JPH0231635B2 - - Google Patents
Info
- Publication number
- JPH0231635B2 JPH0231635B2 JP59021817A JP2181784A JPH0231635B2 JP H0231635 B2 JPH0231635 B2 JP H0231635B2 JP 59021817 A JP59021817 A JP 59021817A JP 2181784 A JP2181784 A JP 2181784A JP H0231635 B2 JPH0231635 B2 JP H0231635B2
- Authority
- JP
- Japan
- Prior art keywords
- laser
- light
- beam splitter
- output
- detects
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000005540 biological transmission Effects 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明はレーザ光の焦点合わせ装置に関し、
さらに詳しくはレーザ光により被加工物を切断加
工したりするときに被加工物であるレーザ光の被
照射体に対する集光装置の焦点合わせを目視また
は自動で行なうことができるレーザ光の焦点合わ
せ装置に関するものである。[Detailed Description of the Invention] [Technical Field of the Invention] This invention relates to a laser beam focusing device,
More specifically, a laser beam focusing device that can visually or automatically focus a condensing device on an object to be irradiated with a laser beam, which is a workpiece, when cutting a workpiece with a laser beam. It is related to.
〔従来技術〕
レーザ光線、特に炭酸ガスのレーザ光は波長が
10.6μmであり目には見えない。また、強力であ
るため焦点位置を目視により決めることは困難で
あつた。[Prior art] Laser beams, especially carbon dioxide laser beams, have wavelengths that are
It is 10.6 μm and invisible to the naked eye. In addition, because of the strong force, it was difficult to determine the focal point position visually.
そのため、例えばレーザ加工装置では、被加工
物に一度レーザ光を当てて、穴の大きさを見て、
さらにこの操作を何べんも繰り返えして穴の一番
小さい所を選んで、手動で焦点合わせをしてい
た。したがつて、時間がかかり、精確に合わせる
ことができないと言う欠点があつた。 For this reason, for example, in laser processing equipment, the workpiece is irradiated with a laser beam once, and the size of the hole is checked.
I then repeated this operation several times until I found the smallest hole and manually adjusted the focus. Therefore, there were disadvantages in that it was time consuming and could not be matched accurately.
この発明はこのような欠点を解消するためにな
されたもので、レーザ発振器とレーザ光の被照射
体間のレーザ光の伝送路中から前記レーザ発振器
の出力光及び前記被照射体からの反射光の一部を
夫々取り出し、両者の比が最大となるように集光
装置を調整するようにしたレーザ焦点合わせ装置
を提供することを目的とするものである。
This invention was made to eliminate such drawbacks, and the output light of the laser oscillator and the reflected light from the object to be irradiated are transmitted from the laser beam transmission path between the laser oscillator and the object to be irradiated with the laser beam. It is an object of the present invention to provide a laser focusing device that adjusts a condensing device so that the ratio of the two is maximized.
以下、この発明の一実施例を図に基づいて説明
する。
Hereinafter, one embodiment of the present invention will be described based on the drawings.
第1図はこの発明の一実施例を示す構成図、第
2図は焦点位置からの加工レンズのずれと割算器
出力との関係を示す特性図である。 FIG. 1 is a block diagram showing an embodiment of the present invention, and FIG. 2 is a characteristic diagram showing the relationship between the deviation of the processing lens from the focal position and the output of the divider.
第1図において、1はレーザ発振器、2はレー
ザ光の伝送路、3はベンドミラー、4は集光装置
である加工レンズ、5は被加工物つまりレーザ光
の被照射体、6は加工レンズ4を駆動するモー
タ、7はビームスプリツタで、レーザ光の伝送路
2中に設けてあり、レーザ発振器1の出力の一部
及び被加工物5からの反射光の一部を取り出すも
のである。8は第1レーザセンサで、ビームスプ
リツタ7で反射されたレーザ出力光を検出する。
9は第2レーザセンサで、ビームスプリツタ7で
反射された被加工物5からの反射光を検出する。
10は割算器で、第1レーザセンサ8の出力bと
第2レーザセンサ9の出力aとの比c=a/bを
演算するもの、11はメータで、割算器10の出
力cを計測し、目視できるように表示するもので
ある。12は焦点位置判別装置、13はサーボ回
路である。 In FIG. 1, 1 is a laser oscillator, 2 is a transmission path for laser light, 3 is a bend mirror, 4 is a processing lens which is a condensing device, 5 is a workpiece, that is, an object to be irradiated with laser light, and 6 is a processing lens. 4, a beam splitter 7 is provided in the laser beam transmission path 2, and extracts a part of the output of the laser oscillator 1 and a part of the reflected light from the workpiece 5. . A first laser sensor 8 detects the laser output light reflected by the beam splitter 7.
A second laser sensor 9 detects the reflected light from the workpiece 5 reflected by the beam splitter 7.
