JPS60166185A - Focusing device for laser - Google Patents
Focusing device for laserInfo
- Publication number
- JPS60166185A JPS60166185A JP59021817A JP2181784A JPS60166185A JP S60166185 A JPS60166185 A JP S60166185A JP 59021817 A JP59021817 A JP 59021817A JP 2181784 A JP2181784 A JP 2181784A JP S60166185 A JPS60166185 A JP S60166185A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- light
- output
- laser light
- irradiated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明はレーザ光の焦点合わせ装置に関し、さらに畦
しくはレーザ光によ＃）被加工物を切断加工したシする
ときに被加工物であるレーザ光の被照射体に対する集光
装置の焦点合わせを目視または自動で行なうことができ
るレーザ光の焦点合わせ装置に関するものである。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a laser beam focusing device, and more particularly, to a focusing device for laser light, and more particularly, to a focusing device for laser light, and more particularly, for cutting a workpiece by using a laser beam. The present invention relates to a laser beam focusing device capable of visually or automatically focusing a condensing device on an object to be irradiated with a laser beam.
レーザ光線、特に炭酸ガスのレーザ光は波長が１０．６
μｍであシ目には見えない。また、強力であるため焦点
位置を目視によシ決めることは困難であった。Laser light, especially carbon dioxide laser light, has a wavelength of 10.6
It is invisible to the naked eye in μm. In addition, it is difficult to visually determine the focal point position because of the strong force.
そのため、例えばレーザ加工装置では、被加工物に一部
レーザ光を当てて、穴の大きさを見て、さらにこの操作
を何べんも繰り返えして穴の一番小さい所を選んで、手
動で焦点合わせをしていた。For this reason, for example, in a laser processing device, a part of the workpiece is irradiated with a laser beam, the size of the hole is checked, and this operation is repeated many times to select the smallest part of the hole. , I had to manually adjust the focus.
したがって、時間がかかシ、精確に合わせることができ
ないと言う欠点があった。Therefore, there are disadvantages in that it is time consuming and cannot be matched accurately.
この発明はこのような欠点を解消するため罠なされたも
ので、レーザ発振器とレーザ光の被照射体間のレーザ光
の伝送路中から前記レーザ発振器の出力光及び前記被照
、船体からの反射光の一部を夫々取シ出し、両者の比が
最大となるように集光装置を調整するようにしたレーザ
焦点合わせ装置を提供することを目的とするものである
。The present invention has been made in order to eliminate such drawbacks, and it is possible to eliminate the output light of the laser oscillator and the reflected light from the irradiated object and the ship's body from the laser beam transmission path between the laser oscillator and the object to be irradiated with the laser beam. It is an object of the present invention to provide a laser focusing device that extracts a portion of the light and adjusts a condenser so that the ratio of the two is maximized.
以下、この発明の一実施例を図に基づいて説明する。 Hereinafter, one embodiment of the present invention will be described based on the drawings.
第１図はこの発明の一実施例を示す構成図、第２図は焦
点位置からの加工レンズのずれと割算器出力との関係を
示す特性図である。FIG. 1 is a block diagram showing an embodiment of the present invention, and FIG. 2 is a characteristic diagram showing the relationship between the deviation of the processing lens from the focal position and the output of the divider.
第１図において、（１）はレーザ発振器、（２）はレー
ザ光の伝送路、（３）はペンドミラー、（４）は集光装
置である加工レンズ、（５）は被加工物つまシレーザ光
の被照射体、（６）は加工レンズ（４）を駆動するモ〜
り、（７）ハビームスブリツタで、レーザ光の伝送路（
２）中に設けてあり、レーザ発振器（１１の出力の一部
及び被加工物（５）からの反射光の一部を取シ出すもの
である。（８１＃′ｉ第ル−ザセンサで、ビームスプリ
ッタ（７）で反射されたレーザ出力光を検出する。（９
）は第２レーザセンサで、ビームスグリツタ（７）で反
射された被加工物（５）からの反射光を検出する。（１
０１は割算器で、第ル−ザセンサ（８）の出力すと第２
レーザセンサ（９）の出力ａとの比Ｃ＝ ／ｂを演算す
るもの、（１υはメータで、割算器（１０）の出力Ｃを
計測し、目視できるように表示するものである。ａｚは
焦点位置判別装置、＋１３１はサーボ回路である。In Figure 1, (1) is a laser oscillator, (2) is a transmission line for laser light, (3) is a pend mirror, (4) is a processing lens which is a condensing device, and (5) is a laser beam at the tip of the workpiece. The irradiated object (6) is the motor that drives the processing lens (4).
