JP2971003B2 - Device to detect dirt on lens of laser repair device - Google Patents

Device to detect dirt on lens of laser repair device

Info

Publication number
JP2971003B2
JP2971003B2 JP33607994A JP33607994A JP2971003B2 JP 2971003 B2 JP2971003 B2 JP 2971003B2 JP 33607994 A JP33607994 A JP 33607994A JP 33607994 A JP33607994 A JP 33607994A JP 2971003 B2 JP2971003 B2 JP 2971003B2
Authority
JP
Japan
Prior art keywords
laser
lens
intensity
beam splitter
light receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP33607994A
Other languages
Japanese (ja)
Other versions
JPH08178856A (en
Inventor
信茂 堂前
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ADOBANTESUTO KK
Original Assignee
ADOBANTESUTO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ADOBANTESUTO KK filed Critical ADOBANTESUTO KK
Priority to JP33607994A priority Critical patent/JP2971003B2/en
Publication of JPH08178856A publication Critical patent/JPH08178856A/en
Application granted granted Critical
Publication of JP2971003B2 publication Critical patent/JP2971003B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、レーザを用いてウェハ
上のパターンを加工するレーザ加工装置のレンズの汚れ
を検出する方法及びその装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for detecting contamination on a lens of a laser processing apparatus for processing a pattern on a wafer by using a laser.

【0002】[0002]

【従来の技術】図3に、従来のレーザ加工装置におけ
る、加工用レーザ光の経路を示す。レーザ発振器10で
発生したレーザ光は、ミラーM1、ミラーM2及びミラ
ーM3を経由して加工しようとするウェハに垂直に入力
するように反射される。そして、上記レーザ光は、ウェ
ハの直前で対物レンズ11により、ウェハへの焦点合わ
せが行なわれる。
2. Description of the Related Art FIG. 3 shows a path of a processing laser beam in a conventional laser processing apparatus. The laser beam generated by the laser oscillator 10 is reflected via the mirror M1, the mirror M2, and the mirror M3 so as to be vertically input to the wafer to be processed. Then, the laser light is focused on the wafer by the objective lens 11 immediately before the wafer.

【0003】[0003]

【発明が解決しようとする課題】ウェハ上での加工を微
細化しようとする場合、レーザのスポット径を小さくす
る必要がある。そのために対物レンズ11とウェハ12
の距離が短くなる。その結果として、レーザ加工時、ウ
ェハより飛び散るポリシリコンがレンズに付着すること
があるようになった。レンズによごれが付着すると、ウ
ェハ上に到達するレーザ光のパワーが低下する。そし
て、そのまま加工を行うと、パワーが不足し、切断不良
が発生してしまう。本発明は、レーザ加工装置におい
て、対物レンズ表面の汚れを検出する方法及び装置を実
現することを目的としている。
When the processing on the wafer is to be miniaturized, it is necessary to reduce the laser spot diameter. Therefore, the objective lens 11 and the wafer 12
Distance becomes shorter. As a result, during laser processing, polysilicon scattered from the wafer may adhere to the lens. If the lens adheres to the lens, the power of the laser beam reaching the wafer decreases. Then, if the processing is performed as it is, the power is insufficient and a cutting failure occurs. An object of the present invention is to realize a method and an apparatus for detecting dirt on the surface of an objective lens in a laser processing apparatus.

【0004】[0004]

【課題を解決するための手段】上記目的を達成するため
に、本発明においては、次のような方法及び装置を実現
している。つまり、レーザ発振器10より出力したレー
ザ光の強さを受光部A15で測定し、対物レンズ11を
通過したレーザ光の強さを受光部B16または受光部B
26で測定し、受光部A15の測定データと受光部B1
6または受光部B26の測定データの比が、レンズが汚
れていない初期状態より変化したことを検出して、レー
ザ加工装置のレンズの汚れを検出している。
In order to achieve the above object, the present invention realizes the following method and apparatus. That is, the intensity of the laser light output from the laser oscillator 10 is measured by the light receiving unit A15, and the intensity of the laser light passing through the objective lens 11 is measured by the light receiving unit B16 or the light receiving unit B15.
26, the measurement data of the light receiving unit A15 and the light receiving unit B1
By detecting that the ratio of the measurement data of No. 6 or the light receiving unit B26 has changed from the initial state in which the lens is not dirty, the dirt on the lens of the laser processing apparatus is detected.

