JPH08178856A - Method and device for detecting contamination of lens of laser machining device - Google Patents
Method and device for detecting contamination of lens of laser machining deviceInfo
- Publication number
- JPH08178856A JPH08178856A JP33607994A JP33607994A JPH08178856A JP H08178856 A JPH08178856 A JP H08178856A JP 33607994 A JP33607994 A JP 33607994A JP 33607994 A JP33607994 A JP 33607994A JP H08178856 A JPH08178856 A JP H08178856A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- lens
- intensity
- light receiving
- objective lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Lasers (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、レーザを用いてウェハ
上のパターンを加工するレーザ加工装置のレンズの汚れ
を検出する方法及びその装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for detecting dirt on a lens of a laser processing apparatus for processing a pattern on a wafer by using a laser.
【０００２】[0002]
【従来の技術】図３に、従来のレーザ加工装置におけ
る、加工用レーザ光の経路を示す。レーザ発振器１０で
発生したレーザ光は、ミラーＭ１、ミラーＭ２及びミラ
ーＭ３を経由して加工しようとするウェハに垂直に入力
するように反射される。そして、上記レーザ光は、ウェ
ハの直前で対物レンズ１１により、ウェハへの焦点合わ
せが行なわれる。2. Description of the Related Art FIG. 3 shows a path of a processing laser beam in a conventional laser processing apparatus. The laser light generated by the laser oscillator 10 is reflected via the mirror M1, the mirror M2, and the mirror M3 so as to be vertically input to the wafer to be processed. Then, the laser light is focused on the wafer by the objective lens 11 immediately before the wafer.
【０００３】[0003]
【発明が解決しようとする課題】ウェハ上での加工を微
細化しようとする場合、レーザのスポット径を小さくす
る必要がある。そのために対物レンズ１１とウェハ１２
の距離が短くなる。その結果として、レーザ加工時、ウ
ェハより飛び散るポリシリコンがレンズに付着すること
があるようになった。レンズによごれが付着すると、ウ
ェハ上に到達するレーザ光のパワーが低下する。そし
て、そのまま加工を行うと、パワーが不足し、切断不良
が発生してしまう。本発明は、レーザ加工装置におい
て、対物レンズ表面の汚れを検出する方法及び装置を実
現することを目的としている。In order to miniaturize the processing on the wafer, it is necessary to reduce the spot diameter of the laser. Therefore, the objective lens 11 and the wafer 12
Distance becomes shorter. As a result, the polysilicon scattered from the wafer may adhere to the lens during laser processing. When dirt adheres to the lens, the power of the laser light that reaches the wafer decreases. Then, if the processing is performed as it is, the power becomes insufficient and a cutting failure occurs. An object of the present invention is to realize a method and apparatus for detecting dirt on the surface of an objective lens in a laser processing apparatus.
【０００４】[0004]
【課題を解決するための手段】上記目的を達成するため
に、本発明においては、次のような方法及び装置を実現
している。つまり、レーザ発振器１０より出力したレー
ザ光の強さを受光部Ａ１５で測定し、対物レンズ１１を
通過したレーザ光の強さを受光部Ｂ１６または受光部Ｂ
２６で測定し、受光部Ａ１５の測定データと受光部Ｂ１
６または受光部Ｂ２６の測定データの比が、レンズが汚
れていない初期状態より変化したことを検出して、レー
ザ加工装置のレンズの汚れを検出している。In order to achieve the above object, the present invention realizes the following method and apparatus. That is, the intensity of the laser beam output from the laser oscillator 10 is measured by the light receiving unit A15, and the intensity of the laser beam passing through the objective lens 11 is measured by the light receiving unit B16 or the light receiving unit B.
26, the measurement data of the light receiving portion A15 and the light receiving portion B1
6 or the ratio of the measurement data of the light receiving unit B26 is changed from the initial state in which the lens is not dirty, and the dirt of the lens of the laser processing apparatus is detected.