10 is a divider that calculates the ratio c=a/b between the output b of the first laser sensor 8 and the output a of the second laser sensor 9; 11 is a meter that calculates the output c of the divider 10; It measures and displays it visually. 12 is a focus position determination device, and 13 is a servo circuit.
以上の構成において、被加工物5にレーザ光を
照射すると、その一部は反射される。この時、加
工レンズ4を上下させて被加工物5上に焦点が合
うと、反射光は平行光線となりもと来た伝送路を
戻る。焦点がずれた場合は、反射光の一部は加工
レンズ5に入射しなかつたり、加工レンズ4に入
射しても発散されるなどのため、第2レーザセン
サ9により検出される反射光出力は焦点が合つた
ときが最大となる。したがつて、焦点位置からの
加工レンズ4のずれと割算器10の出力との関係
は第2図に示す特性となる。 In the above configuration, when the workpiece 5 is irradiated with laser light, a portion of the laser light is reflected. At this time, when the processing lens 4 is moved up and down to focus on the workpiece 5, the reflected light becomes a parallel light beam and returns along the transmission path from which it came. If the focus is shifted, a part of the reflected light may not enter the processing lens 5, or it may be diverged even if it enters the processing lens 4, so that the reflected light output detected by the second laser sensor 9 will be It is at its maximum when it is in focus. Therefore, the relationship between the deviation of the processing lens 4 from the focal position and the output of the divider 10 has the characteristics shown in FIG.
以上のことより、加工レンズ4の位置を被加工
物5に対して上下した時、メータ11の値が最大
になつた時が、加工レンズ4の焦点位置と被加工
物5の表面が一致した時である。 From the above, when the position of the processing lens 4 is moved up and down with respect to the workpiece 5, the focal position of the processing lens 4 and the surface of the workpiece 5 coincide with each other when the value of the meter 11 reaches the maximum. It's time.
加工レンズ5をモータ6などの駆動装置で上下
する機構をもち、割算器10の出力が最大になる
ように、焦点位置判別装置12、サーボ回路13
と共にサーボ機構を組めば、焦点合わせを自動で
行なうことができる。 It has a mechanism for moving the processing lens 5 up and down by a drive device such as a motor 6, and a focus position determination device 12 and a servo circuit 13 so that the output of the divider 10 is maximized.
By assembling a servo mechanism with the lens, focusing can be performed automatically.
被加工物5と同じ厚さの銅、アルミニウムなど
の反射率の高い材料を使用すれば、焦点位置を明
確に設定できる。 If a highly reflective material such as copper or aluminum is used and has the same thickness as the workpiece 5, the focal position can be clearly set.
厚い被加工物5を例えば切断するとき、表面よ
りもやや深い位置に焦点を合わせた方が能率よく
切断できる。この場合でも、表面に目視で焦点を
合わせておいて、あと、例えば何mm下げたらよい
かは、演算によつて決め加工レンズを動かせばよ
い。 For example, when cutting a thick workpiece 5, it is possible to cut more efficiently by focusing on a position slightly deeper than the surface. Even in this case, the focus can be set visually on the surface, and then, for example, how many mm should be lowered can be determined by calculation and the processed lens can be moved.
なお、上記実施例ではレーザ加工装置の焦点合
わせについて述べたが、これに限らずレーザ光を
被照射体に焦点を合わせるものに実施して同様の
効果を得ることができる。 In addition, although the above-mentioned embodiment described the focusing of the laser processing apparatus, the same effect can be obtained by focusing the laser beam on the object to be irradiated.
以上の説明からわかるように、この発明によれ
ば、レーザ光の伝送路中に配置され、レーザ発振
器の出力光及びこの出力光が被照射体を照射する
ことによりその一部が反射されて伝送路を戻つて
来た反射光の夫々の一部を取り出すビームスプリ
ツタと、ビームスプリツタで取り出された前記出
力光を検出する第1レーザセンサと、ビームスプ
リツタで取り出された前記反射光を検出する第2
レーザセンサと、第1及び第2のレーザセンサの
出力の比を演算し、集光装置を上下させて被照射
体の表面上に焦点が合つたとき最大値を出力する
演算器とを設けるという簡単な構造により、下記
の効果を有する。
As can be seen from the above description, according to the present invention, the laser oscillator is arranged in the transmission path of the laser beam, and when the output light of the laser oscillator and the output light irradiate the irradiated object, a part of it is reflected and transmitted. a beam splitter that takes out each part of the reflected light that has returned to the path; a first laser sensor that detects the output light taken out by the beam splitter; and a first laser sensor that detects the output light taken out by the beam splitter; 2nd to detect
A laser sensor is provided, and a computing unit that computes the ratio of the outputs of the first and second laser sensors and outputs the maximum value when the light condensing device is moved up and down to focus on the surface of the irradiated object. The simple structure has the following effects.
(1) 焦点位置合わせを目視により正確に行なうこ
とができる。(1) Focus positioning can be performed accurately by visual inspection.