(7) A hub beam sliver is used to connect the laser beam transmission path (
2), which extracts part of the output of the laser oscillator (11) and part of the reflected light from the workpiece (5). Detect the laser output light reflected by the beam splitter (7). (9
) is a second laser sensor that detects the reflected light from the workpiece (5) reflected by the beam sinter (7). (1
01 is a divider, and when the output of the first loser sensor (8) is output, the second
A device that calculates the ratio C=/b to the output a of the laser sensor (9), (1υ is a meter that measures the output C of the divider (10) and displays it visually.az is a focus position determination device, and +131 is a servo circuit.
以上の構成において、被加工物（５）にレーザ光を照射
すると、その一部は反射される。この時、加工レンズ（
４）を上下させて波力ロエ物（５）上に焦点が合うと、
反射光は平行光線となシもと来た伝送路を戻る。焦点が
ずれた場合は、反射光の一部は加工レンズ（５）に入射
しなかったシ、加工レンズ（４）に入射しても発散され
るなどのため、第２レーザセンサ（９）によシ検出され
る反射光出力は焦点が合ったときが最大となる。したが
って、焦点位置からの加工レンズ（４）のずれと割算器
（ＩＩの出力との関係は第２図に示す特性となる。In the above configuration, when the workpiece (5) is irradiated with laser light, a portion of the laser light is reflected. At this time, the processed lens (
When 4) is moved up and down to focus on the wave power loe object (5),
The reflected light becomes parallel light and returns along the transmission path from which it came. If the focus shifts, some of the reflected light does not enter the processing lens (5), and even if it enters the processing lens (4), it is diverged, so that the reflected light does not reach the second laser sensor (9). The reflected light output that is detected is at its maximum when it is in focus. Therefore, the relationship between the deviation of the processing lens (4) from the focal position and the output of the divider (II) has the characteristics shown in FIG.
以上のことより、加工レンズ（４）の位置を被加工物（
５）に対して上下した時、メータａυの値が最大になっ
た時が、加工レンズ（４）の焦点位置と被加工物（５）
の表面が一致した時である。From the above, the position of the processing lens (4) can be adjusted to the workpiece (
When moving up and down with respect to 5), the time when the value of meter aυ reaches the maximum is the focal position of the processing lens (4) and the workpiece (5).
This is when the surfaces of
加工レンズ（５）をモータ（６）などの駆動装置で上下
する機構を持ち、割算器ａＩの出力が最大になるように
、焦点位置判別装置１１１ （１２＋ 、サーボ回路ｆ
１３）と共にサーボ機構を組めば、焦点合わせを自動で
行なうことができる。It has a mechanism for moving the processing lens (5) up and down by a drive device such as a motor (6), and a focus position determination device 111 (12+, servo circuit f) so that the output of the divider aI is maximized.
If a servo mechanism is assembled with 13), focusing can be performed automatically.
被加工物（５）と同じ厚さの銅、アルミニウムなどの反
射率の高い材料を使用すれば、焦点位置を明確に設定で
きる。By using a highly reflective material such as copper or aluminum that has the same thickness as the workpiece (5), the focal point position can be clearly set.
厚い被加工物（５）を例えば切断するとき、表面よシも
やや深い位置に焦点を合わせた方が能嘉よく切断できる
。この場合でも、表面に目視で焦点を合わせておいて、
あと、例えは何Ｍ下けたらよいかけ、演算によって決め
加工レンズを動かせばよい。For example, when cutting a thick workpiece (5), it is better to focus on a slightly deeper position than the surface to cut more efficiently. Even in this case, keep your eyes focused on the surface.
Also, for example, you can determine how many meters you need to reduce by calculation and move the processing lens.
なお、上記実施例ではレーザ加工装置の焦点合わせにつ
いて述べたが、これに限らすレーザ光を被照射体に焦点
を合わせるものに実施して同様の効果を得ることができ
る。In the above embodiment, focusing of the laser processing apparatus has been described, but the same effect can be obtained by focusing the laser beam on the object to be irradiated.
以上の説明かられかるように、この発明によれば、レー
ザ発振器とレーザ光の被照射体間のレーザ光の伝送路中
から、レーザ発振器の出力光及び被照射体からの反射光
の一部を夫々取シ出し、両者の比が最大となるように集
光装置を調整するようにしたから、下記の効果を有する
。As can be seen from the above description, according to the present invention, part of the output light of the laser oscillator and the reflected light from the object to be irradiated is transmitted from the laser beam transmission path between the laser oscillator and the object to be irradiated with the laser beam. Since the light condensing device is adjusted so that the ratio between the two is maximized, the following effects can be obtained.
１１１焦点位瞳合わせを目視によシ行なうことができる
。111 focal position pupil alignment can be performed visually.
（２）割算をしたことによシ、レーザ発振器の出力が変
化しても感度が一定である。(2) Due to the division, the sensitivity remains constant even if the output of the laser oscillator changes.
（３）自動焦点合わせができる。(3) Automatic focusing is possible.