【０００５】また、レーザ発振器１０より出力したレー
ザ光の強さを、ビームスプリッタ１を通して測定する受
光部Ａを設け、ビームスプリッタ１及びビームスプリッ
タ２を経由したレーザ光を、１／４波長板１４及び対物
レンズ１１を通して照射する標準反射板１３を設け、標
準反射板１３で反射し、対物レンズ１１を透過したレー
ザ光の強さを、１／４波長板１４及びビームスプリッタ
２を通して測定する受光部Ｂ１６を設け、レーザ加工装
置のレンズの汚れを検出する装置としている。Further, a light receiving portion A for measuring the intensity of the laser light output from the laser oscillator 10 through the beam splitter 1 is provided, and the laser light passing through the beam splitter 1 and the beam splitter 2 is converted into a quarter wavelength plate 14 And a standard reflection plate 13 for irradiating through the objective lens 11, and a light receiving section for measuring the intensity of the laser light reflected by the standard reflection plate 13 and transmitted through the objective lens 11 through the quarter wavelength plate 14 and the beam splitter 2. B16 is provided so as to detect dirt on the lens of the laser processing apparatus.
【０００６】別の方法として、レーザ発振器１０より出
力したレーザ光の強さを、ビームスプリッタ１を通して
測定する受光部Ａ１５を設け、ビームスプリッタ１、ミ
ラーＭ２及び対物レンズ１１を経由したレーザ光の強さ
を測定する受光部Ｂ２６を設け、レーザ加工装置のレン
ズの汚れを検出する装置としている。As another method, a light receiving section A15 for measuring the intensity of the laser beam output from the laser oscillator 10 through the beam splitter 1 is provided, and the intensity of the laser beam passing through the beam splitter 1, the mirror M2 and the objective lens 11 is provided. A light receiving portion B26 for measuring the height is provided to detect dirt on the lens of the laser processing apparatus.
【０００７】[0007]
【作用】対物レンズ１１に汚れがついた場合、そこを透
過するレーザの強さは、汚れのない場合に比べ減衰す
る。そこで、その減衰を測定することで、レンズの汚れ
を検出できる。しかし、レーザ発振器１０より出力され
るレーザ光の強さが変動するため、対物レンズ１１を透
過したレーザ光の強さを測定しただけでレンズの汚れを
特定することはできない。そこで、レーザ発振器１０よ
り出力したレーザ光の強さも測定し、レーザ発振器１０
を出力したレーザ光の強さと、対物レンズを透過したレ
ーザ光の強さとの比を求め、初期状態より変化したこと
を検出して、レンズの汚れを検知することができる。When the objective lens 11 is contaminated, the intensity of the laser beam passing therethrough is attenuated as compared with the case where the objective lens 11 is not contaminated. Therefore, the dirt of the lens can be detected by measuring the attenuation. However, since the intensity of the laser light output from the laser oscillator 10 fluctuates, it is not possible to specify the dirt on the lens only by measuring the intensity of the laser light transmitted through the objective lens 11. Therefore, the intensity of the laser beam output from the laser oscillator 10 is also measured, and the laser oscillator 10
The contamination of the lens can be detected by obtaining the ratio of the intensity of the laser beam that has output to the intensity of the laser beam that has passed through the objective lens and detecting the change from the initial state.
【０００８】[0008]
（実施例１）図１に本発明の実施例を示す。このレーザ
加工装置のレンズの汚れを検出する装置は、レーザ発振
器１０より出力したレーザ光の強さを、ミラーＭ１及び
ビームスプリッタ１を通して測定する受光部Ａ１５と、
ビームスプリッタ１及びビームスプリッタ２を経由した
レーザ光を、１／４波長板１４及び対物レンズ１１を通
して照射する標準反射板１３と、標準反射板１３で反射
し、対物レンズ１１を透過したレーザ光の強さを、１／
４波長板１４及びビームスプリッタ２を通して測定する
受光部Ｂ１６とで構成される。(Embodiment 1) FIG. 1 shows an embodiment of the present invention. The device for detecting the dirt on the lens of the laser processing device includes a light receiving section A15 for measuring the intensity of the laser beam output from the laser oscillator 10 through the mirror M1 and the beam splitter 1.
