.
また本実施例ではドリル折れ検出要素の７四−トにより
ドリル折れを検出したが、この検出は電圧、電流、抵抗
、容１ｉ’４Ｇの変化を利用することもできる。Further, in this embodiment, a drill breakage is detected by the drill breakage detecting element 74, but this detection can also be performed using changes in voltage, current, resistance, or capacitance 1i'4G.
以上、詳細に説明したように本発明のドリル折れ検出要
素及びプリント板孔明は方法は、プリント板の孔明は時
におけるドリル折れを、その直後に検出することを可能
としたものであって作業性の向上に富力するといった効
果大なるものである。As explained above in detail, the drill breakage detection element and printed board drilling method of the present invention are capable of detecting a drill breakage immediately after drilling of a printed board, which improves workability. This has a great effect on improving one's wealth and wealth.
２ｇ１図は本発明によるドリル折れ検出要素及びプリン
ト板孔明は方法を説明するための図、第２図及び第３図
は本発明のプリント板孔明は方法におけるドリル折れ検
出情報の経時線図である。
図面において、１はドリル、２は被加ニブリント板、３
はドリル折れ検出要素、４は絶縁板、５及び６は銅箔、
７は電圧源、８は検出器、９はシーケンサ、】０は孔加
工装置の制御装置、１１は孔加工装置をそれぞれ示す。
（７）
第１図Figure 2g1 is a diagram for explaining the drill breakage detection element and printed board drilling method according to the present invention, and Figures 2 and 3 are time charts of drill breakage detection information in the printed board drilling method of the present invention. . In the drawing, 1 is a drill, 2 is a niblint plate to be applied, and 3 is a drill.
is a drill breakage detection element, 4 is an insulating plate, 5 and 6 are copper foils,
7 is a voltage source, 8 is a detector, 9 is a sequencer, ]0 is a control device for the hole machining device, and 11 is the hole machining device. (7) Figure 1
Claims (1)
の導通によりドリル折れを検出できるようにしたことを
特徴とするドリル折れ検出要素。 ２、絶縁板の両面に銅箔を張り付け、その両面の銅箔間
の導通によりドリル折れを検出できるようｋしたドリル
折れ検出要素を被加ニブリント板に重ねた状態で孔明は
加工を行ない、ドリルの上下運動に同期して前記ドリル
折れ検出要素の両面の銅箔間の導通を検知することによ
りドリル折れを検出することを特徴とするプリント板孔
明は方法。[Claims] 1. A drill breakage detection element, characterized in that copper foil is pasted on both sides of an insulating plate, and a drill breakage can be detected by conduction between the copper foils on both sides. 2. Copper foil is pasted on both sides of the insulating plate, and a drill breakage detection element that can detect drill breakage through conduction between the copper foils on both sides is stacked on the Niblint plate to be applied. A method for detecting a drill breakage by detecting conduction between copper foils on both sides of the drill breakage detection element in synchronization with the vertical movement of the drill breakage detection element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2296884A JPS60172409A (en) | 1984-02-13 | 1984-02-13 | Drill breakage detection element and printed board drilling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2296884A JPS60172409A (en) | 1984-02-13 | 1984-02-13 | Drill breakage detection element and printed board drilling method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60172409A true JPS60172409A (en) | 1985-09-05 |
Family
ID=12097376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2296884A Pending JPS60172409A (en) | 1984-02-13 | 1984-02-13 | Drill breakage detection element and printed board drilling method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60172409A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012152875A (en) * | 2011-01-27 | 2012-08-16 | Hitachi Via Mechanics Ltd | Program for detecting drill breakage |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS494280B1 (en) * | 1972-08-30 | 1974-01-31 | ||
| JPS5091770A (en) * | 1973-12-18 | 1975-07-22 |
-
1984
- 1984-02-13 JP JP2296884A patent/JPS60172409A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS494280B1 (en) * | 1972-08-30 | 1974-01-31 | ||
| JPS5091770A (en) * | 1973-12-18 | 1975-07-22 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012152875A (en) * | 2011-01-27 | 2012-08-16 | Hitachi Via Mechanics Ltd | Program for detecting drill breakage |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2007509487A (en) | Closed loop back drilling system | |
| CN109640528B (en) | Method for improving PCB back drilling precision | |
| CN109462949A (en) | A kind of production method of the PCB for the bound edge that metallizes | |
| CN110167289A (en) | A kind of production method of multilayer circuit board | |
| JPS60172409A (en) | Drill breakage detection element and printed board drilling method | |
| JPH05347480A (en) | Manufacture of multilayer printed wiring board | |
| JP4117390B2 (en) | Manufacturing method of multilayer printed wiring board with cavity | |
| JP3404771B2 (en) | Multilayer wiring board processing apparatus and processing method | |
| HU191139B (en) | Method and arrangement for increasinf reliability of metallization of holes at manufacturing printed circuits | |
| JPS6320645B2 (en) | ||
| JPS6320646B2 (en) | ||
| JPS60180706A (en) | Hole positioning error detecting printed plate and perforation of printed plate | |
| JPH02297996A (en) | Detection of fine through hole defect in printed board | |
| JP2003332745A (en) | Multilayer printed wiring board and its manufacturing method | |
| JPH0632383B2 (en) | Method for manufacturing multilayer printed wiring board | |
| JP2629917B2 (en) | Multilayer printed wiring board and method of manufacturing the same | |
| JP2570174B2 (en) | Multilayer printed wiring board | |
| JPS5831422Y2 (en) | Semiconductor device assembly board | |
| JPS6484786A (en) | Multilayer printed wiring board | |
| JPH05327172A (en) | Manufacture of printed-wiring board | |
| JPS62155594A (en) | Multilayer printed circuit board | |
| JPH07256594A (en) | Formation of through hole on printed wiring board | |
| JPS6239239A (en) | Automatic spot facing device for laminated board | |
| KR20100050858A (en) | Drill apparatus for measuring distance of layers of dummy board and measuring method of distance between layers of dummy board using the same | |
| JPS6484793A (en) | Formation of through hole in multilayer printed wiring board |