JPS60163822U - Daylay line - Google Patents
Daylay lineInfo
- Publication number
- JPS60163822U JPS60163822U JP5215084U JP5215084U JPS60163822U JP S60163822 U JPS60163822 U JP S60163822U JP 5215084 U JP5215084 U JP 5215084U JP 5215084 U JP5215084 U JP 5215084U JP S60163822 U JPS60163822 U JP S60163822U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit package
- delay line
- lead frame
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図はディレィラインの電気的等価回路図、第2図は
従来のディレィラインの具体的な構造を示す部分断面図
、第3図は同じく要部の斜視図、第4図は別の従来例に
おける部分断面図、第5図は本考案に係るディレィライ
ンの部分断面図、第6図は要部の斜視図である。
9・・・・・・回路基板、10・・・・・・回路部品、
11・・・・・・ICパッケージ、12・・・・・・リ
ードフレーム、13・・・・・・絶縁外装体、15・・
・・・・切欠。Figure 1 is an electrical equivalent circuit diagram of a delay line, Figure 2 is a partial sectional view showing the specific structure of a conventional delay line, Figure 3 is a perspective view of the same main part, and Figure 4 is another conventional delay line. FIG. 5 is a partial sectional view of the delay line according to the present invention, and FIG. 6 is a perspective view of the main part. 9...Circuit board, 10...Circuit parts,
11...IC package, 12...Lead frame, 13...Insulating exterior body, 15...
...notch.
Claims (1)
出力を集積化されたインバータ回路を通して取出すよう
にし、前記遅延回路を実装した回路基板の下面側に前記
インバータ回路を内蔵する集積回路パッケージを配置す
ると共に、該集積回路パッケージの下面側に入出力端子
となるリードフレームを配置し、前記集積回路パッケー
ジに備えられたピンを前記回路基板上の導体パターン及
び前記リードフレームに接続して回路を構成したディレ
ィラインにおいて、前記リードフレームは前記集積回路
パッケージの方向に向かって折曲げた後、反対方向に折
曲げて構成され、これらのリードフレームの内、前記集
積回路パッケージのピノと対向し、かつ電気的に接触し
てはならないリードフレームのピン対向部分に、ピン、
との接触を阻止する切欠を設けたことを特徴とするディ
レィライン。An integrated circuit package having a plurality of stages of delay circuits, the delayed output of at least one of the stages is taken out through an integrated inverter circuit, and the inverter circuit is built in on the lower surface side of the circuit board on which the delay circuit is mounted. At the same time, a lead frame serving as an input/output terminal is placed on the lower surface of the integrated circuit package, and the pins provided on the integrated circuit package are connected to the conductor pattern on the circuit board and the lead frame to connect the circuit. In the configured delay line, the lead frame is bent toward the integrated circuit package and then bent in the opposite direction, and one of these lead frames faces the pinot of the integrated circuit package, The pins,
A delay line characterized by having a cutout to prevent contact with the delay line.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5215084U JPS60163822U (en) | 1984-04-10 | 1984-04-10 | Daylay line |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5215084U JPS60163822U (en) | 1984-04-10 | 1984-04-10 | Daylay line |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60163822U true JPS60163822U (en) | 1985-10-31 |
Family
ID=30571842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5215084U Pending JPS60163822U (en) | 1984-04-10 | 1984-04-10 | Daylay line |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60163822U (en) |
-
1984
- 1984-04-10 JP JP5215084U patent/JPS60163822U/en active Pending
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