The standard reflection plate 13 that irradiates the laser light that has passed through the beam splitter 1 and the beam splitter 2 through the quarter-wave plate 14 and the objective lens 11, and the laser light that has been reflected by the standard reflection plate 13 and has passed through the objective lens 11. Strength is 1 /
It is composed of a four-wave plate 14 and a light-receiving section B16 for measurement through the beam splitter 2.
【０００９】レーザ発振器１０より出力されたレーザ光
は、ミラーＭ１で反射されビームスプリッタ１に入力す
る。ビームスプリッタ１で５０％のレーザ光はビームス
プリッタ２の方向に進み、残りの５０％のレーザ光は受
光部Ａ１５に進む。ビームスプリッタ２に進んだレーザ
光は、ビームスプリッタ２で反射され、１／４波長板１
４及び対物レンズ１１を通し、標準反射板１３に焦点を
結ぶ。ここで、１／４波長板１４を透過するとき、レー
ザの位相が９０度変化する。レーザは、標準反射板１３
上で反射し、対物レンズ１１及び１／４波長板１４を通
してビームスプリッタ２に入力する。ここで、１／４波
長板１４を透過するとき、レーザの位相が更に９０度変
化し、ビームスプリッタ２へ入力するレーザは、その位
相が１８０度変化している。ビームスプリッタ２は、ビ
ームスプリッタ１からのレーザ光に対し１８０度位相が
変化したレーザを透過し、レーザ光は、受講部Ｂ１６に
到達する。The laser light output from the laser oscillator 10 is reflected by the mirror M1 and enters the beam splitter 1. In the beam splitter 1, 50% of the laser light travels in the direction of the beam splitter 2, and the remaining 50% of the laser light travels in the light receiving portion A15. The laser light that has proceeded to the beam splitter 2 is reflected by the beam splitter 2, and the quarter wavelength plate 1
The standard reflection plate 13 is focused through the lens 4 and the objective lens 11. Here, when passing through the quarter-wave plate 14, the phase of the laser changes by 90 degrees. Laser is standard reflector 13
The light is reflected above and enters the beam splitter 2 through the objective lens 11 and the quarter-wave plate 14. Here, when passing through the quarter-wave plate 14, the phase of the laser changes by 90 degrees, and the phase of the laser input to the beam splitter 2 changes by 180 degrees. The beam splitter 2 transmits the laser beam whose phase is changed by 180 degrees with respect to the laser beam from the beam splitter 1, and the laser beam reaches the lecture section B16.
【００１０】対物レンズ１１に汚れがついた場合、そこ
を透過するレーザの強さは、汚れのない場合に比べ減衰
する。そこで、その減衰を測定することで、レンズの汚
れを検出できる。しかし、レーザ発振器１０より出力さ
れるレーザ光の強さが変動するため、対物レンズ１１を
透過したレーザ光の強さを測定しただけでレンズの汚れ
を特定することはできない。そこで、レーザ発振器１０
より出力したレーザ光の強さも測定し、レーザ発振器１
０を出力したレーザ光の強さと、対物レンズを透過した
レーザ光の強さとの比を求め、初期状態より変化したこ
とを検出して、レンズの汚れを検知することができる。
図１の例においては、標準反射板１３を用いて反射さ
せ、受光部Ａ１５と受光部Ｂ１６のレーザ光の強さの比
率をあらかじめ測定し、その後、その比率が変化した場
合は、途中のレンズ上に汚れがついたため、受光部Ｂ１
６のレーザ光の強さが低下したものと考えることができ
る。この実施例においては、対物レンズ１１を往復２回
通過するため、実施例２における１回通過と比べると、
レンズの汚れに対する受光部Ｂ１６の減衰は大きく、検
出感度が高いといえる。When the objective lens 11 is contaminated, the intensity of the laser beam passing therethrough is attenuated as compared with the case where the objective lens 11 is not contaminated. Therefore, the dirt of the lens can be detected by measuring the attenuation. However, since the intensity of the laser light output from the laser oscillator 10 fluctuates, it is not possible to specify the dirt on the lens only by measuring the intensity of the laser light transmitted through the objective lens 11. Therefore, the laser oscillator 10
Measure the intensity of the laser light output from the laser oscillator 1
The dirt of the lens can be detected by obtaining the ratio between the intensity of the laser beam that outputs 0 and the intensity of the laser beam that has passed through the objective lens, and detecting the change from the initial state.