【0005】また、レーザ発振器10より出力したレー
ザ光の強さを、ビームスプリッタ1を通して測定する受
光部Aを設け、ビームスプリッタ1及びビームスプリッ
タ2を経由したレーザ光を、1/4波長板14及び対物
レンズ11を通して照射する標準反射板13を設け、標
準反射板13で反射し、対物レンズ11を透過したレー
ザ光の強さを、1/4波長板14及びビームスプリッタ
2を通して測定する受光部B16を設け、レーザ加工装
置のレンズの汚れを検出する装置としている。
Further, a light receiving section A for measuring the intensity of the laser beam output from the laser oscillator 10 through the beam splitter 1 is provided, and the laser beam passing through the beam splitter 1 and the beam splitter 2 is transmitted to the quarter wavelength plate 14. A light receiving unit for measuring the intensity of laser light reflected by the standard reflecting plate 13 and transmitted through the objective lens 11 through the quarter-wave plate 14 and the beam splitter 2; B16 is provided to detect contamination of the lens of the laser processing apparatus.

【0006】別の方法として、レーザ発振器10より出
力したレーザ光の強さを、ビームスプリッタ1を通して
測定する受光部A15を設け、ビームスプリッタ1、ミ
ラーM2及び対物レンズ11を経由したレーザ光の強さ
を測定する受光部B26を設け、レーザ加工装置のレン
ズの汚れを検出する装置としている。
As another method, a light receiving section A15 for measuring the intensity of the laser light output from the laser oscillator 10 through the beam splitter 1 is provided, and the intensity of the laser light passing through the beam splitter 1, the mirror M2 and the objective lens 11 is provided. A light receiving unit B26 for measuring the height is provided to detect contamination of a lens of the laser processing apparatus.

【0007】[0007]

【作用】対物レンズ11に汚れがついた場合、そこを透
過するレーザの強さは、汚れのない場合に比べ減衰す
る。そこで、その減衰を測定することで、レンズの汚れ
を検出できる。しかし、レーザ発振器10より出力され
るレーザ光の強さが変動するため、対物レンズ11を透
過したレーザ光の強さを測定しただけでレンズの汚れを
特定することはできない。そこで、レーザ発振器10よ
り出力したレーザ光の強さも測定し、レーザ発振器10
を出力したレーザ光の強さと、対物レンズを透過したレ
ーザ光の強さとの比を求め、初期状態より変化したこと
を検出して、レンズの汚れを検知することができる。
When the objective lens 11 is contaminated, the intensity of the laser beam transmitted therethrough is attenuated as compared with the case where there is no contamination. Therefore, the dirt on the lens can be detected by measuring the attenuation. However, since the intensity of the laser light output from the laser oscillator 10 fluctuates, the dirt on the lens cannot be specified only by measuring the intensity of the laser light transmitted through the objective lens 11. Therefore, the intensity of the laser light output from the laser oscillator 10 is also measured, and the laser oscillator 10
The ratio between the intensity of the laser light that has output the laser beam and the intensity of the laser light that has passed through the objective lens is determined, and a change from the initial state can be detected to detect dirt on the lens.

【0008】[0008]

【実施例】【Example】

(実施例1)図1に本発明の実施例を示す。このレーザ
加工装置のレンズの汚れを検出する装置は、レーザ発振
器10より出力したレーザ光の強さを、ミラーM1及び
ビームスプリッタ1を通して測定する受光部A15と、
ビームスプリッタ1及びビームスプリッタ2を経由した
レーザ光を、1/4波長板14及び対物レンズ11を通
して照射する標準反射板13と、標準反射板13で反射
し、対物レンズ11を透過したレーザ光の強さを、1/
4波長板14及びビームスプリッタ2を通して測定する
受光部B16とで構成される。
(Embodiment 1) FIG. 1 shows an embodiment of the present invention. The laser processing device for detecting dirt on the lens includes a light receiving unit A15 for measuring the intensity of the laser light output from the laser oscillator 10 through the mirror M1 and the beam splitter 1, and
The standard reflector 13 for irradiating the laser beam passing through the beam splitter 1 and the beam splitter 2 through the quarter-wave plate 14 and the objective lens 11, and the laser beam reflected by the standard reflector 13 and transmitted through the objective lens 11. Strength is 1 /
It comprises a four-wavelength plate 14 and a light receiving section B16 for measurement through the beam splitter 2.