第１図はこの発明の一実施例を示す構成図、第２図は焦
点位置からの加工レンズのずれと割算器出力との関係を
示す特性図である。
図中、（１）はレーザ発振器、（２）は伝送路、（３）
はペンドミラー、（４）は加工レンズ（集光装置）、（
５１は被加工物（被照射体）、（６）はモータ、（７）
はビームスプリッタ、（８）は第ル−ザセンサ、（９）
は第２レ−ｆ−（＝７１−１（１１は割算器、（１１１
けｉ−ｐ、ａ２Ｆｉ焦点位置判別装置、りはサーボ回路
である。
なお、図中同一符号は夫々同−又は相当部分を示す。
代理人 弁理士 木 村 三 朗FIG. 1 is a block diagram showing an embodiment of the present invention, and FIG. 2 is a characteristic diagram showing the relationship between the deviation of the processing lens from the focal position and the output of the divider. In the figure, (1) is a laser oscillator, (2) is a transmission line, and (3)
is a pend mirror, (4) is a processed lens (concentrator), (
51 is the workpiece (irradiated object), (6) is the motor, (7)
is the beam splitter, (8) is the first loser sensor, (9)
is the second lane f-(=71-1 (11 is the divider, (111
The i-p, the a2Fi focal position determination device, and the servo circuit. Note that the same reference numerals in the figures indicate the same or corresponding parts, respectively. Agent Patent Attorney Sanro Kimura
Claims (1)
路中から前記レーザ発振器の出力光及び被照射体からの
反射光の一部を夫々取り出し、両者の比が最大となるよ
うに集光装置を調整することを特徴としたレーザ焦点合
わせ装置。A part of the output light of the laser oscillator and a part of the reflected light from the irradiated object are extracted from the laser beam transmission path between the laser oscillator and the object to be irradiated with the laser beam, and the light is focused so that the ratio of the two is maximized. A laser focusing device characterized by adjusting the device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59021817A JPS60166185A (en) | 1984-02-10 | 1984-02-10 | Focusing device for laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59021817A JPS60166185A (en) | 1984-02-10 | 1984-02-10 | Focusing device for laser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60166185A true JPS60166185A (en) | 1985-08-29 |
| JPH0231635B2 JPH0231635B2 (en) | 1990-07-16 |
Family
ID=12065608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59021817A Granted JPS60166185A (en) | 1984-02-10 | 1984-02-10 | Focusing device for laser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60166185A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0367624A2 (en) * | 1988-11-03 | 1990-05-09 | Lasa Industries, Inc. | Method and apparatus for laser process control |
| US5948292A (en) * | 1997-06-05 | 1999-09-07 | Mitsubishi Denki Kabushiki Kaisha | Laser beam machining apparatus, focus positioning device for laser beam machining apparatus, and converged laser beam diameter measuring device |
| KR100670940B1 (en) | 2005-02-07 | 2007-01-17 | (주)한빛레이저 | High speed laser beam focus positioning system |
| JP2012238864A (en) * | 2002-04-18 | 2012-12-06 | Applied Materials Inc | Thermal flux processing by scanning |
| CN104842065A (en) * | 2015-05-28 | 2015-08-19 | 南京南车浦镇城轨车辆有限责任公司 | Laser machining head auxiliary focusing device based on pressure sensing |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5035796A (en) * | 1973-08-01 | 1975-04-04 | ||
| JPS5270851A (en) * | 1975-10-23 | 1977-06-13 | Mitsubishi Electric Corp | Focal point adjusting system for rays |
-
1984
- 1984-02-10 JP JP59021817A patent/JPS60166185A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5035796A (en) * | 1973-08-01 | 1975-04-04 | ||
| JPS5270851A (en) * | 1975-10-23 | 1977-06-13 | Mitsubishi Electric Corp | Focal point adjusting system for rays |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0367624A2 (en) * | 1988-11-03 | 1990-05-09 | Lasa Industries, Inc. | Method and apparatus for laser process control |
| US5948292A (en) * | 1997-06-05 | 1999-09-07 | Mitsubishi Denki Kabushiki Kaisha | Laser beam machining apparatus, focus positioning device for laser beam machining apparatus, and converged laser beam diameter measuring device |
| JP2012238864A (en) * | 2002-04-18 | 2012-12-06 | Applied Materials Inc | Thermal flux processing by scanning |
| KR100670940B1 (en) | 2005-02-07 | 2007-01-17 | (주)한빛레이저 | High speed laser beam focus positioning system |
| CN104842065A (en) * | 2015-05-28 | 2015-08-19 | 南京南车浦镇城轨车辆有限责任公司 | Laser machining head auxiliary focusing device based on pressure sensing |
| CN104842065B (en) * | 2015-05-28 | 2016-08-24 | 南京中车浦镇城轨车辆有限责任公司 | A kind of based on pressure sensing laser Machining head auxiliary focusing mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0231635B2 (en) | 1990-07-16 |
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