In the example of FIG. 1, the standard reflection plate 13 is used for reflection, and the ratio of the laser light intensities of the light receiving part A15 and the light receiving part B16 is measured in advance. After that, when the ratio changes, the lens in the middle Since the top is dirty, the light receiving part B1
It can be considered that the intensity of the laser light of No. 6 is lowered. In this embodiment, the objective lens 11 passes through two round trips, so compared with the single pass in Example 2,
It can be said that the light-receiving unit B16 has a large attenuation with respect to the dirt of the lens, and the detection sensitivity is high.
【００１１】（実施例２）図２に本発明の別の実施例を
示す。この実施例において、このレーザ加工装置のレン
ズの汚れを検出する装置は、レーザ発振器１０より出力
したレーザ光の強さを、ミラーＭ１及びビームスプリッ
タ１を通して測定する受光部Ａ１５と、ビームスプリッ
タ１及びミラーＭ２を経由して、対物レンズ１１を透過
したレーザ光の強さを測定する受光部Ｂ２６とで構成さ
れる。(Embodiment 2) FIG. 2 shows another embodiment of the present invention. In this embodiment, an apparatus for detecting dirt on a lens of the laser processing apparatus includes a light receiving section A15 for measuring the intensity of laser light output from a laser oscillator 10 through a mirror M1 and a beam splitter 1, a beam splitter 1, and a beam splitter 1. It is composed of a light receiving section B26 for measuring the intensity of the laser beam transmitted through the objective lens 11 via the mirror M2.
【００１２】レーザ発振器１０より出力されたレーザ光
は、ミラーＭ１で反射されビームスプリッタ１に入力す
る。ビームスプリッタ１で５０％のレーザ光はミラーＭ
２の方向に進み、残りの５０％のレーザ光は受光部Ａ１
５に進む。ミラーＭ２に進んだレーザ光は、ミラーＭ２
で反射され、対物レンズ１１を通して集束した後、受光
部Ｂ２６に到達する。The laser light output from the laser oscillator 10 is reflected by the mirror M1 and enters the beam splitter 1. 50% of the laser light from the beam splitter 1 is mirror M
In the direction of 2, the remaining 50% of the laser light is received by the light receiving portion A1.
Go to 5. The laser light that has traveled to the mirror M2 is reflected by the mirror M2.
After being reflected by, and focused through the objective lens 11, it reaches the light receiving portion B26.
【００１３】対物レンズ１１に汚れがついた場合、そこ
を透過するレーザの強さは、汚れのない場合に比べ減衰
する。そこで、その減衰を測定することで、レンズの汚
れを検出できる。しかし、レーザ発振器１０より出力さ
れるレーザ光の強さが変動するため、対物レンズ１１を
透過したレーザ光の強さを測定しただけでレンズの汚れ
を特定することはできない。そこで、レーザ発振器１０
より出力したレーザ光の強さも測定し、レーザ発振器１
０を出力したレーザ光の強さと、対物レンズを透過した
レーザ光の強さとの比を求め、初期状態より変化したこ
とを検出して、レンズの汚れを検知することができる。
図２の例においては、受光部Ａ１５と受光部Ｂ２６のレ
ーザ光の強さの比率をあらかじめ測定し、その後、その
比率が変化した場合は、途中のレンズ上に汚れがついた
ため、受光部Ｂ２６のレーザ光の強さが低下したものと
考えることができる。この実施例においては、対物レン
ズ１１を１回通過するため、実施例１における２回通過
に比べると、レンズの汚れに対する受光部Ｂ２６の減衰
は小さく、検出感度が低いといえる。When the objective lens 11 is contaminated, the intensity of the laser beam passing therethrough is attenuated as compared with the case where the objective lens 11 is not contaminated. Therefore, the dirt of the lens can be detected by measuring the attenuation. However, since the intensity of the laser beam output from the laser oscillator 10 fluctuates, it is not possible to specify the dirt on the lens only by measuring the intensity of the laser beam transmitted through the objective lens 11. Therefore, the laser oscillator 10
Measure the intensity of the laser light output from the laser oscillator 1
The dirt of the lens can be detected by obtaining the ratio of the intensity of the laser beam that outputs 0 and the intensity of the laser beam that has passed through the objective lens, and detecting the change from the initial state.