【0009】レーザ発振器10より出力されたレーザ光
は、ミラーM1で反射されビームスプリッタ1に入力す
る。ビームスプリッタ1で50%のレーザ光はビームス
プリッタ2の方向に進み、残りの50%のレーザ光は受
光部A15に進む。ビームスプリッタ2に進んだレーザ
光は、ビームスプリッタ2で反射され、1/4波長板1
4及び対物レンズ11を通し、標準反射板13に焦点を
結ぶ。ここで、1/4波長板14を透過するとき、レー
ザの位相が90度変化する。レーザは、標準反射板13
上で反射し、対物レンズ11及び1/4波長板14を通
してビームスプリッタ2に入力する。ここで、1/4波
長板14を透過するとき、レーザの位相が更に90度変
化し、ビームスプリッタ2へ入力するレーザは、その位
相が180度変化している。ビームスプリッタ2は、ビ
ームスプリッタ1からのレーザ光に対し180度位相が
変化したレーザを透過し、レーザ光は、受部B16に
到達する。
The laser light output from the laser oscillator 10 is reflected by the mirror M1 and is input to the beam splitter 1. In the beam splitter 1, 50% of the laser light travels toward the beam splitter 2, and the remaining 50% of the laser light travels to the light receiving unit A15. The laser light that has advanced to the beam splitter 2 is reflected by the beam splitter 2 and
The focus is focused on the standard reflection plate 13 through 4 and the objective lens 11. Here, when the laser beam passes through the quarter-wave plate 14, the phase of the laser changes by 90 degrees. The laser uses the standard reflector 13
The light is reflected on the upper side and enters the beam splitter 2 through the objective lens 11 and the 波長 wavelength plate 14. Here, when the laser beam passes through the quarter-wave plate 14, the phase of the laser is further changed by 90 degrees, and the phase of the laser input to the beam splitter 2 is changed by 180 degrees. Beam splitter 2 transmits the laser 180 degree phase changes to the laser beam from the beam splitter 1, the laser beam reaches the light receiving portion B16.

【0010】対物レンズ11に汚れがついた場合、そこ
を透過するレーザの強さは、汚れのない場合に比べ減衰
する。そこで、その減衰を測定することで、レンズの汚
れを検出できる。しかし、レーザ発振器10より出力さ
れるレーザ光の強さが変動するため、対物レンズ11を
透過したレーザ光の強さを測定しただけでレンズの汚れ
を特定することはできない。そこで、レーザ発振器10
より出力したレーザ光の強さも測定し、レーザ発振器1
0を出力したレーザ光の強さと、対物レンズを透過した
レーザ光の強さとの比を求め、初期状態より変化したこ
とを検出して、レンズの汚れを検知することができる。
図1の例においては、標準反射板13を用いて反射さ
せ、受光部A15と受光部B16のレーザ光の強さの比
率をあらかじめ測定し、その後、その比率が変化した場
合は、途中のレンズ上に汚れがついたため、受光部B1
6のレーザ光の強さが低下したものと考えることができ
る。この実施例においては、対物レンズ11を往復2回
通過するため、実施例2における1回通過と比べると、
レンズの汚れに対する受光部B16の減衰は大きく、検
出感度が高いといえる。
When the objective lens 11 is contaminated, the intensity of the laser transmitted therethrough is attenuated as compared with the case where there is no contamination. Therefore, the dirt on the lens can be detected by measuring the attenuation. However, since the intensity of the laser light output from the laser oscillator 10 fluctuates, the dirt on the lens cannot be specified only by measuring the intensity of the laser light transmitted through the objective lens 11. Therefore, the laser oscillator 10
The intensity of the output laser light is also measured, and the laser oscillator 1
The ratio between the intensity of the laser light that has output 0 and the intensity of the laser light that has passed through the objective lens is obtained, and a change from the initial state can be detected to detect dirt on the lens.
In the example of FIG. 1, the light is reflected using the standard reflecting plate 13, and the ratio of the intensity of the laser beam between the light receiving unit A15 and the light receiving unit B16 is measured in advance. The light receiving section B1
It can be considered that the intensity of the laser light of No. 6 decreased. In this embodiment, since the light passes through the objective lens 11 twice in a reciprocating manner, compared with the single pass in the second embodiment,
It can be said that the light receiving portion B16 has a large attenuation with respect to the dirt on the lens and the detection sensitivity is high.