(2) 第1及び第2のレーザセンサの出力の比を演
算したことにより、レーザ発振器の出力が変化
しても感度が一定である。(2) By calculating the ratio of the outputs of the first and second laser sensors, the sensitivity remains constant even if the output of the laser oscillator changes.
(3) 自動焦点合わせができる。(3) Automatic focusing is possible.
第1図はこの発明の一実施例を示す構成図、第
2図は焦点位置からの加工レンズのずれと割算器
出力との関係を示す特性図である。
図中、1はレーザ発振器、2は伝送路、3はベ
ンドミラー、4は加工レンズ(集光装置)、5は
被加工物(被照射体)、6はモータ、7はビーム
スプリツタ、8は第1レーザセンサ、9は第2レ
ーザセンサ、10は割算器、11はメータ、12
は焦点位置判別装置、13はサーボ回路である。
なお、図中同一符号は夫々同一又は相当部分を示
す。
FIG. 1 is a block diagram showing an embodiment of the present invention, and FIG. 2 is a characteristic diagram showing the relationship between the deviation of the processing lens from the focal position and the output of the divider. In the figure, 1 is a laser oscillator, 2 is a transmission line, 3 is a bend mirror, 4 is a processing lens (concentrator), 5 is a workpiece (irradiated object), 6 is a motor, 7 is a beam splitter, 8 is a first laser sensor, 9 is a second laser sensor, 10 is a divider, 11 is a meter, 12
1 is a focus position determination device, and 13 is a servo circuit.
Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
から伝送路を介して伝送されたレーザ光を被照射
体上に集光する集光装置と、 前記伝送路中に配置され、前記レーザ発振器の
出力光及びこの出力光が被照射体を照射すること
によりその一部が反射されて前記伝送路を戻つて
来た反射光の夫々の一部を取り出すビームスプリ
ツタと、 このビームスプリツタで取り出された前記出力
光を検出する第1レーザセンサと、 前記ビームスプリツタで取り出された前記反射
光を検出する第2レーザセンサと、 前記第1及び第2レーザセンサの出力の比を演
算し、前記集光装置を上下させて前記被照射体の
表面上に焦点が合つたとき最大値を出力する演算
器とを備えたレーザ焦点合わせ装置。[Scope of Claims] 1. A condensing device that is supported in a vertically movable manner and that condenses laser light transmitted from a laser oscillator via a transmission path onto an irradiated object; , a beam splitter that takes out each part of the output light of the laser oscillator and the reflected light that is partially reflected when the output light irradiates the irradiated object and returns through the transmission path; a first laser sensor that detects the output light taken out by the beam splitter; a second laser sensor that detects the reflected light taken out by the beam splitter; and a second laser sensor that detects the reflected light taken out by the beam splitter; A laser focusing device comprising: a calculator that calculates a ratio and outputs a maximum value when the light focusing device is moved up and down to focus on the surface of the irradiated object.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59021817A JPS60166185A (en) | 1984-02-10 | 1984-02-10 | Focusing device for laser |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59021817A JPS60166185A (en) | 1984-02-10 | 1984-02-10 | Focusing device for laser |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60166185A JPS60166185A (en) | 1985-08-29 |
JPH0231635B2 true JPH0231635B2 (en) | 1990-07-16 |
Family
ID=12065608
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59021817A Granted JPS60166185A (en) | 1984-02-10 | 1984-02-10 | Focusing device for laser |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60166185A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4865683A (en) * | 1988-11-03 | 1989-09-12 | Lasa Industries, Inc. | Method and apparatus for laser process control |
JPH10328867A (en) * | 1997-06-05 | 1998-12-15 | Mitsubishi Electric Corp | Laser beam machining device, focusing jig therefor and jig for measuring diameter of condensed laser beam |
KR101010492B1 (en) * | 2002-04-18 | 2011-01-21 | 어플라이드 머티어리얼스, 인코포레이티드 | Thermal flux processing by scanning electromagnetic radiation |
KR100670940B1 (en) | 2005-02-07 | 2007-01-17 | (주)한빛레이저 | High speed laser beam focus positioning system |
CN104842065B (en) * | 2015-05-28 | 2016-08-24 | 南京中车浦镇城轨车辆有限责任公司 | A kind of based on pressure sensing laser Machining head auxiliary focusing mechanism |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5035796A (en) * | 1973-08-01 | 1975-04-04 | ||
JPS5270851A (en) * | 1975-10-23 | 1977-06-13 | Mitsubishi Electric Corp | Focal point adjusting system for rays |
-
1984
- 1984-02-10 JP JP59021817A patent/JPS60166185A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5035796A (en) * | 1973-08-01 | 1975-04-04 | ||
JPS5270851A (en) * | 1975-10-23 | 1977-06-13 | Mitsubishi Electric Corp | Focal point adjusting system for rays |
Also Published As
Publication number | Publication date |
---|---|
JPS60166185A (en) | 1985-08-29 |
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