In the example of FIG. 2, the ratio of the laser light intensities of the light receiving unit A15 and the light receiving unit B26 is measured in advance, and when the ratio changes thereafter, the lens on the way is contaminated, and thus the light receiving unit B26. It can be considered that the intensity of the laser light is reduced. In this embodiment, since the light passes through the objective lens 11 once, the attenuation of the light receiving portion B26 with respect to the dirt of the lens is small and the detection sensitivity is low as compared with the case of double passage in the first embodiment.
【００１４】[0014]
【発明の効果】本発明は、以上説明したように構成され
ているので、以下に記載されるような効果を奏する。ま
ず、対物レンズ１１に汚れがついた場合、そこを透過す
るレーザの強さは、汚れのない場合に比べ減衰する。そ
こで、その減衰を測定することで、レンズの汚れを検出
できる。しかし、レーザ発振器１０より出力されるレー
ザ光の強さが変動するため、対物レンズ１１を透過した
レーザ光の強さを測定しただけでレンズの汚れを特定す
ることはできない。そこで、レーザ発振器１０より出力
したレーザ光の強さも測定し、レーザ発振器１０を出力
したレーザ光の強さと、対物レンズを透過したレーザ光
の強さとの比を求め、初期状態より変化したことを検出
して、レンズの汚れを検知することができる。レーザ加
工を実施する前に、受光部Ａ１５と受光部Ｂ１６または
受光部Ｂ２６を測定し、その比を求め、レンズが汚れて
いない初期値に対して変化がないことを確認すること
で、レンズの汚れがないことを確信し、レーザ光のパワ
ー不足による、切断不良を未然に防ぐことができ、有効
な発明である。Since the present invention is configured as described above, it has the following effects. First, when the objective lens 11 is contaminated, the intensity of the laser that passes through the objective lens 11 is attenuated as compared with the case where the objective lens 11 is not contaminated. Therefore, the dirt of the lens can be detected by measuring the attenuation. However, since the intensity of the laser beam output from the laser oscillator 10 fluctuates, it is not possible to specify the dirt on the lens only by measuring the intensity of the laser beam transmitted through the objective lens 11. Therefore, the intensity of the laser light output from the laser oscillator 10 is also measured, the ratio of the intensity of the laser light output from the laser oscillator 10 to the intensity of the laser light transmitted through the objective lens is calculated, and the change from the initial state is determined. It is possible to detect and detect the dirt of the lens. Before carrying out the laser processing, the light receiving part A15 and the light receiving part B16 or the light receiving part B26 are measured, the ratio is calculated, and it is confirmed that there is no change from the initial value where the lens is not contaminated. This is an effective invention because it is convinced that there is no dirt and cutting failure due to insufficient laser beam power can be prevented.
【図１】本発明の一実施例を示す説明図である。FIG. 1 is an explanatory diagram showing an embodiment of the present invention.
【図２】本発明の別の実施例を示す説明図である。FIG. 2 is an explanatory diagram showing another embodiment of the present invention.
【図３】従来のレーザ加工装置を示す説明図である。FIG. 3 is an explanatory diagram showing a conventional laser processing apparatus.