【0011】(実施例2)図2に本発明の別の実施例を
示す。この実施例において、このレーザ加工装置のレン
ズの汚れを検出する装置は、レーザ発振器10より出力
したレーザ光の強さを、ミラーM1及びビームスプリッ
タ1を通して測定する受光部A15と、ビームスプリッ
タ1及びミラーM2を経由して、対物レンズ11を透過
したレーザ光の強さを測定する受光部B26とで構成さ
れる。
(Embodiment 2) FIG. 2 shows another embodiment of the present invention. In this embodiment, the apparatus for detecting the dirt on the lens of the laser processing apparatus includes a light receiving unit A15 for measuring the intensity of the laser beam output from the laser oscillator 10 through the mirror M1 and the beam splitter 1, a beam splitter 1, The light receiving unit B26 measures the intensity of the laser beam transmitted through the objective lens 11 via the mirror M2.

【0012】レーザ発振器10より出力されたレーザ光
は、ミラーM1で反射されビームスプリッタ1に入力す
る。ビームスプリッタ1で50%のレーザ光はミラーM
2の方向に進み、残りの50%のレーザ光は受光部A1
5に進む。ミラーM2に進んだレーザ光は、ミラーM2
で反射され、対物レンズ11を通して集束した後、受光
部B26に到達する。
The laser light output from the laser oscillator 10 is reflected by the mirror M1 and is input to the beam splitter 1. 50% of the laser beam from the beam splitter 1 is mirror M
2 and the remaining 50% of the laser light is
Go to 5. The laser beam that has traveled to the mirror M2
After being reflected by the objective lens 11 and converging, the light reaches the light receiving unit B26.

【0013】対物レンズ11に汚れがついた場合、そこ
を透過するレーザの強さは、汚れのない場合に比べ減衰
する。そこで、その減衰を測定することで、レンズの汚
れを検出できる。しかし、レーザ発振器10より出力さ
れるレーザ光の強さが変動するため、対物レンズ11を
透過したレーザ光の強さを測定しただけでレンズの汚れ
を特定することはできない。そこで、レーザ発振器10
より出力したレーザ光の強さも測定し、レーザ発振器1
0を出力したレーザ光の強さと、対物レンズを透過した
レーザ光の強さとの比を求め、初期状態より変化したこ
とを検出して、レンズの汚れを検知することができる。
図2の例においては、受光部A15と受光部B26のレ
ーザ光の強さの比率をあらかじめ測定し、その後、その
比率が変化した場合は、途中のレンズ上に汚れがついた
ため、受光部B26のレーザ光の強さが低下したものと
考えることができる。この実施例においては、対物レン
ズ11を1回通過するため、実施例1における2回通過
に比べると、レンズの汚れに対する受光部B26の減衰
は小さく、検出感度が低いといえる。
When the objective lens 11 is contaminated, the intensity of the laser transmitted therethrough is attenuated as compared with the case where there is no contamination. Therefore, the dirt on the lens can be detected by measuring the attenuation. However, since the intensity of the laser light output from the laser oscillator 10 fluctuates, the dirt on the lens cannot be specified only by measuring the intensity of the laser light transmitted through the objective lens 11. Therefore, the laser oscillator 10
The intensity of the output laser light is also measured, and the laser oscillator 1
The ratio between the intensity of the laser light that outputs 0 and the intensity of the laser light that has passed through the objective lens is obtained, and a change from the initial state can be detected to detect contamination of the lens.
In the example of FIG. 2, the ratio of the intensity of the laser light between the light receiving unit A15 and the light receiving unit B26 is measured in advance, and if the ratio changes thereafter, the dirt is attached to the intermediate lens. It can be considered that the intensity of the laser light has decreased. In this embodiment, since the light passes through the objective lens 11 once, the attenuation of the light receiving portion B26 against the dirt on the lens is smaller and the detection sensitivity is lower as compared with the two passes in the first embodiment.

【0014】[0014]