【符号の説明】 １０ レーザ発振器 １１ 対物レンズ １２ ウェハ １３ 標準反射板 １４ １／４波長板 １５ 受光部Ａ １６、２６ 受光部Ｂ[Explanation of Codes] 10 Laser Oscillator 11 Objective Lens 12 Wafer 13 Standard Reflector 14 Quarter Wave Plate 15 Light Receiving Section A 16, 26 Light Receiving Section B
Claims (3)
ザ光の強さを受光部Ａ（１５）で測定し、 対物レンズ（１１）を通過したレーザ光の強さを受光部
Ｂ（１６又は２６）で測定し、 受光部Ａ（１５）の測定データと受光部Ｂ（１６又は２
６）の測定データの比が、初期状態より変化したことを
検出する、 以上を特徴とするレーザ加工装置のレンズの汚れを検出
する方法。1. The intensity of laser light output from a laser oscillator (10) is measured by a light receiving portion A (15), and the intensity of laser light passing through an objective lens (11) is detected by a light receiving portion B (16 or 26). ), The measurement data of the light receiving part A (15) and the light receiving part B (16 or 2)
6) A method for detecting contamination of a lens of a laser processing apparatus, which is characterized in that the ratio of the measurement data is changed from the initial state.
ザ光の強さを、ビームスプリッタ１を通して測定する受
光部Ａ（１５）を設け、 ビームスプリッタ１及びビームスプリッタ２を経由した
レーザ光を、１／４波長板（１４）及び対物レンズ（１
１）を通して照射する標準反射板（１３）を設け、 標準反射板（１３）で反射し、対物レンズ（１１）を透
過したレーザ光の強さを、１／４波長板（１４）及びビ
ームスプリッタ２を通して測定する受光部Ｂ（１６）を
設け、 たことを特徴とするレーザ加工装置のレンズの汚れを検
出する装置。2. A light receiving portion A (15) for measuring the intensity of laser light output from a laser oscillator (10) through a beam splitter 1 is provided, and the laser light passing through the beam splitter 1 and the beam splitter 2 is / 4 wavelength plate (14) and objective lens (1
1) A standard reflection plate (13) for irradiating through is provided, and the intensity of the laser beam reflected by the standard reflection plate (13) and transmitted through the objective lens (11) is determined by a quarter wavelength plate (14) and a beam splitter. An apparatus for detecting dirt on a lens of a laser processing apparatus, which is provided with a light receiving section B (16) for measuring through 2.
ザ光の強さを、ビームスプリッタ１を通して測定する受
光部Ａ（１５）を設け、 ビームスプリッタ１、ミラーＭ２及び対物レンズ（１
１）を経由したレーザ光の強さを測定する受光部Ｂ（２
６）を設け、 たことを特徴とするレーザ加工装置のレンズの汚れを検
出する装置。3. A light receiving portion A (15) for measuring the intensity of laser light output from a laser oscillator (10) through the beam splitter 1, is provided, and the beam splitter 1, the mirror M2 and the objective lens (1) are provided.
Light receiving section B (2) for measuring the intensity of the laser beam passing through 1)
A device for detecting contamination of a lens of a laser processing device, which is provided with 6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33607994A JP2971003B2 (en) | 1994-12-22 | 1994-12-22 | Device to detect dirt on lens of laser repair device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33607994A JP2971003B2 (en) | 1994-12-22 | 1994-12-22 | Device to detect dirt on lens of laser repair device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08178856A true JPH08178856A (en) | 1996-07-12 |
| JP2971003B2 JP2971003B2 (en) | 1999-11-02 |
Family
ID=18295484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33607994A Expired - Lifetime JP2971003B2 (en) | 1994-12-22 | 1994-12-22 | Device to detect dirt on lens of laser repair device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2971003B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10946484B2 (en) * | 2017-08-23 | 2021-03-16 | Fanuc Corporation | Laser machining method adjusting focus shift depending on type and level of contamination of external optical system before laser machining |
| US11424162B2 (en) | 2002-03-12 | 2022-08-23 | Hamamatsu Photonics K.K. | Substrate dividing method |
-
1994
- 1994-12-22 JP JP33607994A patent/JP2971003B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11424162B2 (en) | 2002-03-12 | 2022-08-23 | Hamamatsu Photonics K.K. | Substrate dividing method |
| US10946484B2 (en) * | 2017-08-23 | 2021-03-16 | Fanuc Corporation | Laser machining method adjusting focus shift depending on type and level of contamination of external optical system before laser machining |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2971003B2 (en) | 1999-11-02 |
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