【発明の効果】本発明は、以上説明したように構成され
ているので、以下に記載されるような効果を奏する。ま
ず、対物レンズ11に汚れがついた場合、そこを透過す
るレーザの強さは、汚れのない場合に比べ減衰する。そ
こで、その減衰を測定することで、レンズの汚れを検出
できる。しかし、レーザ発振器10より出力されるレー
ザ光の強さが変動するため、対物レンズ11を透過した
レーザ光の強さを測定しただけでレンズの汚れを特定す
ることはできない。そこで、レーザ発振器10より出力
したレーザ光の強さも測定し、レーザ発振器10を出力
したレーザ光の強さと、対物レンズを透過したレーザ光
の強さとの比を求め、初期状態より変化したことを検出
して、レンズの汚れを検知することができる。レーザ加
工を実施する前に、受光部A15と受光部B16または
受光部B26を測定し、その比を求め、レンズが汚れて
いない初期値に対して変化がないことを確認すること
で、レンズの汚れがないことを確信し、レーザ光のパワ
ー不足による、切断不良を未然に防ぐことができ、有効
な発明である。
Since the present invention is configured as described above, it has the following effects. First, when the objective lens 11 is contaminated, the intensity of the laser transmitted therethrough is attenuated as compared with the case where there is no dirt. Therefore, the dirt on the lens can be detected by measuring the attenuation. However, since the intensity of the laser light output from the laser oscillator 10 fluctuates, the dirt on the lens cannot be specified only by measuring the intensity of the laser light transmitted through the objective lens 11. Therefore, the intensity of the laser light output from the laser oscillator 10 was also measured, and the ratio of the intensity of the laser light output from the laser oscillator 10 to the intensity of the laser light transmitted through the objective lens was determined. By detecting, dirt on the lens can be detected. Before performing the laser processing, the light receiving unit A15 and the light receiving unit B16 or the light receiving unit B26 are measured, the ratio is obtained, and it is confirmed that there is no change with respect to the initial value at which the lens is not stained. This is an effective invention because it is convinced that there is no dirt, and it is possible to prevent cutting defects due to insufficient laser beam power.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例を示す説明図である。FIG. 1 is an explanatory diagram showing one embodiment of the present invention.

【図2】本発明の別の実施例を示す説明図である。FIG. 2 is an explanatory view showing another embodiment of the present invention.

【図3】従来のレーザ加工装置を示す説明図である。FIG. 3 is an explanatory view showing a conventional laser processing apparatus.

【符号の説明】[Explanation of symbols]

10 レーザ発振器 11 対物レンズ 12 ウェハ 13 標準反射板 14 1/4波長板 15 受光部A 16、26 受光部B DESCRIPTION OF SYMBOLS 10 Laser oscillator 11 Objective lens 12 Wafer 13 Standard reflection plate 14 Quarter-wave plate 15 Light receiving part A 16, 26 Light receiving part B

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 レーザ発振器(10)より出力したリペ
用レーザ光の強さを、ビームスプリッタ(1)を通し
て測定する受光部A(15)を設け、 ビームスプリッタ(1)及びビームスプリッタ(2)を
経由したレーザ光を、1/4波長板(14)及び対物レ
ンズ(11)を通して照射する標準反射板(13)を設
け、 標準反射板(13)で反射し、対物レンズ(11)を透
過したレーザ光の強さを、1/4波長板(14)及びビ
ームスプリッタ(2)を通して測定する受光部B(1
6)を設けたことを特徴とするレーザリペア装置のレン
ズの汚れを検出する装置。
A lipstick output from a laser oscillator (10)
A light receiving unit A (15) for measuring the intensity of the laser light for a through the beam splitter (1) is provided, and the laser light passing through the beam splitter (1) and the beam splitter (2) is converted into a 波長 wavelength plate ( 14) and a standard reflector (13) for irradiating through the objective lens (11). The intensity of the laser beam reflected by the standard reflector (13) and transmitted through the objective lens (11) is reduced by a 波長 wavelength plate. (14) and the light receiving section B (1) for measurement through the beam splitter (2)
An apparatus for detecting contamination of a lens of a laser repair apparatus, wherein the apparatus is provided with 6).
JP33607994A 1994-12-22 1994-12-22 Device to detect dirt on lens of laser repair device Expired - Lifetime JP2971003B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33607994A JP2971003B2 (en) 1994-12-22 1994-12-22 Device to detect dirt on lens of laser repair device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33607994A JP2971003B2 (en) 1994-12-22 1994-12-22 Device to detect dirt on lens of laser repair device

Publications (2)

Publication Number Publication Date
JPH08178856A JPH08178856A (en) 1996-07-12
JP2971003B2 true JP2971003B2 (en) 1999-11-02

Family

ID=18295484

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33607994A Expired - Lifetime JP2971003B2 (en) 1994-12-22 1994-12-22 Device to detect dirt on lens of laser repair device

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ES2377521T3 (en) 2002-03-12 2012-03-28 Hamamatsu Photonics K.K. Method to divide a substrate
JP6546229B2 (en) * 2017-08-23 2019-07-17 ファナック株式会社 Laser processing method of adjusting focus shift according to the type and level of contamination of external optical system before laser processing

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JPH08178856A (en) 1996-07-12

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